JPS6245298B2 - - Google Patents

Info

Publication number
JPS6245298B2
JPS6245298B2 JP57029999A JP2999982A JPS6245298B2 JP S6245298 B2 JPS6245298 B2 JP S6245298B2 JP 57029999 A JP57029999 A JP 57029999A JP 2999982 A JP2999982 A JP 2999982A JP S6245298 B2 JPS6245298 B2 JP S6245298B2
Authority
JP
Japan
Prior art keywords
alloy
lead wire
exceeding
conductivity
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57029999A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58147140A (ja
Inventor
Rensei Futatsuka
Tadao Sakakibara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP57029999A priority Critical patent/JPS58147140A/ja
Publication of JPS58147140A publication Critical patent/JPS58147140A/ja
Publication of JPS6245298B2 publication Critical patent/JPS6245298B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57029999A 1982-02-26 1982-02-26 半導体装置のリ−ド材 Granted JPS58147140A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57029999A JPS58147140A (ja) 1982-02-26 1982-02-26 半導体装置のリ−ド材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57029999A JPS58147140A (ja) 1982-02-26 1982-02-26 半導体装置のリ−ド材

Publications (2)

Publication Number Publication Date
JPS58147140A JPS58147140A (ja) 1983-09-01
JPS6245298B2 true JPS6245298B2 (cg-RX-API-DMAC7.html) 1987-09-25

Family

ID=12291613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57029999A Granted JPS58147140A (ja) 1982-02-26 1982-02-26 半導体装置のリ−ド材

Country Status (1)

Country Link
JP (1) JPS58147140A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0158494U (cg-RX-API-DMAC7.html) * 1987-10-09 1989-04-12

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140339A (ja) * 1983-01-29 1984-08-11 Furukawa Electric Co Ltd:The リ−ドフレ−ム用銅合金
JPS60174841A (ja) * 1984-02-21 1985-09-09 Furukawa Electric Co Ltd:The 電子電気機器用リン青銅
JP4717686B2 (ja) * 2006-04-04 2011-07-06 内橋エステック株式会社 筒型温度ヒューズ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0158494U (cg-RX-API-DMAC7.html) * 1987-10-09 1989-04-12

Also Published As

Publication number Publication date
JPS58147140A (ja) 1983-09-01

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