JPS5333577A - Semiconductor molding method - Google Patents

Semiconductor molding method

Info

Publication number
JPS5333577A
JPS5333577A JP10835276A JP10835276A JPS5333577A JP S5333577 A JPS5333577 A JP S5333577A JP 10835276 A JP10835276 A JP 10835276A JP 10835276 A JP10835276 A JP 10835276A JP S5333577 A JPS5333577 A JP S5333577A
Authority
JP
Japan
Prior art keywords
molding method
semiconductor molding
liquiefied
stopping
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10835276A
Other languages
Japanese (ja)
Inventor
Minoru Karasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Matsushima Kogyo KK
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Matsushima Kogyo KK
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushima Kogyo KK, Seiko Epson Corp, Suwa Seikosha KK filed Critical Matsushima Kogyo KK
Priority to JP10835276A priority Critical patent/JPS5333577A/en
Publication of JPS5333577A publication Critical patent/JPS5333577A/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To mold elements to a miniature size by flowing a liquiefied molding agent up to the element side face and stopping the flow at the peripheral walls of tape and element back face end parts.
COPYRIGHT: (C)1978,JPO&Japio
JP10835276A 1976-09-09 1976-09-09 Semiconductor molding method Pending JPS5333577A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10835276A JPS5333577A (en) 1976-09-09 1976-09-09 Semiconductor molding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10835276A JPS5333577A (en) 1976-09-09 1976-09-09 Semiconductor molding method

Publications (1)

Publication Number Publication Date
JPS5333577A true JPS5333577A (en) 1978-03-29

Family

ID=14482523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10835276A Pending JPS5333577A (en) 1976-09-09 1976-09-09 Semiconductor molding method

Country Status (1)

Country Link
JP (1) JPS5333577A (en)

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