JPS6246981B2 - - Google Patents

Info

Publication number
JPS6246981B2
JPS6246981B2 JP54163776A JP16377679A JPS6246981B2 JP S6246981 B2 JPS6246981 B2 JP S6246981B2 JP 54163776 A JP54163776 A JP 54163776A JP 16377679 A JP16377679 A JP 16377679A JP S6246981 B2 JPS6246981 B2 JP S6246981B2
Authority
JP
Japan
Prior art keywords
semiconductor substrate
appearance inspection
mounting table
storage section
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54163776A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5685834A (en
Inventor
Hidemi Amai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP16377679A priority Critical patent/JPS5685834A/ja
Publication of JPS5685834A publication Critical patent/JPS5685834A/ja
Publication of JPS6246981B2 publication Critical patent/JPS6246981B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP16377679A 1979-12-17 1979-12-17 External appearance inspecting device for semiconductor substrate Granted JPS5685834A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16377679A JPS5685834A (en) 1979-12-17 1979-12-17 External appearance inspecting device for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16377679A JPS5685834A (en) 1979-12-17 1979-12-17 External appearance inspecting device for semiconductor substrate

Publications (2)

Publication Number Publication Date
JPS5685834A JPS5685834A (en) 1981-07-13
JPS6246981B2 true JPS6246981B2 (https=) 1987-10-06

Family

ID=15780495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16377679A Granted JPS5685834A (en) 1979-12-17 1979-12-17 External appearance inspecting device for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5685834A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4772126A (en) * 1986-10-23 1988-09-20 Inspex Incorporated Particle detection method and apparatus
CN110479643B (zh) * 2019-09-18 2020-06-19 青岛亚洲湾包装有限公司 一种生产包装喷码检测装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52125451U (https=) * 1976-03-19 1977-09-24
JPS5355983A (en) * 1976-10-31 1978-05-20 Konishiroku Photo Ind Co Ltd Automatic micro defect detector

Also Published As

Publication number Publication date
JPS5685834A (en) 1981-07-13

Similar Documents

Publication Publication Date Title
US8760643B2 (en) Apparatus and method for inspecting defect in object surface
US6822734B1 (en) Apparatus and method for fabricating flat workpieces
US6373565B1 (en) Method and apparatus to detect a flaw in a surface of an article
EP1001460B1 (en) Method and apparatus for detecting, monitoring and characterizing edge defects on semiconductor wafers
JP2003529741A (ja) 自動化ウェハ欠陥検査システムおよびこのような検査を実行する方法
JPWO2008139735A1 (ja) 表面検査装置および表面検査方法
CN205484099U (zh) 晶圆表面检测设备
JP4385419B2 (ja) 外観検査方法及び外観検査装置
JPH09252035A (ja) 半導体ウェーハの外観検査方法および装置
JP2000114329A (ja) 基板端部の研削面の検査方法とその装置
US6396579B1 (en) Method, apparatus, and system for inspecting transparent objects
JPH08137091A (ja) マスク外観検査装置
JPS6246981B2 (https=)
US12474275B2 (en) Inspection apparatus and inspection method
JPS5910231A (ja) パタ−ン欠陥解析装置
TWI854391B (zh) 晶圓檢測方法及其裝置
JPH09318330A (ja) 微細パターンの検査方法および検査装置
JPH10253547A (ja) 基板外観検査システム
JP2890082B2 (ja) ウエーハの検査方法及び装置
TWI918735B (zh) 檢查裝置及檢查方法
JPH06160286A (ja) 半導体パッケージの外観検査方法
KR200169673Y1 (ko) 반도체 제품 검사장치
JP3184640B2 (ja) ボンディングワイヤ検査装置
JPS6138537A (ja) カラ−フイルタ−検査方法
TW200401879A (en) Microscope arrangement for inspecting a substrate