JPS6243539B2 - - Google Patents

Info

Publication number
JPS6243539B2
JPS6243539B2 JP5115480A JP5115480A JPS6243539B2 JP S6243539 B2 JPS6243539 B2 JP S6243539B2 JP 5115480 A JP5115480 A JP 5115480A JP 5115480 A JP5115480 A JP 5115480A JP S6243539 B2 JPS6243539 B2 JP S6243539B2
Authority
JP
Japan
Prior art keywords
chip
circuit board
insulating layer
conductor
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5115480A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56146264A (en
Inventor
Yoichiro Oonishi
Hayato Takasago
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5115480A priority Critical patent/JPS56146264A/ja
Publication of JPS56146264A publication Critical patent/JPS56146264A/ja
Publication of JPS6243539B2 publication Critical patent/JPS6243539B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP5115480A 1980-04-14 1980-04-14 Carrier for equipment of chip Granted JPS56146264A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5115480A JPS56146264A (en) 1980-04-14 1980-04-14 Carrier for equipment of chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5115480A JPS56146264A (en) 1980-04-14 1980-04-14 Carrier for equipment of chip

Publications (2)

Publication Number Publication Date
JPS56146264A JPS56146264A (en) 1981-11-13
JPS6243539B2 true JPS6243539B2 (fr) 1987-09-14

Family

ID=12878897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5115480A Granted JPS56146264A (en) 1980-04-14 1980-04-14 Carrier for equipment of chip

Country Status (1)

Country Link
JP (1) JPS56146264A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0334444U (fr) * 1989-08-11 1991-04-04

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3629348B2 (ja) * 1997-04-16 2005-03-16 新光電気工業株式会社 配線基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0334444U (fr) * 1989-08-11 1991-04-04

Also Published As

Publication number Publication date
JPS56146264A (en) 1981-11-13

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