JPS624862B2 - - Google Patents
Info
- Publication number
- JPS624862B2 JPS624862B2 JP7647878A JP7647878A JPS624862B2 JP S624862 B2 JPS624862 B2 JP S624862B2 JP 7647878 A JP7647878 A JP 7647878A JP 7647878 A JP7647878 A JP 7647878A JP S624862 B2 JPS624862 B2 JP S624862B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- lead frame
- air vent
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 21
- 238000000465 moulding Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7647878A JPS554922A (en) | 1978-06-26 | 1978-06-26 | Lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7647878A JPS554922A (en) | 1978-06-26 | 1978-06-26 | Lead frame |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS554922A JPS554922A (en) | 1980-01-14 |
JPS624862B2 true JPS624862B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-02-02 |
Family
ID=13606292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7647878A Granted JPS554922A (en) | 1978-06-26 | 1978-06-26 | Lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS554922A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230073177A (ko) | 2020-09-24 | 2023-05-25 | 닛뽄 가야쿠 가부시키가이샤 | 촉매 전구체, 그것을 이용한 촉매, 화합물의 제조 방법 및 촉매의 제조 방법 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61146955U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1985-02-28 | 1986-09-10 | ||
JPS61162063U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1985-03-28 | 1986-10-07 | ||
JPS61203562U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1985-06-07 | 1986-12-22 | ||
JPS61146956U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1985-02-28 | 1986-09-10 | ||
JPS61269351A (ja) * | 1985-05-23 | 1986-11-28 | Nec Yamagata Ltd | 半導体装置用リ−ドフレ−ム |
JPS6268718A (ja) * | 1985-09-20 | 1987-03-28 | Matsushita Electric Ind Co Ltd | 円盤状記録媒体成形金型および円盤状記録媒体 |
JPS6276543U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1985-10-31 | 1987-05-16 | ||
JPS62134253U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1986-02-14 | 1987-08-24 | ||
KR100242249B1 (ko) * | 1997-05-13 | 2000-02-01 | 김규현 | 패키지성형금형구조 및 반도체패키지 |
-
1978
- 1978-06-26 JP JP7647878A patent/JPS554922A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230073177A (ko) | 2020-09-24 | 2023-05-25 | 닛뽄 가야쿠 가부시키가이샤 | 촉매 전구체, 그것을 이용한 촉매, 화합물의 제조 방법 및 촉매의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
JPS554922A (en) | 1980-01-14 |