JPS6256656B2 - - Google Patents
Info
- Publication number
- JPS6256656B2 JPS6256656B2 JP56005672A JP567281A JPS6256656B2 JP S6256656 B2 JPS6256656 B2 JP S6256656B2 JP 56005672 A JP56005672 A JP 56005672A JP 567281 A JP567281 A JP 567281A JP S6256656 B2 JPS6256656 B2 JP S6256656B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- copper foil
- film substrate
- lead
- lead pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 36
- 239000011889 copper foil Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 26
- 238000005530 etching Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 239000004642 Polyimide Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49534—Multi-layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Laminated Bodies (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP567281A JPS57120361A (en) | 1981-01-17 | 1981-01-17 | Structure of film substrate |
KR1019810005282A KR850001541B1 (ko) | 1981-01-17 | 1981-12-31 | 양면 프린트 기관과 그 다량 접속방법 |
GB8200313A GB2093401B (en) | 1981-01-17 | 1982-01-06 | Composite film |
DE3201133A DE3201133A1 (de) | 1981-01-17 | 1982-01-15 | Verbundschichtanordnung, insbesondere zur verwendung in einer halbleiteranordnung sowie verfahren zu deren herstellung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP567281A JPS57120361A (en) | 1981-01-17 | 1981-01-17 | Structure of film substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57120361A JPS57120361A (en) | 1982-07-27 |
JPS6256656B2 true JPS6256656B2 (de) | 1987-11-26 |
Family
ID=11617586
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP567281A Granted JPS57120361A (en) | 1981-01-17 | 1981-01-17 | Structure of film substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57120361A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05512Y2 (de) * | 1987-08-06 | 1993-01-08 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2618883B2 (ja) * | 1987-03-30 | 1997-06-11 | 株式会社東芝 | 半導体装置 |
JPH0666362B2 (ja) * | 1988-07-28 | 1994-08-24 | 日本電気株式会社 | フィルムキャリアテープ |
KR20130018717A (ko) * | 2010-03-30 | 2013-02-25 | 도레이 카부시키가이샤 | 금속 지지 플렉시블 기판 및 그것을 이용한 테이프 오토메이티드 본딩용 금속 지지 캐리어 테이프, led 실장용 금속 지지 플렉시블 회로 기판 및 회로 형성용 동박 적층된 금속 지지 플렉시블 회로 기판 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49121968A (de) * | 1973-03-30 | 1974-11-21 |
-
1981
- 1981-01-17 JP JP567281A patent/JPS57120361A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49121968A (de) * | 1973-03-30 | 1974-11-21 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05512Y2 (de) * | 1987-08-06 | 1993-01-08 |
Also Published As
Publication number | Publication date |
---|---|
JPS57120361A (en) | 1982-07-27 |
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