JPS6244816B2 - - Google Patents
Info
- Publication number
- JPS6244816B2 JPS6244816B2 JP56030996A JP3099681A JPS6244816B2 JP S6244816 B2 JPS6244816 B2 JP S6244816B2 JP 56030996 A JP56030996 A JP 56030996A JP 3099681 A JP3099681 A JP 3099681A JP S6244816 B2 JPS6244816 B2 JP S6244816B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- plating
- wire
- phosphorus
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/457—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/5363—
-
- H10W72/5522—
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- H10W72/5524—
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- H10W72/59—
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- H10W72/884—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56030996A JPS57145351A (en) | 1981-03-04 | 1981-03-04 | Lead frame for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56030996A JPS57145351A (en) | 1981-03-04 | 1981-03-04 | Lead frame for semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57145351A JPS57145351A (en) | 1982-09-08 |
| JPS6244816B2 true JPS6244816B2 (cg-RX-API-DMAC10.html) | 1987-09-22 |
Family
ID=12319202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56030996A Granted JPS57145351A (en) | 1981-03-04 | 1981-03-04 | Lead frame for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57145351A (cg-RX-API-DMAC10.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57192057A (en) * | 1981-05-22 | 1982-11-26 | Hitachi Ltd | Semiconductor device |
| JPS6010796A (ja) * | 1983-06-30 | 1985-01-19 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 配線構造体 |
| JPS6362259A (ja) * | 1986-09-02 | 1988-03-18 | Nec Corp | 半導体装置用リ−ドフレ−ム |
| JP7061247B1 (ja) * | 2020-12-28 | 2022-04-28 | 松田産業株式会社 | ニッケル電解めっき皮膜及びめっき構造体 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6033312B2 (ja) * | 1979-02-15 | 1985-08-02 | 株式会社東芝 | 半導体装置 |
-
1981
- 1981-03-04 JP JP56030996A patent/JPS57145351A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57145351A (en) | 1982-09-08 |
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