JPS6242018B2 - - Google Patents
Info
- Publication number
- JPS6242018B2 JPS6242018B2 JP55169944A JP16994480A JPS6242018B2 JP S6242018 B2 JPS6242018 B2 JP S6242018B2 JP 55169944 A JP55169944 A JP 55169944A JP 16994480 A JP16994480 A JP 16994480A JP S6242018 B2 JPS6242018 B2 JP S6242018B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead material
- conductivity
- strength
- heat resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16994480A JPS5793555A (en) | 1980-12-02 | 1980-12-02 | Lead material for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16994480A JPS5793555A (en) | 1980-12-02 | 1980-12-02 | Lead material for semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5793555A JPS5793555A (en) | 1982-06-10 |
| JPS6242018B2 true JPS6242018B2 (enrdf_load_html_response) | 1987-09-05 |
Family
ID=15895780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16994480A Granted JPS5793555A (en) | 1980-12-02 | 1980-12-02 | Lead material for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5793555A (enrdf_load_html_response) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59153853A (ja) * | 1983-02-21 | 1984-09-01 | Hitachi Metals Ltd | リ−ドフレ−ム材 |
| JPS605550A (ja) * | 1983-06-24 | 1985-01-12 | Toshiba Corp | 電子部品 |
| JPS6039142A (ja) * | 1983-08-11 | 1985-02-28 | Mitsubishi Electric Corp | 銅基合金 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834537B2 (ja) * | 1980-06-16 | 1983-07-27 | 日本鉱業株式会社 | 耐熱性の良好な高力導電用銅合金 |
| JPS5727051A (en) * | 1980-07-25 | 1982-02-13 | Nippon Telegr & Teleph Corp <Ntt> | Copper nickel tin alloy for integrated circuit conductor and its manufacture |
-
1980
- 1980-12-02 JP JP16994480A patent/JPS5793555A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5793555A (en) | 1982-06-10 |
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