JPS62517A - 光素子用封止剤 - Google Patents

光素子用封止剤

Info

Publication number
JPS62517A
JPS62517A JP60139273A JP13927385A JPS62517A JP S62517 A JPS62517 A JP S62517A JP 60139273 A JP60139273 A JP 60139273A JP 13927385 A JP13927385 A JP 13927385A JP S62517 A JPS62517 A JP S62517A
Authority
JP
Japan
Prior art keywords
acid
formula
sealant
group
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60139273A
Other languages
English (en)
Japanese (ja)
Other versions
JPH058928B2 (enrdf_load_html_response
Inventor
Kimio Inoue
井上 公夫
Takaaki Murai
孝明 村井
Toyokazu Yanagii
豊和 楊井
Masaharu Watanabe
正治 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chemical Industries Ltd filed Critical Daicel Chemical Industries Ltd
Priority to JP60139273A priority Critical patent/JPS62517A/ja
Publication of JPS62517A publication Critical patent/JPS62517A/ja
Publication of JPH058928B2 publication Critical patent/JPH058928B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/295Organic, e.g. plastic containing a filler
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
JP60139273A 1985-06-26 1985-06-26 光素子用封止剤 Granted JPS62517A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60139273A JPS62517A (ja) 1985-06-26 1985-06-26 光素子用封止剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60139273A JPS62517A (ja) 1985-06-26 1985-06-26 光素子用封止剤

Publications (2)

Publication Number Publication Date
JPS62517A true JPS62517A (ja) 1987-01-06
JPH058928B2 JPH058928B2 (enrdf_load_html_response) 1993-02-03

Family

ID=15241443

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60139273A Granted JPS62517A (ja) 1985-06-26 1985-06-26 光素子用封止剤

Country Status (1)

Country Link
JP (1) JPS62517A (enrdf_load_html_response)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956312A (en) * 1988-06-06 1990-09-11 U.S. Philips Corporation Method of manufacturing a semiconductor device
JPH0532866A (ja) * 1991-07-31 1993-02-09 Shin Etsu Chem Co Ltd 光透過性エポキシ樹脂組成物及び光半導体装置
WO2012020625A1 (ja) * 2010-08-10 2012-02-16 ダイセル化学工業株式会社 硬化性樹脂組成物及びその硬化物

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956312A (en) * 1988-06-06 1990-09-11 U.S. Philips Corporation Method of manufacturing a semiconductor device
JPH0532866A (ja) * 1991-07-31 1993-02-09 Shin Etsu Chem Co Ltd 光透過性エポキシ樹脂組成物及び光半導体装置
WO2012020625A1 (ja) * 2010-08-10 2012-02-16 ダイセル化学工業株式会社 硬化性樹脂組成物及びその硬化物
JP2012036320A (ja) * 2010-08-10 2012-02-23 Daicel Corp 硬化性樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
JPH058928B2 (enrdf_load_html_response) 1993-02-03

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