JPS6250063B2 - - Google Patents
Info
- Publication number
- JPS6250063B2 JPS6250063B2 JP4326082A JP4326082A JPS6250063B2 JP S6250063 B2 JPS6250063 B2 JP S6250063B2 JP 4326082 A JP4326082 A JP 4326082A JP 4326082 A JP4326082 A JP 4326082A JP S6250063 B2 JPS6250063 B2 JP S6250063B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- substrates
- board
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 17
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007567 mass-production technique Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4326082A JPS58159361A (ja) | 1982-03-17 | 1982-03-17 | 多層混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4326082A JPS58159361A (ja) | 1982-03-17 | 1982-03-17 | 多層混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58159361A JPS58159361A (ja) | 1983-09-21 |
| JPS6250063B2 true JPS6250063B2 (US07709020-20100504-C00041.png) | 1987-10-22 |
Family
ID=12658876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4326082A Granted JPS58159361A (ja) | 1982-03-17 | 1982-03-17 | 多層混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58159361A (US07709020-20100504-C00041.png) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4862322A (en) * | 1988-05-02 | 1989-08-29 | Bickford Harry R | Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween |
| KR920702545A (ko) * | 1990-06-26 | 1992-09-04 | 아이자와 스스무 | 반도체 장치 및 그 제조 방법 |
| US5296737A (en) * | 1990-09-06 | 1994-03-22 | Hitachi, Ltd. | Semiconductor device with a plurality of face to face chips |
| JPH0685161A (ja) * | 1992-09-07 | 1994-03-25 | Hitachi Ltd | 高密度実装型半導体装置 |
| US5479051A (en) * | 1992-10-09 | 1995-12-26 | Fujitsu Limited | Semiconductor device having a plurality of semiconductor chips |
| WO2019012679A1 (ja) * | 2017-07-14 | 2019-01-17 | 新電元工業株式会社 | 電子モジュール |
-
1982
- 1982-03-17 JP JP4326082A patent/JPS58159361A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58159361A (ja) | 1983-09-21 |
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