JPS6249755B2 - - Google Patents

Info

Publication number
JPS6249755B2
JPS6249755B2 JP9530777A JP9530777A JPS6249755B2 JP S6249755 B2 JPS6249755 B2 JP S6249755B2 JP 9530777 A JP9530777 A JP 9530777A JP 9530777 A JP9530777 A JP 9530777A JP S6249755 B2 JPS6249755 B2 JP S6249755B2
Authority
JP
Japan
Prior art keywords
resin
light emitting
lead frame
insulating plate
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9530777A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5429566A (en
Inventor
Fumio Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP9530777A priority Critical patent/JPS5429566A/ja
Publication of JPS5429566A publication Critical patent/JPS5429566A/ja
Publication of JPS6249755B2 publication Critical patent/JPS6249755B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP9530777A 1977-08-08 1977-08-08 Mo lded type electric component Granted JPS5429566A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9530777A JPS5429566A (en) 1977-08-08 1977-08-08 Mo lded type electric component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9530777A JPS5429566A (en) 1977-08-08 1977-08-08 Mo lded type electric component

Publications (2)

Publication Number Publication Date
JPS5429566A JPS5429566A (en) 1979-03-05
JPS6249755B2 true JPS6249755B2 (enExample) 1987-10-21

Family

ID=14134098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9530777A Granted JPS5429566A (en) 1977-08-08 1977-08-08 Mo lded type electric component

Country Status (1)

Country Link
JP (1) JPS5429566A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61237485A (ja) * 1985-04-12 1986-10-22 Takiron Co Ltd 発光表示体の製法
KR101349605B1 (ko) 2007-09-27 2014-01-09 삼성전자주식회사 발광소자 패키지의 제조방법

Also Published As

Publication number Publication date
JPS5429566A (en) 1979-03-05

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