JPS625340B2 - - Google Patents

Info

Publication number
JPS625340B2
JPS625340B2 JP55132538A JP13253880A JPS625340B2 JP S625340 B2 JPS625340 B2 JP S625340B2 JP 55132538 A JP55132538 A JP 55132538A JP 13253880 A JP13253880 A JP 13253880A JP S625340 B2 JPS625340 B2 JP S625340B2
Authority
JP
Japan
Prior art keywords
tape carrier
semiconductor device
tape
horizontal portion
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55132538A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5758346A (en
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP55132538A priority Critical patent/JPS5758346A/ja
Publication of JPS5758346A publication Critical patent/JPS5758346A/ja
Publication of JPS625340B2 publication Critical patent/JPS625340B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP55132538A 1980-09-24 1980-09-24 Tape carrier for semiconductor device Granted JPS5758346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55132538A JPS5758346A (en) 1980-09-24 1980-09-24 Tape carrier for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55132538A JPS5758346A (en) 1980-09-24 1980-09-24 Tape carrier for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5758346A JPS5758346A (en) 1982-04-08
JPS625340B2 true JPS625340B2 (cs) 1987-02-04

Family

ID=15083613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55132538A Granted JPS5758346A (en) 1980-09-24 1980-09-24 Tape carrier for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5758346A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0238995U (cs) * 1988-09-06 1990-03-15

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4721992A (en) * 1986-06-26 1988-01-26 National Semiconductor Corporation Hinge tape
JPH0754813B2 (ja) * 1986-08-29 1995-06-07 株式会社東芝 フイルムキヤリア基板
JPH0444148U (cs) * 1990-08-20 1992-04-15
JP2857492B2 (ja) * 1990-11-28 1999-02-17 シャープ株式会社 Ｔａｂパッケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0238995U (cs) * 1988-09-06 1990-03-15

Also Published As

Publication number Publication date
JPS5758346A (en) 1982-04-08

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