JPS6239681A - Bonding method using pasty or non-dry film adhesive - Google Patents

Bonding method using pasty or non-dry film adhesive

Info

Publication number
JPS6239681A
JPS6239681A JP61059083A JP5908386A JPS6239681A JP S6239681 A JPS6239681 A JP S6239681A JP 61059083 A JP61059083 A JP 61059083A JP 5908386 A JP5908386 A JP 5908386A JP S6239681 A JPS6239681 A JP S6239681A
Authority
JP
Japan
Prior art keywords
adhesive
substrate
bonding
ceramic package
fabric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61059083A
Other languages
Japanese (ja)
Inventor
サムナー　エイチ　ウルフソン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Tucson Corp
Original Assignee
Burr Brown Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burr Brown Corp filed Critical Burr Brown Corp
Publication of JPS6239681A publication Critical patent/JPS6239681A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
    • H—ELECTRICITY
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    • B32B2553/00—Packaging equipment or accessories not otherwise provided for
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    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29075—Plural core members
    • H01L2224/29076—Plural core members being mutually engaged together, e.g. through inserts
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    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

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  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 発明の背景 発明の分野 本発明は、一般に、平坦な表面を一緒に接合させること
ができるように接着剤を適用する方法に関する。特に、
本発明は２つの平坦な表面間のよシ一様なかつよシ一体
的な接合を与えるために布プレフォームを適用する方法
に関する。BACKGROUND OF THE INVENTION Field of the Invention The present invention relates generally to methods of applying adhesives so that planar surfaces can be joined together. especially,
The present invention relates to a method of applying a fabric preform to provide a highly uniform and consistent bond between two planar surfaces.

一般に、表面を一緒に接合する際には２つの問題に遭遇
する。その問題はラン　アラ）　（ｒｕｎ　ｏｕｔ）と
ゲイディング（ｖｏｌｄｌｎｇ）である。−緒に接合し
ようとする２つの表面間に接着剤をサンドインチし、か
つ接着剤を硬化させるためにこの組立体（ａｓｓｅｍｂ
ｌｙ）　　を加熱またはその他の方法で活性化する際、
接着剤は、通常、軟化しかつ粘度が低くなる。接着剤が
軟化すると、接着剤は被接合二表面間から押し出される
頌向がある。通常ランアウトとして知られている接着剤
の過度の押し出されは部品の製造に於ける重大な問題を
ひき起こす可能性がある。この間ｌａは、硬化期間中、
接着剤と接合表面とを緊密な接触状態に保つために締め
つけ力を印加する場合にはさらに重大になる。硬化は、
重合またはイミデイゼーション（１ｍｌ　ｄ　ｌｚ　ａ
ｔｌｏｎ）または溶閉または軸媒作用または他の接合を
起こさせる手段によって達成することができる。Generally, two problems are encountered when joining surfaces together. The problems are run out and gading. - Sandwich the adhesive between the two surfaces to be joined together and allow the assembly to cure.
ly) upon heating or otherwise activating the
Adhesives typically soften and become less viscous. When the adhesive softens, it tends to be forced out from between the two surfaces to be joined. Excessive extrusion of adhesive, commonly known as runout, can cause serious problems in the manufacture of parts. During this time, la is during the curing period.
This becomes even more critical when clamping forces are applied to keep the adhesive and bonding surfaces in intimate contact. The hardening is
Polymerization or imidization (1ml d lz a
tlon) or by welding or axial action or other means of causing joining.

一つの平坦な二表面を一緒に接合させる際に遭遇する第
２の問題は両表面間の摺着剤層中に間隙が残るという間
叩である。この間′Ｋｉｄ、一般に、ボイド形成または
ボイディング−（ｖｏｉｄｌｎｇ）として炒られている
。ゲイディングは、接着剤４・Ｖと被接合表面との１ト
１の接触面積を減少させる作用がある。このボイディン
グは全朝立体の全体的な接合強度を低下させる。A second problem encountered when joining two flat surfaces together is spacing, which leaves gaps in the adhesive layer between the surfaces. During this period 'Kid' is commonly referred to as void formation or voiding. Gading has the effect of reducing the contact area between the adhesive 4·V and the surfaces to be bonded. This voiding reduces the overall joint strength of the Jeoncho three-dimensional structure.

エレクトロニック構成成分または部品の接合に於ては、
この２ンアウトとボイディングの問題は特に深刻である
。基板への大きいダイスの接合または基板の７４ツケー
ジへの接合には、しばしばランアウトまたはボイディン
グを伴う重大な問題がある。例えばハイブリッド　マイ
クロエレクトロニックデバイスの復造に於ては、電子回
路を相持する基板をパッケージ表面またはキャビティの
底へ固定することが望ましい。基板取付は工程中の過度
のランアウトは、ワイヤーボンディングされるべき傾城
を接着剤で被覆し、部品の破壊またはより高い修理費の
いずれかをもたらす可能性がある。Ｔ子回路担持基板を
基板自体よシ偶かに大きいキャビティ中へ接合させよう
とする場合には、このランアウト現壕が、基板への何ら
かの締めつけ力の適用をほとんど不可能にする。基板へ
の締めつけ力の適用は基板下の接着剤の厚さを薄くし、
かつ接着剤が基板の周りへもり上がる高さを高くする。When joining electronic components or parts,
This two-in-out and voiding problem is particularly serious. Bonding large dice to a substrate or bonding a substrate to a 74 cage has significant problems, often with runout or voiding. For example, in the reconstruction of hybrid microelectronic devices, it is desirable to secure the substrate carrying the electronic circuitry to the surface of the package or to the bottom of the cavity. Excessive runout during the board attachment process can coat the ramps to be wire bonded with adhesive, resulting in either component failure or higher repair costs. This run-out trench makes it nearly impossible to apply any clamping force to the board when attempting to bond the circuit-carrying board into a cavity that is even larger than the board itself. Application of clamping force to the board reduces the thickness of the adhesive under the board,
In addition, the height at which the adhesive rises around the substrate is increased.

締めつけカニで接着剤かもシ上がる高さは基板下の面状
対基板の周υの自由面積の比に等しい。この比は３０：
／の程度であり得る。通常の方法によるキャビティ中へ
のペースト接着剤の適用は、基板の頂部上への接着剤の
アウトウニリング（ｏｕｔｗｅｌｌｌｎｇ）　　および
溢流をもたらすランアウト現象に遭遇せずにはほとんど
不可能である。この現象は、硬化中に締め付は力を適用
するときあるいは接着剤の粘度が減少するときに特に顕
著である。The height that the adhesive rises when tightening is equal to the ratio of the free area of the bottom surface of the board to the circumference υ of the board. This ratio is 30:
It can be of the order of /. Application of a paste adhesive into a cavity by conventional methods is almost impossible without encountering run-out phenomena resulting in outwelling and overflow of the adhesive onto the top of the substrate. This phenomenon is particularly noticeable when the clamping force is applied or when the viscosity of the adhesive decreases during curing.

一方、がイド形成は接合組立体への熱伝導度を低下させ
る。熱伝導度は、抵抗体または別の活性部品がよシ高温
で作動する程度まで減少され、電気的パラメーターのシ
フトまたはドリフトに導く可能性がある。このことは、
抵抗体またはダイのような活性電子部品を基板に接合し
、この基板を次Ｋかなシ大きいディトをもつ接着剤１・
１鴫を有するパッケージへ接合させるとき１（特に決定
的である。On the other hand, glide formation reduces thermal conductivity to the joint assembly. Thermal conductivity is reduced to the extent that the resistor or other active component operates at higher temperatures, which can lead to shifts or drifts in electrical parameters. This means that
An active electronic component, such as a resistor or die, is bonded to a substrate, and this substrate is then bonded with an adhesive 1.
1 (particularly critical when bonding to a package with a 1.

旬間、ボイドが活性部品と基板との間の接着剤中にある
）局舎に、同じ結果が起こる。The same result occurs when the void is present in the adhesive between the active component and the board.

発明の要約 従って、本発明の７つの目的は、ランアウトおよびボイ
ディングの問題なしに接着剤層を用いて平坦な表面を一
緒に接合させることである。SUMMARY OF THE INVENTION Accordingly, it is a seven object of the present invention to join flat surfaces together using adhesive layers without run-out and voiding problems.

本発明のもう１つの目的は、布プレフォームを用いるこ
とによって平坦な表面を−・輩に接合させるときにラン
アウトおよびボイディングを防止することである。Another object of the invention is to prevent run-out and voiding when joining flat surfaces together by using a fabric preform.

本発明のさらにもう７つの目的は、・ぐツケージを金−
錫ろう付けまたはその等何物を用いて密封しようとする
とき、セラミックキャビティ　パッケージ中への基板の
経済的接合方法を提供することである。Still another object of the present invention is to
It is an object of the present invention to provide an economical method of joining a substrate into a ceramic cavity package when attempting to seal it using tin brazing or the like.

本発明のもう７つの目的は、非導′げ性ポリイミドを接
着剤として用いる場合、大きいダイスを基板へちるいは
基板を中キビテイパッケージ中へ取付ける方法を提伊す
ることである。Another object of the present invention is to propose a method for attaching large dice to a substrate or attaching a substrate into a medium-sized package when non-conducting polyimide is used as an adhesive.

好ましい実施態様の説明 第１図は基板ペース１２とポリイミド接着剤層１４とを
有する基板１０を示す。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a substrate 10 having a substrate paste 12 and a polyimide adhesive layer 14. FIG.

第２図は、基板１０と布バッキング２０と基板１０をそ
れへ取付けるキャビティ底８０を有する１Ｌグレー）ｅ
（Ｌ日ｒ　ａｚｅ　）”セラミックパッケージ４０との
…１の相互関係を示す。接着剤１４は、基板１０の基板
ペース１２へ適用してもよく、あるいはマイクロエレク
トロニクス工業に於て厚いフィルムインキを適用するた
めに通常用いられる標漁スクリーンプリンターによって
基板上ヘスクリーニングしてもよい。一般に、接着剤１
４の現型を適用し、基板ペース１２の周囲に約０．３０
ｇ羽（０，０２０Ｉｎ）のマー・シン１６を残す。マー
ジン１６は基板ペース１２の布プレフォーム２０への誤
整合および僅かに接着剤ランアウトをそ４１償する。FIG. 2 shows a 1L gray color having a substrate 10, a cloth backing 20, and a cavity bottom 80 to which the substrate 10 is attached.
1 with the ceramic package 40. The adhesive 14 may be applied to the substrate paste 12 of the substrate 10, or thick film ink may be applied in the microelectronics industry. The adhesive may be screened onto the substrate by a standard screen printer commonly used for printing.
Apply the current model of No. 4 and apply approximately 0.30 around the board paste 12.
Leaves Ma Shin 16 of g feathers (0,020 In). Margin 16 compensates for misalignment of substrate paste 12 to fabric preform 20 and slight adhesive runout.

好ましくけガラス織雛４１７１！である布プレフオーム
２０Ｊ’ｔ：接 板ペース１２に等しい７５）またはそれより僅かに小さ
く切断する。布プレフォームは、厚さが０、０　、！タ
４ｔー０．０！ｒＯｇｍｍ（／−２ミル）であり、かつ
スレッドカウントが２　！ｒ滓ｍ　（　／　Ｉｎ）当た
り１、（）ｘ３！ｒ−１，０ＸＡＯである。パッケージ
の用立ては、布プレフォーム２０をパンケージのキャビ
ティペース８０上に心合わせすることによって達成され
る。次に、基板１０をノ母ツケージキャビテイ８０中の
布プレフォーム２０上に心合わせし、パッケージにクリ
ップする。接着剤１４が湿っているか粘着性である間に
基板１０をキャビティ４０内に入れる。／１ｎ２当たり
Ｍ−ａ　ｅｂ　　の力を印加するクリップを用いること
ができる。クリップされた組立体を、次に、通常のオー
プン中で、／！ｒＯ℃で７時間硬化させた後、２左Ｑ℃
で３０分間、芳硬化させる。Desirable glass woven doll 4171! Cut the fabric preform 20J't: equal to the contact plate pace 12 (75) or slightly smaller. The fabric preform has a thickness of 0,0,! Ta4t-0.0! rOgmm (/-2 mil) and thread count is 2! 1 per r slag m (/In), ()x3! r-1,0XAO. Package preparation is accomplished by centering the fabric preform 20 over the pancage cavity space 80. The substrate 10 is then centered over the fabric preform 20 in the base cage cavity 80 and clipped to the package. Substrate 10 is placed into cavity 40 while adhesive 14 is wet or tacky. A clip that applies a force of M-a eb per /1n2 can be used. The clipped assembly is then opened during normal opening/! After curing for 7 hours at rO℃, 2 left Q℃
Let it harden for 30 minutes.

ポリイミドは　／４’ーケージ密封工程中に遭遇する高
湿のためのえシ抜きの接着剤である。ポリイミド接着剤
は、過度のボイディング間頌のため、６、３５　Ｆ．ｌ
　（　０−＝２ヤＩｎ）平方より大きい面積のような比
較的大面積の接着には従来用いられなかった。Polyimide is an inert adhesive due to the high humidity encountered during the /4'-cage sealing process. Polyimide adhesives are rated 6,35 F. due to excessive voiding. l
Conventionally, it has not been used for bonding relatively large areas, such as areas larger than (0-=2 YIn) square.

本発明は経済的にかつボイディングがほとんど無く、助
付けおよびパッケージングを行う。The present invention provides economical and nearly voiding aiding and packaging.

現時点に於て、本発明の方法で遭遇するぎイドは、布プ
レフォームの使用のために大きさが非常に小さいので、
熱発生装置からの熱伝導をあまシ妨害しない。At present, the girds encountered in the method of the present invention are very small in size due to the use of fabric preforms;
Do not interfere with heat conduction from heat generating equipment.

接着剤の適用は、調節された沙のイーストのディスペン
シング（ｄｌｓｐｅｎｓｌｎｇ）　　またはドツティン
グ（ｄＯｔｔｌｎｇ）　”ｔたはスタンピング（ｓｔａ
ｍｐｌｎｇ）　　またはスクリーニング（ｓｃｒｅｅｎ
ｉｎｇ）のような適宜の方法で行うことができる。通常
、接着剤は一方の被接合表面へ適用されるが、第２の被
接合表面へも、あるいは布プレフォームだけに、あるい
は接着剤が両表面の少なくとも一方または布にポ用され
る限り、これらの３者のいずれかの侃合わせに適用する
ことも可能である。Application of the adhesive is accomplished by dispensing or dotting the yeast in a controlled manner or by stamping.
mplng) or screening
This can be done by any suitable method such as ing). Typically, the adhesive is applied to one bonded surface, but also to a second bonded surface, or only to the fabric preform, or as long as the adhesive is applied to at least one of both surfaces or to the fabric. It is also possible to apply it to a combination of any of these three types.

ある環壇下では、接着剤層と布プレフォームではなく布
プレフォームと共に接着剤フィルムプレフォームを用い
ることが望ましいことがあシ得る。In some podiums, it may be desirable to use an adhesive film preform with a fabric preform rather than an adhesive layer and a fabric preform.

それでも、透過性布プレフォームは、−一スト接着剤の
使用によって得られるのと同じ荊１益を得るために用い
られる。接着剤フィルムを用いる場合、接着剤フィルム
は通常市販されているようなＪＷ侯物または半乾燥物で
よいが、湿潤物または粘着物であってもよい。この場合
、硬化前には乾燥することができないある祠の接着剤を
フィルム形で５１べ用することができる。しかし、一般
に、かかる非乾燥性（ｎｏｎ−ｄｒｙａｂｌｅ）接着剤
は決して用いられないが、本発明の下では、幾つかの接
合開門への実際的解決を与える。透過性布を非乾燥性接
着剤で含浸させ、接着剤フィルムのペースとして使用す
ることができる。この方法でも含浸していない透過性布
は不可欠であシ、この未含浸透過性布は、接着剤をプレ
フォームとして適用する場合でも、接着剤の使用によっ
て示される接合問題を制御する働きがある。Nevertheless, permeable fabric preforms can be used to obtain the same benefits obtained through the use of one-stroke adhesives. When an adhesive film is used, the adhesive film may be a commercially available JW product or a semi-dry product, but it may also be a wet product or a sticky product. In this case, certain adhesives that cannot be dried before curing can be used in film form. However, although such non-dryable adhesives are generally never used, under the present invention they provide a practical solution to several joint openings. A permeable fabric can be impregnated with a non-drying adhesive and used as a paste for an adhesive film. An unimpregnated permeable fabric is also essential for this method, and this unimpregnated permeable fabric serves to control bonding problems exhibited by the use of adhesives, even when the adhesive is applied as a preform. .

通常、両方の被接合表面の小さい方のおよその大きさお
よび形に切られる？Ａ　ｉｌｌ性布の使用は、本発明に
とって決定的である。布は下記の３つの主すな目的を果
たす。Usually cut to the approximate size and shape of the smaller of both surfaces to be joined? The use of illuminating fabrics is critical to the invention. Cloth serves three main purposes:

ｌ　布ｉｌｌ：、接着剤が広がることと対する抵抗を与
えかつ相め付は力を最初に印加している間または硬化サ
イクル中のランアウトを制御または防止する１せき止め
（ｄａｒｌ−Ｊ−ｎｌ　ｎｇ）　”作用を与え、２　布
は顕著に大きいボイドの形成を彷ぎ、接着剤の表面張力
と毛細管力と高いスレッドカウントとが胡み合わさって
、気体の逃げ道を与え、それによってもしディトがあっ
たとしてもその大きさを布の糸と糸との間の目よりもず
っと小さい大きさに制限することによって接着剤層内に
気体が抽獲されるのを防止し、 ３、　布は接着剤層を補強し、それによって接着剤の接
合強度を増し、この布補強は、よシ薄い接着剤層の使用
を可能にし、−にでかつ終始変わらない電気および熱伝
りＬ度パラメーターを与える。l Fabric: A dam that provides resistance to adhesive spreading and that controls or prevents runout during the initial application of force or during the curing cycle. 2 The fabric wanders through the formation of significantly larger voids, and the surface tension of the adhesive, capillary forces, and high thread count combine to provide an escape route for gases, thereby allowing the formation of significantly larger voids. However, by limiting its size to a size much smaller than the mesh between the threads of the fabric, gas extraction into the adhesive layer is prevented; This fabric reinforcement allows for the use of thinner adhesive layers and provides uniform electrical and thermal conductivity parameters throughout.

本発明で用いた接海剤は、Ｎノ化物充填低７％硬化性ポ
リイミドである、エポキシ　テクノロジー社（Ｅｐｏｘ
ｙ　Ｔｅｃｈｎｏｌｏｇｙ）　　製の１Ｐ乙０−２＃で
あった。この接着剤は、通常のＧ剤よりは蒸発がずっと
遅いのでポリイミド被−ストの流動性がイースト適用中
あまシ変化しない工２キシチクノロノー社（Ｅｔ＞ｏｘ
ｙ　Ｔｅｃｈｎｏｌｏｇｙ）　　ｒＢ４の特殊な専売溶
”＜ｌｌｐ、＋。The seawetting agent used in the present invention is a low 7% curable polyimide filled with N-oxide, manufactured by Epoxy Technology (Epox).
It was a 1P Otsu 0-2# made by Y Technology. This adhesive evaporates much more slowly than regular G agents, so the fluidity of the polyimide coating remains unchanged during yeast application.
y Technology) rB4's special proprietary solution "<llp, +.

シンナーを用いている。I use thinner.

以上、本発明をその好ましい央旌態様に関して示しかつ
説明したが、その中で形および詳７Ｆ’ｌＦＩの没化が
本発明の精神および範囲から娩脱することなく行われ得
ることは当業者（では明らかであろう。While the present invention has been shown and described in terms of its preferred embodiments, those skilled in the art will appreciate that changes in form and detail may be made therein without departing from the spirit and scope of the invention. It should be obvious.

例えは、金、叫合金またはガラスまたはガラス−全組の
４ｆｉみ合わせが接着剤として用いられるが、全仏メツ
シュまたは有孔金属プレフォームがガラスＲ＋ｈの代わ
シに用いられる。For example, a 4fi combination of gold, copper alloy or glass or glass-full set is used as the adhesive, but a French mesh or perforated metal preform is used in place of glass R+h.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は基板の６視平面図であり、第二図は基板とセラ
ミックパツケージの、分解した透視平面図である。 図面番号の説明 １０：基板、　　１２：基板ペース、　　１４：接着剤
、　　１６：マージン、　２ｏ：布バッキング、布プレ
フォーム、　　８ｏ：キャビティー底、４０：セラミッ
クパッケージ。 第１図FIG. 1 is a six-dimensional plan view of the substrate, and FIG. 2 is an exploded perspective plan view of the substrate and the ceramic package. Description of drawing numbers 10: Substrate, 12: Substrate paste, 14: Adhesive, 16: Margin, 2o: Fabric backing, fabric preform, 8o: Cavity bottom, 40: Ceramic package. Figure 1

Claims (2)

【特許請求の範囲】[Claims] （１）物体の表面に接着剤を適用する工程と、該表面に
布プレフオームをはりつける工程と、該表面を第２物体
の表面へ接合する工程と、該両表面を一緒に締めつける
工程と、 両表面を接着させるために十分な温度でかつ十分な時間
該両表面を硬化させる工程とからなる表面の接合方法。(1) applying an adhesive to a surface of an object; attaching a fabric preform to the surface; bonding the surface to a surface of a second object; and clamping the surfaces together. A method for joining surfaces comprising the step of curing said surfaces at a temperature sufficient for a sufficient period of time to bond the surfaces. （２）電子回路を担持するマイクロエレクトロニック基
板をセラミックパツケージへ接合させる方法に於て、 該マイクロエレクトロニック基板の表面に接着剤を適用
する工程と、 該表面に布プレフオームをはりつける工程と該表面を該
セラミックパツケージのキャビティに接合させる工程と
、 該セラミツクパツケージへ該マイクロエレクトロニツク
基板を一緒に締めつける工程と、該マイクロエレクトロ
ニック基板とセラミックパッケージとを硬化させる工程
であつて、該硬化が該マイクロエレクトロニック基板と
セラミックパツケージとを１５０℃に於て１時間加熱す
る工程と２５０℃に於て３０分間、後加熱する工程とか
らなる硬化工程と からなる接合方法。(2) A method of bonding a microelectronic substrate carrying an electronic circuit to a ceramic package, comprising the steps of: applying an adhesive to the surface of the microelectronic substrate; gluing a cloth preform to the surface; and bonding the surface. bonding the microelectronic substrate to a cavity of a ceramic package; clamping the microelectronic substrate together to the ceramic package; and curing the microelectronic substrate and the ceramic package, the curing being a step between the microelectronic substrate and the ceramic package. A bonding method comprising a curing step consisting of a step of heating a ceramic package at 150° C. for 1 hour and a post-heating step of 30 minutes at 250° C.
JP61059083A 1985-08-16 1986-03-17 Bonding method using pasty or non-dry film adhesive Pending JPS6239681A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US76635285A 1985-08-16 1985-08-16
US766352 1985-08-16

Publications (1)

Publication Number Publication Date
JPS6239681A true JPS6239681A (en) 1987-02-20

Family

ID=25076181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61059083A Pending JPS6239681A (en) 1985-08-16 1986-03-17 Bonding method using pasty or non-dry film adhesive

Country Status (4)

Country Link
JP (1) JPS6239681A (en)
DE (1) DE3625596A1 (en)
FR (1) FR2586251A1 (en)
GB (1) GB2179001A (en)

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US3969177A (en) * 1974-06-24 1976-07-13 International Business Machines Corporation Laminating method
GB2028227B (en) * 1978-08-19 1982-09-08 Bostik Ltd Bonding
US4318954A (en) * 1981-02-09 1982-03-09 Boeing Aerospace Company Printed wiring board substrates for ceramic chip carriers
DE3211631A1 (en) * 1982-03-30 1983-10-06 Metzeler Kautschuk SYSTEM AND METHOD FOR CONNECTING SURFACES
US4469737A (en) * 1982-09-30 1984-09-04 Monarch Mirror Door Co., Inc. Process for laminating mirror with protective backing and product resulting therefrom

Also Published As

Publication number Publication date
FR2586251A1 (en) 1987-02-20
GB2179001A (en) 1987-02-25
DE3625596A1 (en) 1987-02-19
GB8606545D0 (en) 1986-04-23

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