JPH04234193A - Method of mounting smd constituent element on substrate - Google Patents

Method of mounting smd constituent element on substrate

Info

Publication number
JPH04234193A
JPH04234193A JP3226800A JP22680091A JPH04234193A JP H04234193 A JPH04234193 A JP H04234193A JP 3226800 A JP3226800 A JP 3226800A JP 22680091 A JP22680091 A JP 22680091A JP H04234193 A JPH04234193 A JP H04234193A
Authority
JP
Japan
Prior art keywords
substrate
adhesive
component
mounting
melt adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3226800A
Other languages
Japanese (ja)
Other versions
JP3219793B2 (en
Inventor
Roland Gerstner
ローラント　ゲルシュトナー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JPH04234193A publication Critical patent/JPH04234193A/en
Application granted granted Critical
Publication of JP3219793B2 publication Critical patent/JP3219793B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Abstract

PURPOSE: To provide an adhesive on a substrate by a screen-print method even in the case of a hybrid-mounting technique, by heating a hot melt adhesive filled with a conductive particle, is a solid at a room temperature, and changes to a liquid state on heating, and providing it on the substrate and heating the substrate when mounting an SMD component. CONSTITUTION: A hot melt adhesive 8 where a conductive particle such as a silver particle is added mainly consisting of polyamide is provided on a substrate 1 by a screen-print method. In this case, the adhesive 8 is preheated into a liquid shape. Also, after a short cooling process, the adhesive 8 still remains viscous. Then, a solder paste 6 is printed on the substrate 1, and solderable capacitor 3, a plastic lead chip carrier 4, and a small outline 5 are mounted and soldered. Then, the substrate 1 is heated in a mounting machine for turning the adhesive 8 into a liquid, and a component that can be adhered such as an IC2 is mounted.

Description

【発明の詳細な説明】[Detailed description of the invention]

【０００１】0001

【産業上の利用分野】本発明は、請求項１の部類による
基板にＳＭＤ（Ｓｕｒｆａｃｅ−Ｍｏｕｎｔｅｄ−Ｄｅ
ｖｉｃｅ）構成要素を実装する方法に関する。FIELD OF INDUSTRIAL APPLICATION The present invention provides a surface-mounted
(vice) component.

【０００２】0002

【従来の技術】構成要素接続端子を導体路と導電結合す
るために、エポキシを主体とする導電性接着剤を使用す
ることは公知である。このために、液状接着剤をスクリ
ン印刷法で設け、構成要素を湿潤接着剤中へ装着し、引
き続き接着剤をたとえば１５０℃で硬化する。しかしこ
れは、接着剤の塗布と構成要素の装着との間で、接着剤
のポットライフに依存する最終時間が経過する必要があ
るという欠点を有する。さらに、導電性接着剤が一度硬
化した構成要素は、場合により温度の支持で、機械的に
剥取ることによってのみ除去することができる。しかし
この場合には、基板および／または隣接構成部品が損傷
する危険がある。BACKGROUND OF THE INVENTION It is known to use electrically conductive adhesives based on epoxy for electrically connecting component terminals to conductor tracks. For this purpose, the liquid adhesive is applied by screen printing, the components are applied into the wet adhesive, and the adhesive is subsequently cured at, for example, 150.degree. However, this has the disadvantage that between the application of the adhesive and the mounting of the component a final time must elapse, which depends on the pot life of the adhesive. Furthermore, once the conductive adhesive has hardened, the component can only be removed by mechanical peeling, optionally with temperature support. However, in this case there is a risk of damage to the substrate and/or adjacent components.

【０００３】この方法は、電子構成部品の一部を接着し
、残りをはんだ付けする混合技術の場合には、基板上に
既にプリントされたはんだペーストが次の導電性接着剤
のスクリン印刷の際によごれるので、もはや使用するこ
とができない。[0003] This method, in the case of a mixed technique in which part of the electronic component is glued and the rest is soldered, requires that the solder paste already printed on the board be used during the subsequent screen printing of the conductive adhesive. It becomes dirty and can no longer be used.

【０００４】さらに、定期刊行物“Ｍｉｃｒｏｅｌｅｃ
ｔｒｏｎｉｃ　　Ｍａｎｕｆａｃｔｕｒｉｎｇ　　ａｎ
ｄ　　Ｔｅｓｔｉｎｇ”（１９８８年６月号）の“Ｔｈ
ｅｒｍａｌＳｔｒｅｓｓ　　Ｒｅｄｕｃｔｉｏｎ　　Ｖ
ｉａ　　Ｔｈｅｒｍｏｐｌａｓｔｉｃ　　Ｄｉｅ−Ａｔ
ｔａｃｈ　　Ａｄｈｅｓｉｖｅ”（熱可塑性のダイアタ
ッチ接着剤による熱応力の減少）から、ＩＣの実装のた
めにホットメルト接着剤を使用することは公知である。 しかし、該接着剤は、液状で塗布されないで、固形で小
板として基板上ではじめて溶融される。しかしこれは、
各ＩＣに対し接着剤を小板として個々に位置定めしなけ
ればならないという欠点を有する。Furthermore, the periodical “Microelec”
tronic manufacturing an
d Testing” (June 1988 issue)
Ermal Stress Reduction V
ia Thermoplastic Die-At
It is known to use hot melt adhesives for the mounting of ICs because of their "tach adhesive" (reduction of thermal stress with thermoplastic die attach adhesives). However, the adhesives are not applied in liquid form. , is first melted on the substrate as a solid platelet.
It has the disadvantage that the adhesive must be individually positioned as a platelet for each IC.

【０００５】マイクロエレクトロニックＩＳＨＭの１９
８６年度国際シンポジウム議事録“Ａ　　Ｒｅｗｏｒｈ
ａｂｌｅ　　Ｈｉｇｈ　　Ｒｅｌｉａｂｉｌｉｔｙ　　
Ｔｈｅｒｍｏｐｌａｓｔｉｃ　　Ｄｉｅ−Ａｔｔａｃｈ
　　Ａｄｈｅｓｉｖｅ”（再生可能な高信頼性の熱可塑
性のダイアタッチ接着剤）（国際シンポジウムに対する
告示）から、ホットメルト接着剤をスクリン印刷法を用
いて塗布するために溶剤に溶解し、溶剤をあとで蒸発さ
せる方法が公知である。19 of Microelectronic ISHM
Proceedings of the 1986 International Symposium “A Reworh”
able High Reliability
Thermoplastic Die-Attach
Adhesive” (Renewable and Highly Reliable Thermoplastic Die Attach Adhesives) (Notification to the International Symposium), hot melt adhesives are dissolved in a solvent for application using screen printing methods, and the solvent is removed later. Methods of evaporation are known.

【０００６】[0006]

【発明が解決しようとする課題】本発明の課題は、公知
技術水準の欠点を回避し、これに比して幾多の利点を有
するＳＭＤ構成要素の実装技術を開発することである。SUMMARY OF THE INVENTION It is an object of the invention to develop an implementation technique for SMD components which avoids the disadvantages of the known state of the art and which has a number of advantages over it.

【０００７】[0007]

【課題を解決するための手段】本発明は、導電性接着剤
を使用して基板上にＳＭＤ構成要素を、接着剤をスクリ
ン印刷法を用いるかまたはスタンプで基板上に設けるこ
とにより実装する方法に関し、接着剤として、導電性粒
子を充填した、室温で固体であり、加熱の際に液体の状
態に変わるホットメルト接着剤を、加熱した状態でまず
最初に基板上に設け、あとでＳＭＤ構成要素を実装する
ためにホットメルト接着剤を有する基板を加熱すること
を特徴とする。SUMMARY OF THE INVENTION The present invention provides a method for mounting SMD components on a substrate using a conductive adhesive by applying the adhesive to the substrate using screen printing or stamping. Regarding the adhesive, a hot-melt adhesive filled with conductive particles, which is solid at room temperature and changes to a liquid state when heated, is first applied to the substrate in the heated state, and later the SMD configuration is applied. It is characterized by heating the substrate with hot melt adhesive to mount the elements.

【０００８】本発明の１実施形によれば、銀粒子を充填
したホットメルト接着剤が使用される。According to one embodiment of the invention, a hot melt adhesive filled with silver particles is used.

【０００９】さらに、ホットメルト接着剤は本発明によ
れば加熱したスタンプを用いるスタンプ法ないしは加熱
したスクリンを用いるスクリン印刷法で設けられる。Furthermore, the hot melt adhesive is applied according to the invention by a stamping method using a heated stamp or a screen printing method using a heated screen.

【００１０】本発明のもう１つの実施形によれば、接着
剤塗布とＳＭＤ構成要素の装着との間の時間内に、基板
上に別のはんだ付け可能の構成要素を実装するために、
このための個所にはんだペーストを設け、その後強固に
はんだ付けする。According to another embodiment of the invention, in order to mount another solderable component on the substrate within the time between adhesive application and mounting of the SMD component,
Apply solder paste to this point and then firmly solder it.

【００１１】請求項１の特徴部に記載された構成要件を
有する本発明による解決手段は、公知技術水準に比して
、混合技術の場合でもホットメルト接着剤はスクリン印
刷法を用いて設けることができるという利点を有する。 接着剤は最初の過程で設けられ、冷却過程後はもはや粘
着性ではないので、次いではんだペーストを問題なしに
プリントすることができる。The solution according to the invention with the features specified in the characterizing part of claim 1 provides that, compared to the state of the art, even in the case of mixing technology the hot melt adhesive can be applied using a screen printing method. It has the advantage of being able to Since the adhesive is applied in the first step and is no longer sticky after the cooling process, the solder paste can then be printed without problems.

【００１２】もう１つの利点は、不良構成要素の交換を
、基板の簡単な加熱によって問題なく行なうことができ
るという事実である。Another advantage is the fact that defective components can be replaced without problems by simple heating of the substrate.

【００１３】接着剤の塗布と構成要素の装着との間に、
冷却して接着剤が凝固した後は導電性粒子は移動しえな
いので、任意に長い時間を設けることができるという可
能性である。Between applying the adhesive and mounting the components,
Since the conductive particles cannot move after cooling and solidifying the adhesive, it is possible to provide an arbitrarily long period of time.

【００１４】さらに、ホットメルト接着剤は、溶剤を有
する接着剤に比して、溶剤の蒸発を内容とする待ち時間
とは異なり、直ちに処理することができるという利点を
有する。最後に、溶剤なしの接着剤は環境汚染防止の点
で著しく有利である。Furthermore, hot melt adhesives have the advantage over adhesives containing solvents that they can be processed immediately, unlike waiting times that involve evaporation of the solvent. Finally, solvent-free adhesives have significant advantages in terms of environmental pollution prevention.

【００１５】[0015]

【実施例】本発明の１実施例は図面に示され、下記に詳
述されている。図は、基板上の種種の構成要素の配置を
示す。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the invention is shown in the drawings and described in detail below. The figure shows the arrangement of the various components on the substrate.

【００１６】図においては、基板１上に種々のＳＭＤ構
成要素、たとえば２個のコンデンサ３、ＰＬＣＣ（プラ
スチックリードチップキャリヤ）４、ＳＯ（スモールア
ウトライン）５およびＩＣ２が実装されている。これら
の構成部品２〜５は、基板１に異なる方法で実装されて
いる。たとえば、構成要素３〜５ははんだペースト６を
用いて固定され、ボンディングワイヤ７により導電接続
されている。この場合、ホットメルト接着剤８は、基板
１の導体路へのＩＣ２のボンディングを形成する。In the figure, various SMD components are mounted on a substrate 1, such as two capacitors 3, a PLCC (plastic lead chip carrier) 4, an SO (small outline) 5 and an IC 2. These components 2 to 5 are mounted on the substrate 1 in different ways. For example, the components 3 to 5 are fixed using solder paste 6 and electrically connected by bonding wires 7. In this case, the hot-melt adhesive 8 forms the bond of the IC 2 to the conductor tracks of the substrate 1.

【００１７】この混合技術においては、まずたとえばポ
リアミドを主体とする、導電性粒子、たとえば銀粒子が
添加されているホットメルト接着剤８が、スクリン印刷
法を用いて基板１上に設けられる。この場合、接着剤は
あらかじめ加熱されており、従って液状である。短かい
冷却過程後、ホットメルト接着剤８はもはや粘着性でな
い。次の過程で、はんだペースト６を基板１上へ導体路
の範囲内にプリントし、はんだ付け可能な構成要素３〜
５を装着し、はんだ付けすることができる。引き続き、
接着可能の構成要素、たとえばＩＣ２を、基板を実装機
械（Ｂｅｓｔｕｅｃｋｕｎｇｓｍａｓｃｈｉｎｅ）中で
加熱してホットメルト接着剤８を液状にし、構成要素を
装着することができるようにすることによって実装する
ことができる。In this mixing technique, first a hot melt adhesive 8, for example based on polyamide, to which conductive particles, for example silver particles, are added is applied onto the substrate 1 using a screen printing method. In this case, the adhesive has been preheated and is therefore in liquid form. After a short cooling process, the hot melt adhesive 8 is no longer sticky. In the next step, a solder paste 6 is printed onto the substrate 1 in the area of the conductor tracks and the solderable components 3 to
5 can be attached and soldered. continuation,
A bondable component, for example an IC 2, can be mounted by heating the substrate in a packaging machine to liquefy the hot-melt adhesive 8 and allow the component to be mounted.

【００１８】場合により修理する場合には、基板を簡単
に加熱することによって同様に容易に除去ないしは交換
できる。この場合、ＩＣではボンデングワイヤを更新し
なければならない。In case of possible repair, the substrate can likewise be easily removed or replaced by simply heating it. In this case, the bonding wires in the IC must be updated.

【００１９】ホットメルト接着剤を用いてＳＭＤ構成要
素を固定するこの方法を用いると、すべての構成要素を
基板に固定し、導体路に導電接続することも可能である
、つまりＳＭＤ構成要素にあるすべての接続部が接着さ
れる。Using this method of fixing SMD components using hot-melt adhesives, it is also possible to fix all components to the substrate and conductively connect them to the conductor tracks, ie to All connections are glued.

【図面の簡単な説明】[Brief explanation of the drawing]

【図１】本発明の１実施例により種々の構成要素が実装
された基板の断面図FIG. 1 is a cross-sectional view of a board on which various components are mounted according to an embodiment of the present invention.

【符号の説明】 １　　　　基板 ２〜５　　　　構成要素 ６　　　　はんだペースト ７　　　　ボンディングワイヤ ８　　　　ホットメルト接着剤[Explanation of symbols] 1　　　　Substrate 2-5 Components 6 Solder paste 7 Bonding wire 8 Hot melt adhesive

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】　　導電性接着剤を使用して基板上にＳＭ
Ｄ構成要素を、接着剤をスクリン印刷法またはスタンプ
を用いて基板に設けることにより実装する方法において
、接着剤として、導電性粒子を充填した、室温で固体で
あり、加熱の際に液体の状態に変わるホットメルト接着
剤を加熱された状態でまず最初に基板（１）上に設け、
あとでＳＭＤ構成要素（２）を実装するために、ホット
メルト接着剤（８）を有する基板（１）を加熱すること
を特徴とする、基板にＳＭＤ構成要素を実装する方法。[Claim 1] SM on the substrate using conductive adhesive.
D A method of implementing the component by applying an adhesive to the substrate using screen printing or stamping, in which the adhesive is a solid at room temperature and liquid state upon heating, filled with conductive particles. First, apply hot melt adhesive to the substrate (1) in a heated state,
A method for mounting SMD components on a substrate, characterized in that the substrate (1) with a hot-melt adhesive (8) is heated in order to later mount the SMD component (2). 【請求項２】　　銀粒子が充填されたホットメルト接着
剤を使用することを特徴とする、請求項１記載の方法。2. Method according to claim 1, characterized in that a hot melt adhesive filled with silver particles is used. 【請求項３】　　ホットメルト接着剤（８）を、加熱さ
れたスタンプを用いるスタンプ法ないしは加熱されたス
クリンを用いるスクリン印刷法で設けることを特徴とす
る、請求項１または２記載の方法。3. Method according to claim 1, characterized in that the hot-melt adhesive (8) is applied by a stamping method using a heated stamp or a screen printing method using a heated screen. 【請求項４】　　接着剤（８）の塗布とＳＭＤ構成要素
の装着との間の時間内に、基板（１）に別のはんだ付け
可能な構成要素（３，４，５）を実装するために、相当
する個所にはんだペースト（６）を塗布し、その後構成
要素（３，４，５）をこの個所に装着し、その後強固に
はんだ付けすることを特徴とする、請求項１から３まで
のいずれか１項記載の方法。4. For mounting another solderable component (3, 4, 5) on the substrate (1) within the time between the application of the adhesive (8) and the mounting of the SMD component. Claims 1 to 3 are characterized in that a solder paste (6) is applied to the corresponding location, after which the component (3, 4, 5) is attached to this location and then firmly soldered. The method according to any one of the above.
JP22680091A 1990-09-08 1991-09-06 Method for mounting SMD components on a substrate Expired - Fee Related JP3219793B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4028556A DE4028556C1 (en) 1990-09-08 1990-09-08
DE4028556.1 1990-09-08

Publications (2)

Publication Number Publication Date
JPH04234193A true JPH04234193A (en) 1992-08-21
JP3219793B2 JP3219793B2 (en) 2001-10-15

Family

ID=6413881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22680091A Expired - Fee Related JP3219793B2 (en) 1990-09-08 1991-09-06 Method for mounting SMD components on a substrate

Country Status (3)

Country Link
US (1) US5220724A (en)
JP (1) JP3219793B2 (en)
DE (1) DE4028556C1 (en)

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US5220724A (en) 1993-06-22
JP3219793B2 (en) 2001-10-15
DE4028556C1 (en) 1992-04-02

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