JPS6252946U - - Google Patents

Info

Publication number
JPS6252946U
JPS6252946U JP14493785U JP14493785U JPS6252946U JP S6252946 U JPS6252946 U JP S6252946U JP 14493785 U JP14493785 U JP 14493785U JP 14493785 U JP14493785 U JP 14493785U JP S6252946 U JPS6252946 U JP S6252946U
Authority
JP
Japan
Prior art keywords
tab
integrated circuit
type leads
outside
circuit chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14493785U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14493785U priority Critical patent/JPS6252946U/ja
Publication of JPS6252946U publication Critical patent/JPS6252946U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａは本考案の一実施例の平面図、同図ｂ
は同図ａのＡ―Ａ断面図、第２図ａ〜ｃは、第１
図の集積回路チツプの封入工程を説明するための
工程順の断面図、第３図ａ，ｂはそれぞれ従来の
タブ型リードを有する集積回路チツプの実装方法
の一例および他の一例を説明するための断面図で
ある。 １……セラミツクケース基体、２……タブ型リ
ードをもつ集積回路チツプ、３……タブ型リード
、４……セラミツク蓋板、５……配線基板、６…
…ケース本体、７……リードピン、８……蓋。 Figure 1a is a plan view of an embodiment of the present invention, Figure 1b is a plan view of an embodiment of the present invention.
is a sectional view taken along line A-A in Figure a, and Figures 2 a to c are sectional views of the first
Figures 3a and 3b are cross-sectional views of the process order for explaining the process of encapsulating an integrated circuit chip in the figure, and Figures 3a and 3b are for explaining an example and another example of a mounting method for an integrated circuit chip having conventional tab-type leads, respectively. FIG. DESCRIPTION OF SYMBOLS 1... Ceramic case base, 2... Integrated circuit chip with tab-shaped leads, 3... Tab-shaped leads, 4... Ceramic cover plate, 5... Wiring board, 6...
...Case body, 7... Lead pin, 8... Lid.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] タブ（ＴＡＢ）型リードを有する集積回路チツ
プを、そのタブ型リードの外端側を外部に出した
状態で絶縁ケースに収容し、前記ケース外部に出
ているタブ型リードを外部リード端子としたこと
を特徴とする集積回路装置。 An integrated circuit chip having tab (TAB) type leads is housed in an insulating case with the outer ends of the tab type leads exposed to the outside, and the tab type leads exposed to the outside of the case are used as external lead terminals. An integrated circuit device characterized by:
JP14493785U 1985-09-20 1985-09-20 Pending JPS6252946U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14493785U JPS6252946U (en) 1985-09-20 1985-09-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14493785U JPS6252946U (en) 1985-09-20 1985-09-20

Publications (1)

Publication Number Publication Date
JPS6252946U true JPS6252946U (en) 1987-04-02

Family

ID=31056009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14493785U Pending JPS6252946U (en) 1985-09-20 1985-09-20

Country Status (1)

Country Link
JP (1) JPS6252946U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236556A (en) * 1988-07-26 1990-02-06 Matsushita Electric Works Ltd Pin grid array and mounting of semiconductor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236556A (en) * 1988-07-26 1990-02-06 Matsushita Electric Works Ltd Pin grid array and mounting of semiconductor element

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