JPS6252463B2 - - Google Patents

Info

Publication number
JPS6252463B2
JPS6252463B2 JP54142113A JP14211379A JPS6252463B2 JP S6252463 B2 JPS6252463 B2 JP S6252463B2 JP 54142113 A JP54142113 A JP 54142113A JP 14211379 A JP14211379 A JP 14211379A JP S6252463 B2 JPS6252463 B2 JP S6252463B2
Authority
JP
Japan
Prior art keywords
lead
wire
tab
bonding
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54142113A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5666061A (en
Inventor
Takashi Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14211379A priority Critical patent/JPS5666061A/ja
Publication of JPS5666061A publication Critical patent/JPS5666061A/ja
Publication of JPS6252463B2 publication Critical patent/JPS6252463B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/424
    • H10W72/0711
    • H10W72/07141
    • H10W72/075
    • H10W72/07521
    • H10W72/07551
    • H10W72/50
    • H10W72/536
    • H10W72/5363
    • H10W72/5449
    • H10W72/5522
    • H10W90/756

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP14211379A 1979-11-05 1979-11-05 Lead frame Granted JPS5666061A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14211379A JPS5666061A (en) 1979-11-05 1979-11-05 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14211379A JPS5666061A (en) 1979-11-05 1979-11-05 Lead frame

Publications (2)

Publication Number Publication Date
JPS5666061A JPS5666061A (en) 1981-06-04
JPS6252463B2 true JPS6252463B2 (cg-RX-API-DMAC10.html) 1987-11-05

Family

ID=15307711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14211379A Granted JPS5666061A (en) 1979-11-05 1979-11-05 Lead frame

Country Status (1)

Country Link
JP (1) JPS5666061A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5870562A (ja) * 1981-08-28 1983-04-27 Hitachi Ltd リ−ドフレ−ムの製造方法
JPS58182858A (ja) * 1982-04-21 1983-10-25 Nec Corp リ−ドフレ−ム
JPS61216353A (ja) * 1985-03-20 1986-09-26 Shinko Electric Ind Co Ltd リ−ドフレ−ムの製造方法

Also Published As

Publication number Publication date
JPS5666061A (en) 1981-06-04

Similar Documents

Publication Publication Date Title
KR860000410B1 (ko) 반도체장치 및 그 조립방법
US7102210B2 (en) Lead frame, manufacturing method of the same, and semiconductor device using the same
JPS60167454A (ja) 半導体装置
JPS6252463B2 (cg-RX-API-DMAC10.html)
JPH0558273B2 (cg-RX-API-DMAC10.html)
JPS6156621B2 (cg-RX-API-DMAC10.html)
JP2504187B2 (ja) リ―ドフレ―ム
KR940008340B1 (ko) 반도체 장치용 리이드 프레임
JPH0355989B2 (cg-RX-API-DMAC10.html)
JP3007806B2 (ja) 半導体装置およびその製造方法とそれに用いるリードフレーム
JPS6138193Y2 (cg-RX-API-DMAC10.html)
JPH0433630Y2 (cg-RX-API-DMAC10.html)
JPS60121752A (ja) 半導体装置
JPS63181362A (ja) リ−ドフレ−ム
JPS6035551A (ja) 半導体装置の製法
JPH08264698A (ja) 半導体装置
JPS61102054A (ja) リ−ドフレ−ム
JP2004200719A (ja) 半導体装置
JPS635253Y2 (cg-RX-API-DMAC10.html)
JPS62122253A (ja) 半導体装置
KR0179171B1 (ko) 반도체소자 패키지 공정용 리드프레임의 와이어 처짐 방지 장치
KR100201387B1 (ko) 반도체 패키지
JPH0310670Y2 (cg-RX-API-DMAC10.html)
JPS60194547A (ja) 半導体装置
JPH0738045A (ja) 半導体集積回路装置