JPS625341B2 - - Google Patents
Info
- Publication number
- JPS625341B2 JPS625341B2 JP54073377A JP7337779A JPS625341B2 JP S625341 B2 JPS625341 B2 JP S625341B2 JP 54073377 A JP54073377 A JP 54073377A JP 7337779 A JP7337779 A JP 7337779A JP S625341 B2 JPS625341 B2 JP S625341B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- multilayer circuit
- chip carrier
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W40/22—
-
- H10W40/228—
-
- H10W90/737—
-
- H10W90/754—
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7337779A JPS55165657A (en) | 1979-06-11 | 1979-06-11 | Multi-chip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7337779A JPS55165657A (en) | 1979-06-11 | 1979-06-11 | Multi-chip package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55165657A JPS55165657A (en) | 1980-12-24 |
| JPS625341B2 true JPS625341B2 (enExample) | 1987-02-04 |
Family
ID=13516424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7337779A Granted JPS55165657A (en) | 1979-06-11 | 1979-06-11 | Multi-chip package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55165657A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5947746A (ja) * | 1982-09-10 | 1984-03-17 | Mitsubishi Electric Corp | 混成集積回路装置 |
| JP2959506B2 (ja) * | 1997-02-03 | 1999-10-06 | 日本電気株式会社 | マルチチップモジュールの冷却構造 |
| US6867493B2 (en) * | 2000-11-15 | 2005-03-15 | Skyworks Solutions, Inc. | Structure and method for fabrication of a leadless multi-die carrier |
| JP4988609B2 (ja) * | 2008-01-11 | 2012-08-01 | 株式会社日立国際電気 | 配線基板 |
| JP6160698B2 (ja) | 2013-08-23 | 2017-07-12 | 富士電機株式会社 | 半導体装置 |
| JP7226087B2 (ja) * | 2019-05-20 | 2023-02-21 | 三菱電機株式会社 | 電気特性評価治具 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5381957A (en) * | 1976-12-27 | 1978-07-19 | Fujitsu Ltd | Multilyer ceramic board with heat sink |
| JPS5384169A (en) * | 1976-12-30 | 1978-07-25 | Fujitsu Ltd | Pattern inspecting device |
| JPS546573A (en) * | 1977-06-16 | 1979-01-18 | Seiko Epson Corp | Electronic wristwatch |
-
1979
- 1979-06-11 JP JP7337779A patent/JPS55165657A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55165657A (en) | 1980-12-24 |
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