JPS6250077B2 - - Google Patents
Info
- Publication number
- JPS6250077B2 JPS6250077B2 JP11686783A JP11686783A JPS6250077B2 JP S6250077 B2 JPS6250077 B2 JP S6250077B2 JP 11686783 A JP11686783 A JP 11686783A JP 11686783 A JP11686783 A JP 11686783A JP S6250077 B2 JPS6250077 B2 JP S6250077B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- ceramic
- manufacturing
- substrate
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 39
- 239000010409 thin film Substances 0.000 claims description 31
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 10
- 238000010304 firing Methods 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 5
- 230000003746 surface roughness Effects 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 4
- 238000007606 doctor blade method Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- -1 Mo and W Chemical class 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11686783A JPS6010696A (ja) | 1983-06-30 | 1983-06-30 | 薄膜用セラミツク回路基板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11686783A JPS6010696A (ja) | 1983-06-30 | 1983-06-30 | 薄膜用セラミツク回路基板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6010696A JPS6010696A (ja) | 1985-01-19 |
| JPS6250077B2 true JPS6250077B2 (enrdf_load_stackoverflow) | 1987-10-22 |
Family
ID=14697591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11686783A Granted JPS6010696A (ja) | 1983-06-30 | 1983-06-30 | 薄膜用セラミツク回路基板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6010696A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6416287U (enrdf_load_stackoverflow) * | 1987-07-20 | 1989-01-26 | ||
| JPH0315490A (ja) * | 1988-09-03 | 1991-01-23 | Wilkinson Sword Gmbh | かみそり |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62216251A (ja) * | 1986-03-17 | 1987-09-22 | Toshiba Corp | 高熱伝導性基板 |
| JPH0770644B2 (ja) * | 1986-03-27 | 1995-07-31 | 株式会社東芝 | 熱伝導性基板 |
| JP2727602B2 (ja) * | 1988-11-07 | 1998-03-11 | 富士通株式会社 | 多層回路基板の製造方法 |
| KR20120015948A (ko) * | 2010-08-13 | 2012-02-22 | 삼성전기주식회사 | 세라믹 기판의 제조 방법 및 이를 이용한 세라믹 기판 |
| KR101153492B1 (ko) * | 2010-08-24 | 2012-06-11 | 삼성전기주식회사 | 프로브 카드용 세라믹 기판 제조 방법 및 프로브 카드용 세라믹 기판 |
-
1983
- 1983-06-30 JP JP11686783A patent/JPS6010696A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6416287U (enrdf_load_stackoverflow) * | 1987-07-20 | 1989-01-26 | ||
| JPH0315490A (ja) * | 1988-09-03 | 1991-01-23 | Wilkinson Sword Gmbh | かみそり |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6010696A (ja) | 1985-01-19 |
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