JPS5429566A - Mo lded type electric component - Google Patents

Mo lded type electric component

Info

Publication number
JPS5429566A
JPS5429566A JP9530777A JP9530777A JPS5429566A JP S5429566 A JPS5429566 A JP S5429566A JP 9530777 A JP9530777 A JP 9530777A JP 9530777 A JP9530777 A JP 9530777A JP S5429566 A JPS5429566 A JP S5429566A
Authority
JP
Japan
Prior art keywords
lded
type electric
electric component
resin
display plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9530777A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6249755B2 (enExample
Inventor
Fumio Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9530777A priority Critical patent/JPS5429566A/ja
Publication of JPS5429566A publication Critical patent/JPS5429566A/ja
Publication of JPS6249755B2 publication Critical patent/JPS6249755B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP9530777A 1977-08-08 1977-08-08 Mo lded type electric component Granted JPS5429566A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9530777A JPS5429566A (en) 1977-08-08 1977-08-08 Mo lded type electric component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9530777A JPS5429566A (en) 1977-08-08 1977-08-08 Mo lded type electric component

Publications (2)

Publication Number Publication Date
JPS5429566A true JPS5429566A (en) 1979-03-05
JPS6249755B2 JPS6249755B2 (enExample) 1987-10-21

Family

ID=14134098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9530777A Granted JPS5429566A (en) 1977-08-08 1977-08-08 Mo lded type electric component

Country Status (1)

Country Link
JP (1) JPS5429566A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61237485A (ja) * 1985-04-12 1986-10-22 Takiron Co Ltd 発光表示体の製法
JP2009088520A (ja) * 2007-09-27 2009-04-23 Samsung Electro Mech Co Ltd 発光素子パッケージの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61237485A (ja) * 1985-04-12 1986-10-22 Takiron Co Ltd 発光表示体の製法
JP2009088520A (ja) * 2007-09-27 2009-04-23 Samsung Electro Mech Co Ltd 発光素子パッケージの製造方法
US8202746B2 (en) 2007-09-27 2012-06-19 Samsung Led Co., Ltd. Method of manufacturing LED package for formation of molding member

Also Published As

Publication number Publication date
JPS6249755B2 (enExample) 1987-10-21

Similar Documents

Publication Publication Date Title
JPS5429566A (en) Mo lded type electric component
JPS5558557A (en) Resin mold type electronic component and lead frame used therefor
JPS5298472A (en) Lead frame for resin molding
JPS5394441A (en) Apparatus for diffusing dubble into water
JPS5275180A (en) Package for integrated circuits
JPS52115126A (en) Graphic display unit
JPS5660210A (en) Metal mold for resin sealing type semiconductor device
JPS5361280A (en) Pattern projector
JPS52122444A (en) Connection changeover monitoring unit
JPS532079A (en) Frame structure for semiconductor device and its manufacture
JPS5290798A (en) Exit window for charged particles
JPS5421273A (en) Manufacture for photo mask
JPS51122806A (en) Air compressor
JPS5397817A (en) Interchangeable lens accossory with mount mechanism
JPS5229067A (en) Code plate
JPS5297183A (en) Production of air tight terminal
JPS5371566A (en) Wafer matching equipment
JPS52111935A (en) Method of forming paint film on metal by ultraviolet curing.
JPS524212A (en) Magnet sheet unit
JPS5551913A (en) Engine cooling device for motor cycle
JPS5438118A (en) Projector
JPS5424657A (en) Liquid crystal display device
JPS5330715A (en) Coil for pulse motor
JPS52132726A (en) Projector
JPS5364497A (en) Semiconductor light emitting display device