JPS6244529Y2 - - Google Patents
Info
- Publication number
- JPS6244529Y2 JPS6244529Y2 JP7997983U JP7997983U JPS6244529Y2 JP S6244529 Y2 JPS6244529 Y2 JP S6244529Y2 JP 7997983 U JP7997983 U JP 7997983U JP 7997983 U JP7997983 U JP 7997983U JP S6244529 Y2 JPS6244529 Y2 JP S6244529Y2
- Authority
- JP
- Japan
- Prior art keywords
- rod
- mold
- chuck
- holder
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 9
- 239000000057 synthetic resin Substances 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7997983U JPS59185831U (ja) | 1983-05-26 | 1983-05-26 | 電子部品の合成樹脂モ−ルド装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7997983U JPS59185831U (ja) | 1983-05-26 | 1983-05-26 | 電子部品の合成樹脂モ−ルド装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59185831U JPS59185831U (ja) | 1984-12-10 |
| JPS6244529Y2 true JPS6244529Y2 (enrdf_load_stackoverflow) | 1987-11-25 |
Family
ID=30209975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7997983U Granted JPS59185831U (ja) | 1983-05-26 | 1983-05-26 | 電子部品の合成樹脂モ−ルド装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59185831U (enrdf_load_stackoverflow) |
-
1983
- 1983-05-26 JP JP7997983U patent/JPS59185831U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59185831U (ja) | 1984-12-10 |
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