JPS6246293Y2 - - Google Patents
Info
- Publication number
- JPS6246293Y2 JPS6246293Y2 JP1981133802U JP13380281U JPS6246293Y2 JP S6246293 Y2 JPS6246293 Y2 JP S6246293Y2 JP 1981133802 U JP1981133802 U JP 1981133802U JP 13380281 U JP13380281 U JP 13380281U JP S6246293 Y2 JPS6246293 Y2 JP S6246293Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- layer
- junction
- semiconductor
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13380281U JPS5839063U (ja) | 1981-09-08 | 1981-09-08 | 全色発光半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13380281U JPS5839063U (ja) | 1981-09-08 | 1981-09-08 | 全色発光半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5839063U JPS5839063U (ja) | 1983-03-14 |
JPS6246293Y2 true JPS6246293Y2 (enrdf_load_stackoverflow) | 1987-12-12 |
Family
ID=29927248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13380281U Granted JPS5839063U (ja) | 1981-09-08 | 1981-09-08 | 全色発光半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5839063U (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02273482A (ja) * | 1989-04-13 | 1990-11-07 | Nec Corp | Icソケット |
JPH0741170Y2 (ja) * | 1989-08-11 | 1995-09-20 | 三洋電機株式会社 | 発光ダイオードランプ |
JP3817323B2 (ja) * | 1997-03-13 | 2006-09-06 | ローム株式会社 | 半導体発光素子の製法 |
JP3822624B2 (ja) * | 2004-12-13 | 2006-09-20 | ローム株式会社 | 半導体発光素子 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5124860Y2 (enrdf_load_stackoverflow) * | 1972-03-09 | 1976-06-25 |
-
1981
- 1981-09-08 JP JP13380281U patent/JPS5839063U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5839063U (ja) | 1983-03-14 |
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