JPS6244529Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for molding a semiconductor chip part with a thermosetting synthetic resin in an electronic component such as a light emitting diode.

Generally, a light emitting diode is manufactured by punching out a lead frame 1 from a thin metal plate, which is made up of a cathode lead 2 and an anode lead 3 connected at an appropriate interval P, which constitute one light emitting diode, as shown in FIG.
After performing die bonding and wire bonding on the tips of the cathode lead 2 and anode lead 3 that form a pair at the interval P, the tips are placed in the pot 5 of the mold 4 into which a thermosetting synthetic resin liquid has been injected in advance. Insert lead frame 1 and mold 4
The lead frame 1 is manufactured by curing the synthetic resin with the leads 2 and 3 fixed in a predetermined positional relationship, and then cutting the joints between the leads 2 and 3 in the lead frame 1. In this case, the synthetic resin is The molding die 4 for molding is a molding die that is divided into an appropriate number (for example, 5) of light emitting diode units in the longitudinal direction of the lead frame 1, without making the entire length of the lead frame 1 integral. year,
A plurality of these (for example, five) are arranged in a row.

Conventionally, a plurality of molds as described above are attached to a support member with screws, and a lead frame is attached to this support member with the semiconductor chip at its tip inserted into the mold. Thus, the positional relationship between the lead frame and the mold is fixed, and the synthetic resin is cured under this condition.

However, the mold described above must be replaced with a new mold after about 30 uses, so if the mold is attached with screws as in the conventional example described above, it is difficult to replace the mold. In addition to requiring a large amount of labor, work efficiency was low due to the hassle of separately fixing the lead frame and mold. Furthermore, in some cases, since the heights of the molds are different, it is necessary to change the height of the jig member, further increasing the number of steps described above.

In such a case, the present invention fixes the lead frame and the plurality of molds by simultaneously clamping them from both the left and right sides with the semiconductor chip at the tip of the lead frame inserted into the mold. This eliminates the conventional inconvenience of replacing molds, improves work efficiency, and enables automation of the work.

The present invention will be described below with reference to an embodiment. In the figure, 6 indicates a holder rod having an appropriately longer length than the lead frame 1, and 7 indicates a chuck rod extending parallel to one side of the holder rod 6. Both ends of the rod 7 are slidably fitted into guide pins 8, 8 installed horizontally at both ends of the holder rod 6, and parallel to the holder rod 6 along the guide pins 8, 8. Both guide pins 8,
8, and both guide pins 8,
A spring 11 inserted between the chuck rod 7 and a bar 10 that connects the ends of the holder rods 8 is pressed to contact one side of the holder rod 6, and the holder rod 6 and the chuck rod 7 are pressed together. It is configured to sandwich the lead frame 1 therebetween.

The lower surface 12 of the holder rod 6 and the chuck rod 7
The lower surface 13 of the holder rod 6 is formed in the same plane so that the upper surface 14 of each mold 4 is in contact with both lower surfaces 12 and 13, and the lower surface 12 of the holder rod 6 has a
A protrusion 16 is provided to protrude from one side surface 15, and a leaf spring 17 is provided along the outer surface of the chuck rod 7 opposite to the inner surface that contacts the holder rod 6. The upper end of the leaf spring 17 is fixed to the chuck rod 7 with a plurality of screws 18, and the lower edge 19 of the leaf spring 17 is projected downward from the lower surface 13 of the chuck rod 7, so that the lower edge 19 and the holder rod 6 are connected to each other. It is constructed so that each mold 4 is held between the protrusions 16 on the lower surface.

In addition, the reference numeral 20 in the figure indicates a protection plate for the leaf spring 17, and the leaf spring 17 has a plurality of slits 21 carved at appropriate intervals along its longitudinal direction, and the inside surface of the chuck rod 7 or the holder. On the inner surface of the rod 6, a plurality of pressing pins 23 with springs 22 are provided so as to be able to freely appear and retract, the tip of which comes into contact with the lead frame 1.

In this configuration, in order to sandwich a plurality of molds 4 and lead frames 1 between the holder rod 6 and the chuck rod 7, a predetermined number (for example, five) of molds 4 are arranged in parallel on the support base 24. A synthetic resin liquid is injected into each pot 5 in the mold 4, and then, with the holder rod 6 and the chuck rod 7 spread out against the springs 9, 9, and 11, the lead frame is placed. 1 is inserted between the holder rod 6 and the chuck rod 7, and the lower surfaces 12 and 13 of the holder rod 6 and chuck rod 7 are brought into close contact with the upper surface 14 of the mold 4 (FIG. 6). After immersing the semiconductor chip at the tip into the pot 5 of the mold 4, the holder rod 6 and the chuck rod 7 are spread out and released.
and are brought close to each other by springs 9, 9, and 11, and the lead frame 1 is held between them by the force of the springs 9, 9, and 11, while the protrusion 16 on the lower surface of the holder rod 6 and the leaf spring of the chuck rod 7 Since each mold 4 is held between the lead frame 1 and the lower edge 19 of the lead frame 17 by the elastic force of the leaf spring 17, the lead frame 1 and each mold 4 are
The relative position between the two is automatically determined and, at the same time, fixed at the predetermined relative position.

Therefore, after curing the synthetic resin liquid in the above condition, the holder rod 6 and the chuck rod 7 can be pushed apart against the springs 9, 9, and 11 and removed. In this case, when replacing the mold 4, it is only necessary to replace it with a new mold before clamping the mold 4 between the holder rod 6 and the chuck rod 7, and the conventional screw There is no need for replacement work by attaching and detaching.

Furthermore, although the above embodiments have been described with respect to manufacturing a light emitting diode, the present invention is not limited thereto, and it goes without saying that the present invention can be applied to other similar electronic components.

Note that if the lower end edge 19 of the leaf spring 17 is bent inward at an appropriate angle as shown in the figure, and the inner surface of the protrusion 16 is also formed into an inclined surface at an appropriate angle, the molding held between them can be The upper surface 14 of the mold 4 is automatically pressed into close contact with the lower surface 12 of the holder rod 6 and the lower surface 13 of the chuck rod 7 due to the guiding action of the lower edge 19 of the leaf spring and the inclined inner surface of the projection 16, so that relative positioning is possible. This can be done more accurately, and if a plurality of slits 21 are carved at appropriate intervals in the longitudinal direction of the leaf spring 17, even if there is a dimensional error in the width of each mold 4, the width can be adjusted. Each mold can be reliably clamped under equal conditions without weakening the grip for molds smaller than the standard value. Furthermore, if a pressing pin 23 with a spring 22 is provided on one or both of the inner surfaces of the holder rod 6 and the chuck rod 7 as shown in the figure, even if the lead frame 1 is slightly deformed, , it is possible to reliably hold it while correcting this.

In summary, the present invention has a holder rod and a chuck rod that is parallel to the holder rod and is configured to freely move back and forth with respect to the holder rod, and a spring that holds the lead frame between the holder rod and the chuck rod. The lower surface of the holder rod and the lower surface of the chuck rod are formed in the same plane so that the upper surface of the mold is in close contact with both lower surfaces, and the lower surface of the holder rod has a protrusion with which one side of the mold comes into contact. On the other hand, a leaf spring with a free lower end is provided on the outer surface of the chuck rod, and the lower end of the leaf spring is connected to the chuck rod such that the mold is held between the lower end edge and the protrusion. This is a synthetic resin molding device for electronic components that protrudes from the bottom surface. Simply by expanding the holder rod and chuck rod against a spring and then releasing the expansion, the lead frame and each mold can be molded together. Since the mold and lead frame can be held and fixed at the same time in a predetermined relative position, there is no need to worry about fixing the mold and lead frame separately as in the past, and the labor required to replace the mold is eliminated, improving work efficiency. It is possible to achieve a remarkable improvement, and furthermore, it is possible to fully automate the above-mentioned work.

[Brief explanation of the drawing]

Figure 1 is a diagram of the lead frame and mold, Figure 2
The figures are an enlarged sectional view of Fig. 1, and Figs. 3 to 6.
The figures show an embodiment of the present invention, and FIG. 3 is a plan view of the device, FIG. 4 is a side view of FIG. 3, and FIG.
The figures are FIG. 3 - an enlarged sectional view, and FIG. 6 is a sectional view showing the operating state. 1... Lead frame, 4... Molding mold, 6...
Holder rod, 7... Chuck rod, 8... Guide pin, 9, 11... Spring, 12, 13... Bottom surface, 1
6... Protrusion, 17... Leaf spring, 19... Lower edge.

Claims (1)

[Scope of utility model registration request] A spring is mounted between the holder rod and the chuck rod, which is configured to freely move back and forth with respect to the holder rod in parallel with the holder rod. The lower surface and the lower surface of the chuck rod are formed on the same plane so that the upper surface of the mold is in close contact with both lower surfaces, and the lower surface of the holder rod is provided with a protrusion that one side of the mold comes into contact with, while the chuck rod A leaf spring with a free lower end is provided on the outer surface of the chuck rod, and the lower edge of the leaf spring protrudes from the lower surface of the chuck rod so as to sandwich the mold between the lower edge and the protrusion. Synthetic resin molding equipment for electronic parts.