JPS58220441A - ダイ詰め換え装置 - Google Patents

ダイ詰め換え装置

Info

Publication number
JPS58220441A
JPS58220441A JP57104349A JP10434982A JPS58220441A JP S58220441 A JPS58220441 A JP S58220441A JP 57104349 A JP57104349 A JP 57104349A JP 10434982 A JP10434982 A JP 10434982A JP S58220441 A JPS58220441 A JP S58220441A
Authority
JP
Japan
Prior art keywords
tray
die
conveyor
trays
wafer ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57104349A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6258148B2 (show.php
Inventor
Noboru Fujino
昇 藤野
Seiichi Chiba
誠一 千葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP57104349A priority Critical patent/JPS58220441A/ja
Publication of JPS58220441A publication Critical patent/JPS58220441A/ja
Publication of JPS6258148B2 publication Critical patent/JPS6258148B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/0612
    • H10P72/3411
    • H10P72/50

Landscapes

  • Die Bonding (AREA)
JP57104349A 1982-06-17 1982-06-17 ダイ詰め換え装置 Granted JPS58220441A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57104349A JPS58220441A (ja) 1982-06-17 1982-06-17 ダイ詰め換え装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57104349A JPS58220441A (ja) 1982-06-17 1982-06-17 ダイ詰め換え装置

Publications (2)

Publication Number Publication Date
JPS58220441A true JPS58220441A (ja) 1983-12-22
JPS6258148B2 JPS6258148B2 (show.php) 1987-12-04

Family

ID=14378404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57104349A Granted JPS58220441A (ja) 1982-06-17 1982-06-17 ダイ詰め換え装置

Country Status (1)

Country Link
JP (1) JPS58220441A (show.php)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0194628A (ja) * 1987-10-06 1989-04-13 Rohm Co Ltd チップボンディング装置
JPH0328726U (show.php) * 1989-07-28 1991-03-22

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0194628A (ja) * 1987-10-06 1989-04-13 Rohm Co Ltd チップボンディング装置
JPH0328726U (show.php) * 1989-07-28 1991-03-22

Also Published As

Publication number Publication date
JPS6258148B2 (show.php) 1987-12-04

Similar Documents

Publication Publication Date Title
US4934891A (en) Component supply structure
TWI387053B (zh) 用於積體電路切割裝置之夾盤的供給機構
KR101849351B1 (ko) 듀얼 기판 소팅장치 및 방법
CN210884290U (zh) 自动供料装置
EP0568761A2 (en) Tape cassette feed unit for automatic machines
JPH05183022A (ja) チップ自動選別搬送装置
JPS58220441A (ja) ダイ詰め換え装置
CN113682575B (zh) 新型在线模块包装转换机
CN113369175B (zh) 一种用于电感器的自动测包系统及测包方法
JPS58220442A (ja) ダイ詰め換え装置におけるトレ−搬送装置
KR102742111B1 (ko) 매거진 이송모듈 및 이를 이용한 다이 본딩 장치
JPH0992664A (ja) チップの搭載装置
CN111306160A (zh) 静置固化设备
KR20160094231A (ko) 전자부품 언로딩장비
JPH1053332A (ja) 板状部材搬送装置
TWI436445B (zh) 改良的網狀區塊總成
CN115208143B (zh) 一种电机的线圈组件、上极板和齿轮板的自动组装机
KR101646974B1 (ko) 베어칩 포장 장치
KR101020669B1 (ko) 반도체 칩의 픽업 및 플레이스 장치
CN221183786U (zh) 一种工件检测分类集装设备
KR100404621B1 (ko) 반도체 소자 분류기용 핸들러의 작동방법 및 그 장치
JPS6262053B2 (show.php)
KR20160040002A (ko) 소자핸들러
CN217197157U (zh) 一种可以同时传送盒子或皮壳的送纸机构
KR200273988Y1 (ko) 반도체 소자 분류기용 핸들러의 작동장치