JPS6247891B2 - - Google Patents
Info
- Publication number
- JPS6247891B2 JPS6247891B2 JP59054031A JP5403184A JPS6247891B2 JP S6247891 B2 JPS6247891 B2 JP S6247891B2 JP 59054031 A JP59054031 A JP 59054031A JP 5403184 A JP5403184 A JP 5403184A JP S6247891 B2 JPS6247891 B2 JP S6247891B2
- Authority
- JP
- Japan
- Prior art keywords
- anhydride
- curing agent
- endo
- epoxy resin
- exo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5403184A JPS60197721A (ja) | 1984-03-21 | 1984-03-21 | エポキシ樹脂用硬化剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5403184A JPS60197721A (ja) | 1984-03-21 | 1984-03-21 | エポキシ樹脂用硬化剤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60197721A JPS60197721A (ja) | 1985-10-07 |
| JPS6247891B2 true JPS6247891B2 (enExample) | 1987-10-09 |
Family
ID=12959212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5403184A Granted JPS60197721A (ja) | 1984-03-21 | 1984-03-21 | エポキシ樹脂用硬化剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60197721A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6192451A (ja) * | 1984-10-11 | 1986-05-10 | Sumitomo Bakelite Co Ltd | 光学的記録媒体用基板 |
| JP2004307846A (ja) * | 2003-03-24 | 2004-11-04 | Sumitomo Bakelite Co Ltd | 表示素子基板用エポキシ樹脂組成物 |
| WO2010095329A1 (ja) * | 2009-02-18 | 2010-08-26 | 日立化成工業株式会社 | 新規な液状テトラカルボン酸二無水物及びその製造方法 |
| US20120326301A1 (en) * | 2010-01-21 | 2012-12-27 | Sekisui Chemical Co., Ltd. | Thermosetting resin composition, flip-chip mounting adhesive, semiconductor device fabrication method, and semiconductor device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3598749A (en) * | 1969-05-23 | 1971-08-10 | Allied Chem | Production of epoxide compositions |
-
1984
- 1984-03-21 JP JP5403184A patent/JPS60197721A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60197721A (ja) | 1985-10-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4002599A (en) | Epoxy resin compositions from glycidyl derivatives of aminophenols cured with tetracarboxylic dianhydrides | |
| DE60123176T2 (de) | Vergussmasse mit hohem Tg | |
| US5629379A (en) | Anhydride-hardened epoxy resin with polybutadiene-maleic anhydride adduct | |
| JP2004002675A (ja) | 熱硬化性エポキシ樹脂をベースとする注型用材料 | |
| JPS6247891B2 (enExample) | ||
| US4492789A (en) | Epoxy resin composition | |
| US3341555A (en) | Stable liquid dicarboxylic acid anhydride compositions | |
| US3560411A (en) | Epoxyalkyl esters of endo-methylene hexahydrophthalic acid | |
| US3764584A (en) | Curable compositions | |
| KR102453940B1 (ko) | 무수물 경화제를 이용한 에폭시 수지 조성물의 제조방법 | |
| US3404195A (en) | Process for improving the thermal properties of hardened epoxide resins | |
| JPH05214075A (ja) | エポキシ樹脂のための硬化剤としてのジアミノジフェニルスルホン化合物の付加物 | |
| JP2002155069A (ja) | 低粘度の液状酸無水物の製造法およびエポキシ樹脂組成物 | |
| JPH04264123A (ja) | トリグリシジルイソシアヌレート組成物 | |
| JP2992313B2 (ja) | エポキシ樹脂組成物 | |
| JPS6181427A (ja) | エポキシ樹脂組成物 | |
| US4507460A (en) | Epoxy resin composition | |
| JPH03269011A (ja) | エポキシ樹脂組成物 | |
| JP2952034B2 (ja) | エポキシ樹脂硬化剤 | |
| US3523919A (en) | Process for the preparation of heathardened internally plasticized epoxide resins | |
| JPH02308809A (ja) | エポキシ樹脂組成物 | |
| JPS6244012B2 (enExample) | ||
| JPH06128352A (ja) | エポキシ樹脂組成物 | |
| JPS623168B2 (enExample) | ||
| JPH0718059A (ja) | エポキシ樹脂配合物 |