JPS6240368B2 - - Google Patents
Info
- Publication number
- JPS6240368B2 JPS6240368B2 JP13765882A JP13765882A JPS6240368B2 JP S6240368 B2 JPS6240368 B2 JP S6240368B2 JP 13765882 A JP13765882 A JP 13765882A JP 13765882 A JP13765882 A JP 13765882A JP S6240368 B2 JPS6240368 B2 JP S6240368B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- inorganic filler
- coupling agent
- silane coupling
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13765882A JPS5927945A (ja) | 1982-08-05 | 1982-08-05 | 半導体封止用液状エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13765882A JPS5927945A (ja) | 1982-08-05 | 1982-08-05 | 半導体封止用液状エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5927945A JPS5927945A (ja) | 1984-02-14 |
| JPS6240368B2 true JPS6240368B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-08-27 |
Family
ID=15203782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13765882A Granted JPS5927945A (ja) | 1982-08-05 | 1982-08-05 | 半導体封止用液状エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5927945A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62149743A (ja) * | 1985-12-25 | 1987-07-03 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂成形材料 |
| JPS63225657A (ja) * | 1986-10-28 | 1988-09-20 | Calp Corp | 複合樹脂組成物 |
| JPS63202621A (ja) * | 1987-02-18 | 1988-08-22 | Matsushita Electric Works Ltd | エポキシ樹脂成形材料 |
| JPH0668012B2 (ja) * | 1987-09-15 | 1994-08-31 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 封止用組成物及び前記組成物を用いた電子装置 |
| EP0339527B1 (en) * | 1988-04-23 | 1997-07-09 | Nec Corporation | Fingerprint processing system capable of detecting a core of a fingerprint image by curvature parameters |
| JP2776757B2 (ja) | 1995-04-04 | 1998-07-16 | 日本電気ソフトウェア株式会社 | 指紋指頭軸方向検出装置 |
| US20050288458A1 (en) | 2002-07-29 | 2005-12-29 | Klemarczyk Philip T | Reworkable thermosetting resin composition |
| KR100890313B1 (ko) | 2000-03-31 | 2009-03-26 | 히다치 가세고교 가부시끼가이샤 | 열경화성 수지 조성물, 수지 필름, 절연 재료 부착 금속박,양면 금속박 부착 절연 필름, 금속장 적층판, 다층 금속장적층판 및 다층 프린트 배선판 |
| US7012120B2 (en) | 2000-03-31 | 2006-03-14 | Henkel Corporation | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent |
| WO2001074798A1 (en) * | 2000-03-31 | 2001-10-11 | Loctite Corporation | Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent |
| JP4618407B2 (ja) * | 2004-05-27 | 2011-01-26 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| JP5256614B2 (ja) * | 2006-01-19 | 2013-08-07 | 日立化成株式会社 | エポキシ樹脂組成物及び電子部品装置 |
| JP4904928B2 (ja) * | 2006-05-30 | 2012-03-28 | 横浜ゴム株式会社 | 注型用硬化性樹脂組成物およびタイヤ空気圧センサー |
| JP5520183B2 (ja) * | 2010-09-30 | 2014-06-11 | 積水化学工業株式会社 | 樹脂組成物、樹脂シート及び積層構造体 |
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1982
- 1982-08-05 JP JP13765882A patent/JPS5927945A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5927945A (ja) | 1984-02-14 |