JPH04151894A - Mounting method on printed wiring boards - Google Patents
Mounting method on printed wiring boardsInfo
- Publication number
- JPH04151894A JPH04151894A JP27662390A JP27662390A JPH04151894A JP H04151894 A JPH04151894 A JP H04151894A JP 27662390 A JP27662390 A JP 27662390A JP 27662390 A JP27662390 A JP 27662390A JP H04151894 A JPH04151894 A JP H04151894A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- electronic component
- solder
- electrode pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 abstract description 19
- 238000007667 floating Methods 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 239000006071 cream Substances 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 5
- 239000007767 bonding agent Substances 0.000 abstract 4
- 238000010276 construction Methods 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 241000272168 Laridae Species 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、微細リードピッチの電子部品の取付法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for mounting electronic components with fine lead pitches.
第５図は従来の電子部品の取付法におけるプリント配線
板と電子部品の上面斜視図、第６図は従来の電子部品の
取付法によるリード接合部の断面拡大図である。図にお
いて、１はプリント配線板、２はプリント配線板１上に
形成された電子部品取付用の電極パッド、３は電子部品
、４は電子部品３のリードである。また第７図はヒート
ブロックを用いた従来の電子部品取付法によるリード接
合部の断面拡大図であり、同図において５はヒートブロ
ックを示す。FIG. 5 is a top perspective view of a printed wiring board and an electronic component in a conventional electronic component mounting method, and FIG. 6 is an enlarged sectional view of a lead joint portion in a conventional electronic component mounting method. In the figure, 1 is a printed wiring board, 2 is an electrode pad for mounting an electronic component formed on the printed wiring board 1, 3 is an electronic component, and 4 is a lead for the electronic component 3. Further, FIG. 7 is an enlarged cross-sectional view of a lead bonding portion according to the conventional electronic component mounting method using a heat block, and in the same figure, 5 indicates the heat block.
次に取付法について説明する。第５図、第６図において
、プリント配線板１上の電子部品取付用電極パッド２に
クリームはんだ印刷あるいははんだコート等を施すこと
によりはんだを供給する。Next, the mounting method will be explained. In FIGS. 5 and 6, solder is supplied by applying cream solder printing or solder coating to electrode pads 2 for mounting electronic components on a printed wiring board 1. In FIG.
次いで電子部品３のリード４とプリント配線板１上の電
極パッド２の位置を合わせ、電子部品３をプリント配線
板１上に装着する。次に、赤外線照射あるいは有機溶剤
の蒸気槽に入れて加熱することにより、電極パッド２上
のはんだを溶融し、電極パッド２と電子部品３のリード
４をはんだ付けする。Next, the leads 4 of the electronic component 3 and the electrode pads 2 on the printed wiring board 1 are aligned, and the electronic component 3 is mounted on the printed wiring board 1. Next, the solder on the electrode pad 2 is melted by infrared irradiation or heating in an organic solvent vapor bath, and the electrode pad 2 and the lead 4 of the electronic component 3 are soldered.
また、第７図においては、プリント配線板１上の電子部
品取付用電極パッド２にはんだコート等を施すことによ
りはんだを供給し、次いで電子部品３のリード４とプリ
ント配線板］上の電極パッド２の位置を合わせ、電子部
品３をプリント配線板１上に装着する。次に、ヒートブ
ロック５を電子部品３のリード４に圧着させてはんだを
溶融し、電極パッド２と電子部品３のリード４とのはん
だ付けを行う。In addition, in FIG. 7, solder is supplied by applying a solder coat etc. to the electrode pad 2 for mounting an electronic component on the printed wiring board 1, and then the lead 4 of the electronic component 3 and the electrode pad on the printed wiring board] 2 and mount the electronic component 3 on the printed wiring board 1. Next, the heat block 5 is pressed onto the lead 4 of the electronic component 3 to melt the solder, and the electrode pad 2 and the lead 4 of the electronic component 3 are soldered.
従来のプリント配線板への電子部品取付法で、赤外線照
射あるいは有機溶剤の蒸気槽に入れ、括はんだ付けを行
う方法の場合、電子部品のリードをプリント配線板のパ
ッドに圧着させる構造になっていないため、電子部品の
リードフォーミング時のリード形状のばらつきによりリ
ード浮きが発生し、はんだ付は不良となっていた。また
ヒートブロックを用いてはんだ付けを行う方法の場合、
ヒートブロックを必要としない他の電子部品と一括はん
だ付けができず、また電子部品のリード列、−列に対し
、−回のヒートブロックによる熱圧着はんだ付けが必要
であり、はんだ付けに時間が掛かるなどの問題点があっ
た。In the conventional method of attaching electronic components to a printed wiring board, which involves bulk soldering by irradiating the electronic components with infrared rays or placing them in an organic solvent vapor bath, the structure is such that the leads of the electronic components are crimped to the pads of the printed wiring board. As a result, lead floating occurred due to variations in lead shape during lead forming of electronic components, resulting in poor soldering. In addition, in the case of the method of soldering using a heat block,
It is not possible to solder all the electronic components together with other electronic components that do not require a heat block, and the lead rows and − rows of electronic components require thermocompression soldering - times using a heat block, which increases the time required for soldering. There were problems such as hanging.
この発明は上記のような問題点を解消するためになされ
たもので、電子部品のり−ドフオーミング時のリード形
状のばらつきによるリード浮きを防止できるとともに、
リード浮き等を生じない他の電子部品と同時に一括はん
だ付けができるプリント配線板への電子部品数イ１法を
得ることを目的とする。This invention was made to solve the above-mentioned problems, and it is possible to prevent lead floating due to variations in lead shape during bonding and forming of electronic components, and
The purpose of the present invention is to obtain a method for increasing the number of electronic components to a printed wiring board, which can be soldered simultaneously with other electronic components without causing floating leads or the like.
この発明に係るプリント配線板への電子部品取付法は、
プリント配線板の電子部品取付用電極パッド部の近傍に
収縮性接着材を塗布し、電子部品のリードを上記収縮性
接着材で固定した後、−括はんだ付けを行うものである
。The method for attaching electronic components to a printed wiring board according to the present invention is as follows:
A shrinkable adhesive is applied to the vicinity of the electrode pad portion for mounting electronic components on the printed wiring board, and after the leads of the electronic components are fixed with the shrinkable adhesive, -bracket soldering is performed.
この発明におけるプリント配線板への電子部品取付法は
、プリント配線板の電子部品取付用の電極パッド部近傍
に塗布された収縮性接着材が収縮。In the method of attaching electronic components to a printed wiring board according to the present invention, a shrinkable adhesive applied near an electrode pad portion of the printed wiring board for attaching electronic components contracts.
硬化するため、電子部品のリードがプリント配線板の電
極パッドに圧着され、リード浮きを防止する。As it hardens, the leads of electronic components are crimped to the electrode pads of the printed wiring board, preventing the leads from floating.
以下、この発明の一実施例を図について説明する。上記
第５図５第６図に対応する第１図、第２図において、１
〜４は上記従来例のものと同一部分を示しており、６は
プリント配線板１上の電極パッド２の近傍に塗布され、
電子部品３のリード４を固定するための収縮性接着材で
ある。An embodiment of the present invention will be described below with reference to the drawings. In Figures 1 and 2, which correspond to Figures 5 and 6 above, 1
4 indicates the same parts as those of the conventional example, 6 is applied near the electrode pad 2 on the printed wiring board 1,
This is a shrinkable adhesive for fixing the leads 4 of the electronic component 3.
次に取付法について説明する。第１図、第２図において
、プリント配線板１上の電子部品取付用電極パッド２に
クリームはんだ印刷あるいははんだコート等を施すこと
によりはんだを供給する。Next, the mounting method will be explained. In FIGS. 1 and 2, solder is supplied by applying cream solder printing or solder coating to electrode pads 2 for mounting electronic components on a printed wiring board 1. In FIGS.
次いでプリント配線板１上の電極パッド２の近傍に収縮
性接着材６を印刷あるいは接着材塗布装置（デイスペン
サー）等により塗布する。次いで、電子部品３のリード
４とプリント配線板１上の電極パッド２の位置を合わせ
、電子部品３をプリント配線板１上に装着する。次いで
プリント配線板１に塗布された収縮性接着材６を収縮、
硬化させ、電子部品３のリード４をプリント配線板１上
の電極パッド２に圧着固定する。Next, a shrinkable adhesive 6 is applied near the electrode pads 2 on the printed wiring board 1 by printing or using an adhesive application device (dispenser) or the like. Next, the leads 4 of the electronic component 3 and the electrode pads 2 on the printed wiring board 1 are aligned, and the electronic component 3 is mounted on the printed wiring board 1. Next, the shrinkable adhesive 6 applied to the printed wiring board 1 is shrunk,
After curing, the leads 4 of the electronic component 3 are crimped and fixed to the electrode pads 2 on the printed wiring board 1.
次に、赤外線照射あるいは有機溶剤の蒸気槽に入れ、加
熱することにより、電極パッド２上のはんだを溶融し、
電極パッド２と電子部品３のリード４を円）
（４ン
を−括ではんだ付けを行う。Next, the solder on the electrode pad 2 is melted by infrared irradiation or by heating it in an organic solvent steam bath.
Solder the electrode pad 2 and the lead 4 of the electronic component 3 in a circle.
なお上記実施例では、電子部品３のリード４がガルウィ
ング型のものを示したが、第３図に示すように、リード
４の形状が２段型であってもよく、この場合においては
、収縮性接着材６の塗布部におけるプリント配線板１と
電子部品３のリード４との間隔が広いので、収縮性接着
材６の塗布した後、電子部品３をプリント配線板ｌに装
着する際、収縮性接着材６の電極パッド２へのはみ出し
を防止できる。In the above embodiment, the lead 4 of the electronic component 3 is shown as a gull wing type, but as shown in FIG. Since the distance between the printed wiring board 1 and the leads 4 of the electronic components 3 in the area where the adhesive 6 is applied is wide, when the electronic components 3 are mounted on the printed wiring board 1 after the adhesive 6 has been applied, the shrinkage may occur. The adhesive material 6 can be prevented from protruding onto the electrode pad 2.
また上記実施例では、電子部品３がＱＦＰタイプのもの
を示したが、第４図に示すように、電子部品３がテープ
キャリアパッケージでも、上記実施例と同様の効果を奏
する。Further, in the above embodiment, the electronic component 3 is of the QFP type, but as shown in FIG. 4, even if the electronic component 3 is a tape carrier package, the same effects as in the above embodiment can be obtained.
以上のようにこの発明によれば、電極パッド部の近傍に
設けた収縮性接着材により、電子部品のリードとプリン
ト配線板の電極パッドを圧着、固定するようにしなので
、電子部品のリード浮きを防止でき、また、−括はんだ
付けができるので、製造期間を短縮できるという効果が
ある。As described above, according to the present invention, the lead of the electronic component and the electrode pad of the printed wiring board are crimped and fixed using the shrinkable adhesive provided near the electrode pad portion, thereby preventing the lead of the electronic component from floating. Since it is possible to prevent this, and since it is possible to perform negative soldering, there is an effect that the manufacturing period can be shortened.
第１図、第２図はこの発明の一実施例によるプリント配
線板への電子部品取付法を示す上面斜視図とそのリード
接合部の断面拡大図、第３図はこの発明の他の実施例を
示すリード接合部の断面拡大図、第４図はさらにこの発
明の他の実施例を示す上面斜視図、第５図、第６図は従
来のプリント配線板への電子部品取付法を示す上面斜視
図とそのリード接合部の断面拡大図、第７図はヒートブ
ロックを用いた場合の従来のプリント配線板への電子部
品取付法によるリード接合部の断面拡大図である。
図中、１はプリント配線板、２は電極パッド、３は電子
部品、４はリード、６は収縮性接着材である。
なお、図中同一符号は同−又は相当部分を示す。1 and 2 are a top perspective view and an enlarged cross-sectional view of the lead joint portion showing a method of attaching electronic components to a printed wiring board according to one embodiment of the present invention, and FIG. 3 is another embodiment of the present invention. FIG. 4 is a top perspective view showing another embodiment of the present invention, and FIGS. 5 and 6 are top views showing a conventional method of attaching electronic components to a printed wiring board. A perspective view and an enlarged cross-sectional view of the lead joint portion thereof, and FIG. 7 is an enlarged cross-sectional view of the lead joint portion according to the conventional method of attaching electronic components to a printed wiring board using a heat block. In the figure, 1 is a printed wiring board, 2 is an electrode pad, 3 is an electronic component, 4 is a lead, and 6 is a shrinkable adhesive. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
塗布し、電子部品のリードを上記収縮性接着材で固定し
た後、はんだ付けを行うことを特徴とするプリント配線
板への電子部品取付法。A method for attaching electronic components to a printed wiring board, which comprises applying a shrinkable adhesive near the electrode pads of the printed wiring board, fixing the leads of the electronic components with the shrinkable adhesive, and then soldering. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27662390A JPH04151894A (en) | 1990-10-15 | 1990-10-15 | Mounting method on printed wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27662390A JPH04151894A (en) | 1990-10-15 | 1990-10-15 | Mounting method on printed wiring boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04151894A true JPH04151894A (en) | 1992-05-25 |
Family
ID=17572020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27662390A Pending JPH04151894A (en) | 1990-10-15 | 1990-10-15 | Mounting method on printed wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04151894A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056113A (en) * | 2020-07-31 | 2021-06-29 | 广州立景创新科技有限公司 | Method for manufacturing electronic component module |
-
1990
- 1990-10-15 JP JP27662390A patent/JPH04151894A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056113A (en) * | 2020-07-31 | 2021-06-29 | 广州立景创新科技有限公司 | Method for manufacturing electronic component module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH065760A (en) | Package lead for surface mountint type semiconductor device | |
| JPH04234193A (en) | Method of mounting smd constituent element on substrate | |
| JPH04151894A (en) | Mounting method on printed wiring boards | |
| JPS617692A (en) | Method of securing conductor pin and printed circuit board secured with conductor pin | |
| JP3306981B2 (en) | Method for applying adhesive to lead frame for semiconductor device | |
| WO1987004008A1 (en) | Lead finishing for a surface mount package | |
| JPH0350853A (en) | Solder coating of semiconductor device | |
| JPS6364916B2 (en) | ||
| JPS6288398A (en) | Soldering of flat package part | |
| JP2501668Y2 (en) | Surface mount electrical components | |
| JPS6030195A (en) | Method of connecting lead | |
| JP3629600B2 (en) | Manufacturing method of electronic component mounting board | |
| JPS636898A (en) | Method of soldering leadless electronic parts | |
| JPH0382095A (en) | Connection of semiconductor ic | |
| JPH05347473A (en) | Wiring substrate | |
| JPH0215697A (en) | Surface packaging method | |
| JPH09129667A (en) | Method of forming solder bump | |
| JPH0336788A (en) | Surface mounting type electronic component and mounting method thereof | |
| JPH0722742A (en) | Soldering method for printed wiring board | |
| JPH01220801A (en) | Chip-type electric element | |
| JPS63211655A (en) | Solder-buried resist sheet | |
| JPH01171294A (en) | Soldering method | |
| JPH01233062A (en) | Method for soldering surface packaging part | |
| JPH06310841A (en) | Printed-wiring board with pad part fit for mounting minipower package and mounting method thereof | |
| JPS60211891A (en) | Method of assembling both-side printed circuit board |