JPS6246061B2 - - Google Patents

Info

Publication number
JPS6246061B2
JPS6246061B2 JP58103482A JP10348283A JPS6246061B2 JP S6246061 B2 JPS6246061 B2 JP S6246061B2 JP 58103482 A JP58103482 A JP 58103482A JP 10348283 A JP10348283 A JP 10348283A JP S6246061 B2 JPS6246061 B2 JP S6246061B2
Authority
JP
Japan
Prior art keywords
pad
electrode pad
main electrode
auxiliary
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58103482A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59228730A (ja
Inventor
Isamu Odaka
Haruo Yoshikyo
Katsuhiko Aoki
Yasuo Tazo
Norifumi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP58103482A priority Critical patent/JPS59228730A/ja
Publication of JPS59228730A publication Critical patent/JPS59228730A/ja
Publication of JPS6246061B2 publication Critical patent/JPS6246061B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P74/00—
    • H10W90/724—

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP58103482A 1983-06-09 1983-06-09 補助パツド付き電極パツド Granted JPS59228730A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58103482A JPS59228730A (ja) 1983-06-09 1983-06-09 補助パツド付き電極パツド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58103482A JPS59228730A (ja) 1983-06-09 1983-06-09 補助パツド付き電極パツド

Publications (2)

Publication Number Publication Date
JPS59228730A JPS59228730A (ja) 1984-12-22
JPS6246061B2 true JPS6246061B2 (enExample) 1987-09-30

Family

ID=14355224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58103482A Granted JPS59228730A (ja) 1983-06-09 1983-06-09 補助パツド付き電極パツド

Country Status (1)

Country Link
JP (1) JPS59228730A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0346352U (enExample) * 1989-09-13 1991-04-30

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5554940A (en) * 1994-07-05 1996-09-10 Motorola, Inc. Bumped semiconductor device and method for probing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0346352U (enExample) * 1989-09-13 1991-04-30

Also Published As

Publication number Publication date
JPS59228730A (ja) 1984-12-22

Similar Documents

Publication Publication Date Title
US4750666A (en) Method of fabricating gold bumps on IC's and power chips
US5234149A (en) Debondable metallic bonding method
JP2555811B2 (ja) 半導体チップのフリップチップ接合方法
US7019397B2 (en) Semiconductor device, manufacturing method of semiconductor device, stack type semiconductor device, and manufacturing method of stack type semiconductor device
US6268739B1 (en) Method and device for semiconductor testing using electrically conductive adhesives
JP3186941B2 (ja) 半導体チップおよびマルチチップ半導体モジュール
US5863812A (en) Process for manufacturing a multi layer bumped semiconductor device
JP3052074B2 (ja) 集積回路チップのバーンインテスト基板及びこれを用いたノウングッドダイの製造方法
JPH06151701A (ja) 半導体装置の製造方法
US5023697A (en) Semiconductor device with copper wire ball bonding
CN110010511A (zh) 一种射频芯片系统级封装模组的测试方式
JP2715793B2 (ja) 半導体装置及びその製造方法
JPS6246061B2 (enExample)
KR20020026854A (ko) 반도체 장치 제조 방법
JP3468132B2 (ja) 半導体装置の製造方法
US5626971A (en) Thin film probe
JPS6260836B2 (enExample)
JPH0350736A (ja) 半導体チップのバンプ製造方法
US3802065A (en) Method and structure for mounting semiconductor chips
JP2000012621A (ja) 半導体装置およびその製造方法
JPH06268201A (ja) Ｃｃｂバンプの形成方法
JPH04127547A (ja) Ｌｓｉ実装構造体
JPH02181457A (ja) バンプ電極を備える集積回路装置の試験方法
JP3128511B2 (ja) アンパッケージ半導体ダイ試験用インターコネクトの形成方法
JPS6234144B2 (enExample)