JPS6240849B2 - - Google Patents
Info
- Publication number
- JPS6240849B2 JPS6240849B2 JP14046883A JP14046883A JPS6240849B2 JP S6240849 B2 JPS6240849 B2 JP S6240849B2 JP 14046883 A JP14046883 A JP 14046883A JP 14046883 A JP14046883 A JP 14046883A JP S6240849 B2 JPS6240849 B2 JP S6240849B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- vacuum nozzle
- drying
- main surface
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 61
- 238000001035 drying Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 13
- 235000012431 wafers Nutrition 0.000 description 57
- 239000000428 dust Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000011109 contamination Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14046883A JPS6032326A (ja) | 1983-08-02 | 1983-08-02 | 半導体ウエハの乾燥方法 |
| US06/633,134 US4559718A (en) | 1983-08-02 | 1984-07-23 | Method and apparatus for drying semiconductor wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14046883A JPS6032326A (ja) | 1983-08-02 | 1983-08-02 | 半導体ウエハの乾燥方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6032326A JPS6032326A (ja) | 1985-02-19 |
| JPS6240849B2 true JPS6240849B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-08-31 |
Family
ID=15269294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14046883A Granted JPS6032326A (ja) | 1983-08-02 | 1983-08-02 | 半導体ウエハの乾燥方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6032326A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109442883A (zh) * | 2018-11-08 | 2019-03-08 | 李伟 | 一种化工生产用效率高的离心干燥装置 |
-
1983
- 1983-08-02 JP JP14046883A patent/JPS6032326A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6032326A (ja) | 1985-02-19 |