JPS6244813B2 - - Google Patents

Info

Publication number
JPS6244813B2
JPS6244813B2 JP56114666A JP11466681A JPS6244813B2 JP S6244813 B2 JPS6244813 B2 JP S6244813B2 JP 56114666 A JP56114666 A JP 56114666A JP 11466681 A JP11466681 A JP 11466681A JP S6244813 B2 JPS6244813 B2 JP S6244813B2
Authority
JP
Japan
Prior art keywords
film
semiconductor substrate
conductive film
insulating film
conductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56114666A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5816546A (ja
Inventor
Takehiko Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56114666A priority Critical patent/JPS5816546A/ja
Publication of JPS5816546A publication Critical patent/JPS5816546A/ja
Publication of JPS6244813B2 publication Critical patent/JPS6244813B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP56114666A 1981-07-22 1981-07-22 半導体装置 Granted JPS5816546A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56114666A JPS5816546A (ja) 1981-07-22 1981-07-22 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56114666A JPS5816546A (ja) 1981-07-22 1981-07-22 半導体装置

Publications (2)

Publication Number Publication Date
JPS5816546A JPS5816546A (ja) 1983-01-31
JPS6244813B2 true JPS6244813B2 (enExample) 1987-09-22

Family

ID=14643541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56114666A Granted JPS5816546A (ja) 1981-07-22 1981-07-22 半導体装置

Country Status (1)

Country Link
JP (1) JPS5816546A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6417052U (enExample) * 1987-07-21 1989-01-27
JPS6436740U (enExample) * 1987-08-29 1989-03-06

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0687464B2 (ja) * 1986-12-17 1994-11-02 日本電装株式会社 アルミニウム合金配線装置およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6417052U (enExample) * 1987-07-21 1989-01-27
JPS6436740U (enExample) * 1987-08-29 1989-03-06

Also Published As

Publication number Publication date
JPS5816546A (ja) 1983-01-31

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