JPS6240863B2 - - Google Patents
Info
- Publication number
- JPS6240863B2 JPS6240863B2 JP57061985A JP6198582A JPS6240863B2 JP S6240863 B2 JPS6240863 B2 JP S6240863B2 JP 57061985 A JP57061985 A JP 57061985A JP 6198582 A JP6198582 A JP 6198582A JP S6240863 B2 JPS6240863 B2 JP S6240863B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- solder cream
- solder
- lead terminal
- electrode pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 25
- 239000006071 cream Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57061985A JPS58178542A (ja) | 1982-04-13 | 1982-04-13 | リ−ド端子の固着方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57061985A JPS58178542A (ja) | 1982-04-13 | 1982-04-13 | リ−ド端子の固着方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58178542A JPS58178542A (ja) | 1983-10-19 |
| JPS6240863B2 true JPS6240863B2 (cs) | 1987-08-31 |
Family
ID=13186983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57061985A Granted JPS58178542A (ja) | 1982-04-13 | 1982-04-13 | リ−ド端子の固着方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58178542A (cs) |
-
1982
- 1982-04-13 JP JP57061985A patent/JPS58178542A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58178542A (ja) | 1983-10-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4415116A (en) | Soldering tool with resilient hold-down attachment and method of using same | |
| JPH0469836B2 (cs) | ||
| US4789096A (en) | Method of soldering joints by moving them through a target area on which a stream of hot gas is focused | |
| JPS6240863B2 (cs) | ||
| EP0410211A1 (de) | Verfahren zur Herstellung einer elektrisch leitenden Verbindung zwischen Kupferlackdrähten und Anschlusselementen | |
| JPH02144821A (ja) | ヒューズ形成方法 | |
| JPS6228069A (ja) | レ−ザはんだ付け方法 | |
| JPS6211767B2 (cs) | ||
| JPS6256665B2 (cs) | ||
| JPS5919394A (ja) | 多端子素子のハンダ付方法 | |
| JPS60182194A (ja) | はんだ付け方法 | |
| JPH0119418Y2 (cs) | ||
| JPH0422551Y2 (cs) | ||
| JPS63132464A (ja) | 集積回路のリ−ド | |
| JPH0355783A (ja) | リード端子の半田付け方法 | |
| JPS58190013A (ja) | チツプ部品およびチツプ部品のはんだ付け方法 | |
| JPH02276125A (ja) | ヒューズ回路形成方法 | |
| JPS6399746A (ja) | モ−タ回転子の製造方法およびその方法に使用する加熱装置 | |
| JPS5824940B2 (ja) | ハンドウタイソシノジツソウホウホウ | |
| JPH043514Y2 (cs) | ||
| JPS59137174A (ja) | 予備半田付け方法 | |
| JPH0437101A (ja) | 電子部品 | |
| JPS63204696A (ja) | 可撓性プリント基板への部品ハンダ付け実装法 | |
| JPS5846661A (ja) | 二股リ−ド端子の予備はんだ付着方法 | |
| JPS62183595A (ja) | プリント配線板の実装方法 |