CN212884514U

CN212884514U - CQFP lead frame forming die

Info

Publication number: CN212884514U
Application number: CN202021785829.4U
Authority: CN
Inventors: 康征; 史庄
Original assignee: Shijiazhuang Hengrong Shitong Electronic Technology Co ltd
Current assignee: Shijiazhuang Hengrong Shitong Electronic Technology Co ltd
Priority date: 2020-08-24
Filing date: 2020-08-24
Publication date: 2021-04-06
Anticipated expiration: 2030-08-24

Abstract

The utility model provides a CQFP lead frame forming die belongs to electronic parts technical field, including die holder, upper die base, lower shaping piece, go up the shaping piece, the outside of lower shaping piece is still overlapped and is equipped with the elasticity kicking block, and the top of lower shaping piece is provided with the first sand grip of bending of two relative settings, and the top of lower shaping piece also is provided with the second sand grip of bending of two relative settings. The utility model provides a CQFP lead frame forming die, with the lead frame after once punching press, the middle part lead wire of two rows of lead wires on the lead frame is bent, two rows of tip lead wires are bent, then carry out the secondary with the lead frame after rotating certain angle and bend the lead frame, thereby make the lead frame go up the tip lead wire on all lead wire rows and all processed target in place with the middle part lead wire, carry out the processing that twice punching presses realized the CQFP lead frame through using one set of mould, the machining efficiency of lead frame has been improved, the processing cost of lead frame has also been reduced.

Description

CQFP lead frame forming die

Technical Field

The utility model belongs to the technical field of electronic part, more specifically say, relate to a CQFP lead frame forming die.

Background

The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry. The bending angles of the leads at the two ends of each row of leads and other leads of the existing CQFP lead frame are different, so that two sets of dies are usually required for processing when the lead frame is bent and molded, and the production efficiency and the development cost of the lead frame are seriously influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a CQFP lead frame forming die aims at solving the lead frame among the prior art and needs many sets of moulds to process the problem that influences production efficiency and development cost.

In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides a CQFP lead frame forming die, including the die holder, with the relative upper die base that sets up of die holder, set up lower shaping piece on the die holder and set up on the upper die base and in the relative last shaping piece that sets up of shaping piece down, the outside of shaping piece still overlaps and is equipped with the elasticity kicking block down, the top of shaping piece is provided with two relative settings down, and is used for carrying out the first sand grip of bending to the lead wire of lead frame upper end, the top of shaping piece also is provided with two relative settings down, and is used for carrying out the second sand grip of bending to the lead wire of middle part on the lead wire frame.

As another embodiment of this application, first sand grip of bending is including the tip portion of bending that is used for bending lead frame upper end portion lead wire and the empty division in middle part that is used for dodging lead frame upper middle part lead wire, the sand grip of bending of second is including the middle part portion of bending that is used for bending lead frame upper middle part lead wire and the empty division in tip that is used for dodging lead frame upper end portion lead wire.

As another embodiment of this application, first bending sand grip with the equal mutually perpendicular setting of second bending sand grip, two first bending sand grip and two the second bending sand grip is constituteed and is followed the rectangle that the lower shaping piece week set up is bent protrudingly.

As another embodiment of this application, still be provided with the location fixed block that is used for fixing a position the lead frame position on the die holder, be provided with on the location fixed block and be used for fixing a position the lead frame position and in the appearance assorted constant head tank of lead frame, down the shaping piece is located in the constant head tank, the slip setting of elasticity kicking block is between location fixed block and lower shaping piece.

As another embodiment of this application, elasticity kicking block is including sliding the setting and being in piece body in the constant head tank and setting are in piece body with the elastic component between the die holder, be provided with on the piece body and be used for holding the accommodation hole of lower shaping piece.

As another embodiment of this application, be provided with the installation blind hole that is used for installing the elastic component on the die holder, a part of installation blind hole is located another part in location fixed block below and is located the constant head tank, location fixed block bottom still is provided with the spring groove of stepping down.

As another embodiment of this application, the die holder includes lower bolster backing plate and sets up the lower fixed plate that is used for fixed lower shaping piece above the lower bolster backing plate, be provided with on the lower fixed plate with lower shaping piece shape assorted first mounting hole.

As another embodiment of this application, the upper die base includes the last die backing plate, sets up go up the die backing plate below be used for fixed upper shaping piece the fixed upper mounting plate and set up and be in go up die backing plate top be used for with go up the die shank that die backing plate and pressure equipment link to each other.

As another embodiment of the application, a guide mechanism for keeping the upper die holder stably moving is further arranged between the lower die holder and the upper die holder.

As another embodiment of this application, guiding mechanism includes a plurality of settings and is in guide post on the die holder and a plurality of settings are on the upper die base and in guide post position assorted uide bushing, be provided with the uide bushing hole that is used for installing the uide bushing on the upper die base.

The utility model provides a CQFP lead frame forming die's beneficial effect lies in: compared with the prior art, through being provided with down the shaping piece on the lower die holder to and set up the last shaping piece on the upper die holder, the outside of lower shaping piece still overlaps and is equipped with the elasticity kicking block, and the top of lower shaping piece is provided with two relative settings, and is used for carrying out the first bending sand grip of bending to lead frame upper end, and the top of lower shaping piece also is provided with two relative settings, and is used for carrying out the second bending sand grip of bending to lead frame upper middle part lead wire. The utility model discloses a CQFP lead frame forming die, when the lead frame is processed, the lead frame is placed on the elastic ejecting block, then the upper forming block moves downwards under the driving of the upper die base, the lead frame is pressed and fixed by the upper forming block and the elastic ejecting block, then the upper forming block moves downwards together with the elastic ejecting block, the top of the lower forming block protrudes the elastic ejecting block to bend the corresponding part of the lead frame, wherein, the top of the lower forming block is respectively provided with a first bending convex strip and a second bending convex strip, after the lead frame is punched for one time, the middle leads of two rows of leads on the lead frame are bent, the two rows of end leads are bent, then the lead frame is bent for the second time after rotating a certain angle, thereby the end leads and the middle leads on all lead rows on the lead frame are processed in place, the processing of the CQFP lead frame is realized by using one set of die to punch for two times, the processing efficiency of the lead frame is improved, and the processing cost of the lead frame is also reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a diagram illustrating a CQFP lead frame in the prior art;

fig. 2 is a schematic structural diagram of a CQFP lead frame forming mold according to an embodiment of the present invention;

fig. 3 is a schematic cross-sectional view of a CQFP lead frame forming mold according to an embodiment of the present invention;

FIG. 4 is a schematic structural view of a lower die holder used in the embodiment of the present invention;

FIG. 5 is an enlarged view of the structure at A in FIG. 4;

fig. 6 is a schematic structural view of a positioning fixing block adopted in the embodiment of the present invention;

fig. 7 is a schematic structural view of a lower die holder adopted in the embodiment of the present invention.

In the figure: 1. a lower die holder; 11. a lower die base plate; 12. a lower fixing plate; 13. a first mounting hole; 2. an upper die holder; 21. an upper die base plate; 22. an upper fixing plate; 23. a die shank; 3. a lower forming block; 4. an upper forming block; 41. a yielding groove; 5. an elastic jacking block; 51. a block body; 52. an elastic member; 6. a first bending convex strip; 7. second bending convex strips; 8. a guide mechanism; 81. a guide post; 82. a guide sleeve; 9. positioning a fixed block; 91. positioning a groove; 10. a lead frame; 101. a middle lead; 102. and end lead wires.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to fig. 1 to fig. 3, a CQFP lead frame forming mold according to the present invention will now be described. CQFP lead frame forming die, including die holder 1, the upper die base 2 that sets up with die holder 1 is relative, the lower shaping piece 3 of setting on die holder 1, and set up on upper die base 2 and in the relative last shaping piece 4 that sets up of shaping piece 3 down, the outside of shaping piece 3 still overlaps and is equipped with elasticity kicking block 5 down, the top of shaping piece 3 is provided with two relative settings down, and be used for carrying out the first bending sand grip 6 of bending to lead frame 10 upper end lead wire 102, the top of shaping piece 3 also is provided with two relative settings down, and be used for going up middle part lead wire 101 to the lead frame 10 and carry out the second bending sand grip 7 of bending.

Compared with the prior art, the CQFP lead frame forming die provided by the embodiment is characterized in that a lower forming block 3 is arranged on a lower die holder 1, an upper forming block 4 on an upper die holder 2 is arranged, an elastic ejecting block 5 is sleeved outside the lower forming block 3, the top of the lower forming block 3 is provided with two opposite settings and is used for bending a first bending protruding strip 6 of an upper end lead 102 of a lead frame 10, and the top of the lower forming block 3 is also provided with two opposite settings and is used for bending a second bending protruding strip 7 of the upper middle lead 101 of the lead frame 10. The utility model discloses a CQFP lead frame forming die, when the lead frame 10 is processed, the lead frame 10 is placed on the elastic ejecting block 5, then the upper forming block 4 moves downwards under the driving of the upper die holder 2, the lead frame 10 is pressed and fixed through the upper forming block 4 and the elastic ejecting block 5, then the upper forming block 4 moves downwards together with the elastic ejecting block 5, so that the top of the lower forming block 3 protrudes out of the elastic ejecting block 5 to bend the corresponding part of the lead frame 10, wherein the top of the lower forming block 3 is respectively provided with a first bending protruding strip 6 and a second bending protruding strip 7, after the lead frame 10 is punched once, the middle lead 101 of the two rows of leads on the lead frame 10 is bent, the two rows of end leads 102 are bent, then the lead frame 10 is bent for the second time after rotating a certain angle, thereby the end leads 102 and the middle lead 101 on all the lead rows on the lead frame 10 are processed in place, the processing of the CQFP lead frame 10 is realized by using one set of die to perform twice stamping, which improves the processing efficiency of the lead frame 10 and also reduces the processing cost of the lead frame 10.

In this embodiment, still be provided with on the working face of last shaping piece 4 and be used for holding last shaping piece 4 and in last shaping piece 4 shape assorted groove 41 of stepping down, the groove 41 of stepping down is concave to be established on last shaping piece 4 bottom surface, when going up shaping piece 4 and lower shaping piece 3 and hugging closely each other and compressing tightly, first bending sand grip 6 all is located the groove 41 of stepping down with second bending sand grip 7, and the lateral wall shape of the groove 41 of stepping down matches each other with the side shape of first bending sand grip 6 with second bending sand grip 7 respectively, extrude the shaping position of lead frame 10 through the lateral wall of the groove 41 of stepping down and the side of first bending sand grip 6 or second bending sand grip.

As a specific implementation manner of the CQFP lead frame forming die, please refer to fig. 4 to 7 together, first convex strip 6 of bending bends the portion and is used for dodging the empty division in middle part of lead wire 101 on the lead frame 10 including the tip that is used for bending lead frame 10 upper end lead wire 102, and the convex strip 7 of bending the second bends the portion and is used for dodging the empty division in tip that lead wire 102 was led to the lead frame 10 upper end including the middle part that is used for bending lead wire 101 on the lead frame 10. The shape of the first bending convex strip 6 is matched with that of the end lead 102, the shape of the second bending convex strip 7 is matched with that of the middle lead 101, when the lead frame 10 is bent for the first time, the two rows of leads on the lead frame 10 are bent at the first bending convex strip 6 at the end lead 102, the other two rows of leads are bent at the second bending convex strip 7 at the middle lead 101, then the lead frame 10 is rotated by 90 degrees and placed on the lower forming block 3 again for secondary punching, the two rows of leads on the lead frame 10 bend the middle lead 101 which is not bent at the second bending convex strip 7, and the other two rows of leads on the lead frame 10 bend the end lead 102 which is not bent at the first bending convex strip 6, so that the processing efficiency of the lead frame 10 is improved, and the processing cost of the lead frame 10 is reduced.

As a specific embodiment of the CQFP lead frame forming die, please refer to fig. 4 and 5, the first bending protruding strip 6 and the second bending protruding strip 7 are all perpendicular to each other, and the two first bending protruding strips 6 and the two second bending protruding strips 7 form a rectangular bending protrusion arranged along the circumference of the lower forming block 3. The lengths and positions of the first bending convex strip 6 and the second bending convex strip 7 are matched with the areas needing to be bent on the CQFP lead frame 10, so that the processing efficiency of the lead frame 10 is improved, and the processing cost of the lead frame 10 is reduced.

As a specific implementation manner of the CQFP lead frame forming die, please refer to fig. 4 and 6, still be provided with the location fixed block 9 that is used for fixing a position the lead frame 10 position on the lower die holder 1, be provided with on the location fixed block 9 and be used for fixing a position the lead frame 10 position and in the appearance assorted constant head tank 91 of lead frame 10, lower shaping piece 3 is located constant head tank 91, elasticity kicking block 5 slides and sets up between location fixed block 9 and lower shaping piece 3. The constant head tank 91 runs through whole location fixed block 9 setting to elasticity kicking block 5 slides and sets up in constant head tank 91, and elasticity kicking block 5 can slide from top to bottom along the direction of height of constant head tank 91. The top height of the elastic top block 5 is lower than the top surface of the positioning fixing block 9 in the initial state but higher than the top surface of the lower forming block 3, so that the lead frame 10 can be conveniently placed into the positioning groove 91 to be positioned before processing, and the processing of the lead frame 10 is more accurate.

In this embodiment, the positioning groove 91 includes a groove body for positioning the lead frame 10 and matching the shape of the lead frame 10 body, and an escape portion for escaping the connection end of the lead frame 10.

As a specific embodiment of the CQFP lead frame forming die provided in the present invention, please refer to fig. 3 and 6, the elastic top block 5 includes a block body 51 slidably disposed in the positioning groove 91 and an elastic member 52 disposed between the block body 51 and the lower die holder 1, and the block body 51 is provided with a receiving hole for receiving the lower forming block 3. The piece body 51 sets up with lower bolster 1 interval under the effect of elastic component 52, and under the pressure effect of last shaping piece 4, piece body 51 can be interactive for shaping piece 3 down, and convenient last shaping piece 4 is bent the processing to lead frame 10, makes and has improved lead frame 10 production efficiency.

In this embodiment, the elastic member 52 preferably adopts a spring, so that the overall manufacturing cost of the mold is reduced, the structure is simple, the installation is convenient and fast, and the mold is more convenient and fast to manufacture and assemble.

As a specific implementation manner of the CQFP lead frame forming die, please refer to fig. 3 and 4, the lower die holder 1 is provided with an installation blind hole for installing the elastic element 52, a part of the installation blind hole is located the positioning fixing block 9, and the other part is located the positioning groove 91, and the bottom of the positioning fixing block 9 is further provided with a spring yielding groove. The elastic piece 52 is placed in the installation blind hole and then is pressed and fixed on the installation blind hole through the positioning fixing block 9, one part of the end face of the elastic piece 52 abuts against the bottom of the spring yielding groove at the bottom of the positioning fixing block 9, the other part of the end face abuts against the bottom of the block body 51, and the spring yielding groove is arranged to allow the elastic piece 52 to have a certain telescopic space to jack up the block body 51 by a certain height, so that the block body 51 can support the lead frame 10. The elastic element 52 is more convenient to install, the whole space of the lower die holder 1 is saved, and the structure of the die is simpler.

As a specific implementation manner of the CQFP lead frame forming die, please refer to fig. 3 and 4, the lower die holder 1 includes the lower die pad 11 and sets up the lower fixing plate 12 that is used for fixed lower shaping piece 3 above the lower die pad 11, is provided with the first mounting hole 13 with the 3 shape assorted of lower shaping piece on the lower fixing plate 12. The lower fixing plate 12 is fixed to the lower die base plate 11 through a fastener, a fixing structure used for fixing the lower die base 1 and an operation table of a pressure device is arranged on the lower die base plate 11, the lower forming block 3 is fixed to the lower fixing plate 12 through a first mounting hole 13, the lower forming block 3 is installed in the first mounting hole 13 in a tight fit mode, installation of the lower forming block 3 is more convenient and accurate, and production accuracy of the lead frame 10 is improved.

As a specific embodiment of the CQFP lead frame forming die provided in the present invention, please refer to fig. 3 to 7, the upper die base 2 includes an upper die base plate 21, an upper fixing plate 22 disposed below the upper die base plate 21 and used for fixing the upper forming block 4, and a die handle 23 disposed above the upper die base plate 21 and used for connecting the upper die base plate 21 with a press device. The upper die base 2 is connected with a pressure device through a die handle 23, an upper fixing plate 22 is fixed on an upper die base plate 21 through a fastener, a positioning pin is further arranged between the upper fixing plate 22 and the upper die base plate 21, a second mounting hole used for mounting and fixing an upper forming block 4 is also formed in the upper fixing plate 22, the upper forming block 4 is mounted in the second mounting hole in a tight fit mode, the lower forming block 3 is mounted more conveniently and accurately, and meanwhile the production precision of the lead frame 10 is also improved.

As a specific implementation manner of the CQFP lead frame forming die provided in the present invention, please refer to fig. 2 and 3, a guiding mechanism 8 for keeping the motion stability of the upper die base 2 is further disposed between the lower die base 1 and the upper die base 2. The guide mechanism 8 enables the upper die holder 2 and the lower die holder 1 to move more accurately.

As a specific implementation manner of the CQFP lead frame forming die provided in the present invention, please refer to fig. 2 and fig. 3, the guiding mechanism 8 includes a plurality of guide posts 81 disposed on the lower die base 1 and a plurality of guide sleeves 82 disposed on the upper die base 2 and matched with the guide posts 81, and the upper die base 2 is provided with a guide sleeve hole for installing the guide sleeve 82. The movement between the upper die holder 2 and the lower die holder 1 is more accurate.

The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides a CQFP lead frame forming die, its characterized in that, including the die holder, with upper die base, the setting that the die holder set up relatively are in lower shaping piece and setting on the die holder are in on the upper die base and in the relative last shaping piece that sets up of shaping piece down, the outside of shaping piece is still overlapped and is equipped with the elasticity kicking block down, the top of shaping piece down is provided with two relative settings, and is used for carrying out the first sand grip of bending to the lead frame upper end lead wire, the top of shaping piece down also is provided with two relative settings, and is used for carrying out the second sand grip of bending to the lead frame upper middle part lead wire.

2. The CQFP lead frame molding die of claim 1, wherein the first bending protrusion comprises an end bending portion for bending the upper end lead of the lead frame and a middle opening for avoiding the middle lead of the lead frame, and the second bending protrusion comprises a middle bending portion for bending the middle lead of the lead frame and an end opening for avoiding the upper end lead of the lead frame.

3. The CQFP lead frame molding die of claim 2, wherein the first bending ribs and the second bending ribs are perpendicular to each other, and two of the first bending ribs and two of the second bending ribs form rectangular bending protrusions disposed along the periphery of the lower molding block.

4. The CQFP lead frame forming die of claim 1, wherein the lower die holder is further provided with a positioning fixing block for positioning the lead frame, the positioning fixing block is provided with a positioning groove for positioning the lead frame and matching the shape of the lead frame, the lower forming block is located in the positioning groove, and the elastic top block is slidably disposed between the positioning fixing block and the lower forming block.

5. The CQFP lead frame molding die of claim 4, wherein the elastic top block comprises a block body slidably disposed in the positioning groove, and an elastic member disposed between the block body and the lower die base, and the block body is provided with a receiving hole for receiving the lower molding block.

6. The CQFP lead frame molding die of claim 5, wherein the lower die holder is provided with a blind mounting hole for mounting the elastic element, one part of the blind mounting hole is located below the fixed positioning block, the other part of the blind mounting hole is located in the positioning groove, and the bottom of the fixed positioning block is further provided with a spring relief groove.

7. The CQFP lead frame forming die of claim 1, wherein the lower die base comprises a lower die pad plate and a lower fixing plate disposed above the lower die pad plate for fixing a lower forming block, and the lower fixing plate is provided with a first mounting hole matching with the shape of the lower forming block.

8. The CQFP lead frame-forming die of claim 7, wherein the upper die base comprises an upper die pad, an upper fixing plate disposed below the upper die pad for fixing an upper forming block, and a die handle disposed above the upper die pad for connecting the upper die pad to a press.

9. The CQFP lead frame molding die of claim 1, wherein a guide mechanism for keeping the upper die holder moving stably is further disposed between the lower die holder and the upper die holder.

10. The CQFP lead frame molding die of claim 9, wherein the guiding mechanism includes a plurality of guiding posts disposed on the lower die base, and a plurality of guiding sleeves disposed on the upper die base and matching with the guiding posts, and the upper die base is provided with guiding sleeve holes for mounting the guiding sleeves.