JPS5429566A - Mo lded type electric component - Google Patents

Mo lded type electric component

Info

Publication number
JPS5429566A
JPS5429566A JP9530777A JP9530777A JPS5429566A JP S5429566 A JPS5429566 A JP S5429566A JP 9530777 A JP9530777 A JP 9530777A JP 9530777 A JP9530777 A JP 9530777A JP S5429566 A JPS5429566 A JP S5429566A
Authority
JP
Japan
Prior art keywords
lded
type electric
electric component
resin
display plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9530777A
Other languages
Japanese (ja)
Other versions
JPS6249755B2 (en
Inventor
Fumio Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9530777A priority Critical patent/JPS5429566A/en
Publication of JPS5429566A publication Critical patent/JPS5429566A/en
Publication of JPS6249755B2 publication Critical patent/JPS6249755B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To block the occurrence of turbulent flow of resin and to reduce air bubbles, by providing a projection on the display plate at lower stream of the resin flow, when the light emission diode mounted on the frame shaped leads in a metal mold and the display plate are located for resin sealing.
COPYRIGHT: (C)1979,JPO&Japio
JP9530777A 1977-08-08 1977-08-08 Mo lded type electric component Granted JPS5429566A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9530777A JPS5429566A (en) 1977-08-08 1977-08-08 Mo lded type electric component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9530777A JPS5429566A (en) 1977-08-08 1977-08-08 Mo lded type electric component

Publications (2)

Publication Number Publication Date
JPS5429566A true JPS5429566A (en) 1979-03-05
JPS6249755B2 JPS6249755B2 (en) 1987-10-21

Family

ID=14134098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9530777A Granted JPS5429566A (en) 1977-08-08 1977-08-08 Mo lded type electric component

Country Status (1)

Country Link
JP (1) JPS5429566A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61237485A (en) * 1985-04-12 1986-10-22 Takiron Co Ltd Manufacture of light-emission display body
JP2009088520A (en) * 2007-09-27 2009-04-23 Samsung Electro Mech Co Ltd Method of manufacturing light-emitting diode package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61237485A (en) * 1985-04-12 1986-10-22 Takiron Co Ltd Manufacture of light-emission display body
JP2009088520A (en) * 2007-09-27 2009-04-23 Samsung Electro Mech Co Ltd Method of manufacturing light-emitting diode package
US8202746B2 (en) 2007-09-27 2012-06-19 Samsung Led Co., Ltd. Method of manufacturing LED package for formation of molding member

Also Published As

Publication number Publication date
JPS6249755B2 (en) 1987-10-21

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