JP2952814B2 - Connection unit between electronic components and board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection unit between an electronic component and a substrate.

[0002]

2. Description of the Related Art Conventionally, as this type of connection unit,
An electronic component including at least one electrode having a protrusion (bump) formed under application of a wire bonding technique; an electrically insulating substrate including at least one terminal facing the protrusion; A conductive bonding material, such as solder, for electrically connecting terminals, and an electrically insulating sealant that has penetrated into the gap between the electronic component and the substrate by capillary action to bond the electronic component and the substrate. What is provided is known.

[0003] The sealant electrically insulates the projections of the electrodes, the terminals, and the connection portion made of a conductive bonding material from the surroundings, and cools the wire between the electronic component and the substrate during the cooling process after the operation of the electronic component. It is used to reduce thermal stress acting on the connection due to the difference in expansion rate.

[0004]

However, in the conventional connection unit, the distance between the electronic component and the substrate is extremely small, and the volume of the sealant is very small. When a thermal stress acts on the connecting portion due to a difference in linear expansion coefficient between the component and the board, the thermal stress cannot be sufficiently reduced, and as a result, the connecting portion may be broken. There's a problem.

[0005]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a connecting unit capable of sufficiently reducing a thermal stress acting on the connecting portion.

[0006] In order to achieve the above object, according to the present invention,
An electronic component including at least one electrode having a protrusion; a substrate including at least one terminal facing the protrusion; a conductive bonding material that electrically connects the protrusion and the terminal; An electrically insulating sealing agent that surrounds the conductive bonding material and joins the electronic component and the substrate; and a diameter a of the protrusion, and a thickness of the sealing agent between the electronic component and the substrate. The relationship with b is set to b> a, the distance c between the tip of the projection and the terminal is set to c> 0.02 mm, and the conductive bonding material and sealing are set.
The agent is solidified at the time of the joining, and the hardening of the conductive joining material is performed.
A connection unit having a hardness lower than the hardness of the sealant is provided.

In the connection unit having the above structure, the volume of the sealant existing between the electronic component and the substrate is large, and the space c is wide. Thermal stress acting on the connecting portion due to the difference in expansion rate can be sufficiently reduced.

This is because, due to the difference in linear expansion coefficient, a lateral shearing force acts on the sealant between the electronic component and the substrate so as to be substantially parallel to the facing surface of the electronic component and the substrate. When the volume of the sealant is large as described above, the shearing force per unit volume in the sealant can be reduced,
Also, because the interval c is wide, the connecting portion sufficiently withstands the shearing force. Thereby, the connection unit has excellent thermal shock resistance. The above sealing agent and
After the conductive bonding material is solidified, the hardness of the conductive bonding material is
Since the hardness is lower than that of the sealant, the thermal stress is reduced,
To prevent deformation and breakage of each connection due to vibration
It is valid.

[0009]

1 and 2, a connection unit 1 includes an electronic component 2 and a heat-resistant and electrically insulating substrate 3.
And Examples of the electronic component 2 include FCB (flip chip bonding), which is a semiconductor bare chip including an unsealed semiconductor, CSP (chip size package), which is a high-density package, and BGA ( ball grid array). The electronic component 2 includes at least one electrode 4 on the surface facing the substrate 3, in the illustrated example, a plurality of electrodes 4, and the substrate 3 has at least one electrode 4 on the surface facing the electronic component 2, and the same number as the number of the electrodes 4 in the illustrated example. Are provided.

The electronic component 2 and the substrate 3 are joined via an electrically insulating sealant 6 solidified under heating and pressurization, and each of the electronic components 2 The electrode 4 faces each terminal 5 of the substrate 3. Each of the electrodes 4 has a protrusion (bump) 8 made of gold. The protrusion 8 is formed by applying a wire bonding technique and has a constant diameter a. The inside of each connection hole 7 is filled with a conductive bonding material 9 solidified under heating and pressurization, and thus each conductive bonding material 9 is surrounded by the sealant 6. In this manner, the projection 8 of each electrode 4 and each terminal 5 are electrically connected via the conductive bonding material 9, and the electrode 4, the projection 8, the terminal 5, and the conductive bonding material 9 are 1
0.

The relationship between the diameter a of the projection 8 of each electrode 4 and the thickness b of the sealant 6 between the electronic component 2 and the substrate 3 is set to b> a, and the tip of the projection 8 and the terminal 5 The interval c between them is set to be c> 0.02 mm.

With this configuration, in the connection unit 1, the sealing agent 6 existing between the electronic component 2 and the substrate 3
Is large and the space is large, so that in the cooling process after the operation of the electronic component 2, the thermal stress acting on the connecting portion 10 due to the difference in linear expansion coefficient between the electronic component 2 and the substrate 3 is sufficiently reduced. Can be eased.

This is because the sealing agent 6 between the electronic component 2 and the substrate 3 has a shearing force in the lateral direction so as to be substantially parallel to the facing surfaces of the electronic component 2 and the substrate 3 due to the difference in linear expansion coefficient. However, when the volume of the sealant 6 is large as described above, the shearing force per unit volume of the sealant 6 can be reduced, and since the interval c is wide, the connection portion 10 sufficiently withstands the shearing force. Thereby, the connection unit 1 has excellent thermal shock resistance.

In manufacturing the connection unit 1, the following mounting method is adopted.

As shown in FIG. 3, a thermosetting and electrically insulating film-like sealant 6 is prepared. This sealant 6
The electronic component 2 has a plurality of connection holes 7 corresponding to the plurality of electrodes 4.

(I) As shown in FIG. 4, a substrate 3 provided with a plurality of terminals 5 corresponding to a plurality of electrodes 4 of an electronic component 2 is placed on a heating plate 11 and heated to a predetermined temperature. Above 3, the film-like sealant 6 is arranged such that each joint hole 7 thereof matches each terminal 5.

(Ii) As shown in FIG. 5, the sealing agent 6 is superimposed on the substrate 3 and then the sealing agent 6 is pressed against the substrate 3 with a predetermined pressure for a predetermined time to make close contact with the substrate 3 by temporary bonding.

(Iii) As shown in FIG. 6, using a conductive paste 12 containing a thermosetting conductive bonding material 9,
Screen printing is performed on the surface of the sealant 6, and the conductive paste 12 is filled in each connection hole 7. At this time, the surface of each conductive paste 12 is made slightly higher than the edge of each connection hole 7 in consideration of the amount of contraction due to solidification of the conductive bonding material 9.

(Iv) As shown in FIG. 7, the temperature of the substrate 3 is increased, and then the electronic component 2 is arranged above the sealant 6 so that each electrode 4 of the electronic component 2 matches each connection hole 7.

(V) As shown in FIG. 8, the projections 8 of each electrode 4 of the electronic component 2 are stabbed into the conductive paste 12 in each connection hole 7, and the electronic component 2 is Overlap. In this case, since the solidification and contraction of the conductive bonding material 9 is progressing with the temperature rise of the substrate 3, the conductive bonding material 9
From the connection hole 7 is avoided. Next, the electronic component 2 is pressed against the substrate 3 at a predetermined pressure for a predetermined time, and the sealing agent 6 and the conductive bonding material 9 are solidified under heat and pressure.
The electronic component 2 is joined to the substrate 3.

(Vi) In order to completely solidify the sealant 6,
Put the joint between the electronic component 2 and the substrate 3 in an oven,
The connection unit 1 is obtained by maintaining the temperature at a predetermined temperature under the atmospheric pressure for a predetermined time, and then cooling in an oven.

In the above method, the projection 8 of each electrode 4
And the connection between each terminal 5 and the sealant 6 to each connection portion 10
And solidification are performed in the same process, so that the electronic component 2
And the mounting cost can be reduced.

A composite plate is used as the substrate 3, and the composite plate is made of a glass cloth as a reinforcing material and a bismaleimide triazine resin as a matrix.

The film-shaped sealant 6 is configured Ri by novolac epoxy resins containing a silica-based filler. This resin is solid at normal temperature, but when heated, goes through the steps of softening, melting and solidifying in sequence. The gelation time of this resin is 120 seconds at 150 ° C., but it takes about 20 minutes at 150 ° C. to completely solidify the resin.

The conductive bonding material 9 is composed of 75% by weight of amorphous silver powder smaller than 300 mesh and 25% by weight of an aliphatic hydrocarbon type epoxy resin. Conductive paste 12
Is composed of a conductive bonding material 9 and a mixed solvent of 45.8% by volume, and the mixed solvent is a mixture of 70% by weight of xylene and 30% by weight of ethanol.

The aliphatic hydrocarbon type epoxy resin is liquid at room temperature, but solidifies under heating. The gel time of this resin is 90 to 100 seconds at 150 ° C., which is shorter than that of the novolak type epoxy resin. At that time, the mixed solvent is 15
Evaporates almost completely at 0 ° C. in about 60 seconds.

When the gelation time of the conductive bonding material 9 is shorter than the gelation time of the sealant 6 as described above, the conductive bonding material 9 that is formed when the sealant 6 gels first may be formed. It is possible to prevent the air bubbles from being trapped in the electrodes 4, thereby making it possible to avoid a poor connection between the projection 8 of each electrode 4 and each terminal 5.

After solidification, the conductive bonding material 9 has flexibility, and its hardness is lower than the hardness of the sealant 6.
This is effective in relieving the thermal stress and preventing deformation and breakage of each connection portion 10 due to vibration.

The formation of the connection holes 7 of the film-shaped sealant 6 may be performed after the film-shaped sealant 6 without holes is brought into close contact with the substrate 3.

From this viewpoint, as a constituent material of the sealing agent 6, for example, a liquid epoxy acrylate resin containing a polyfunctional acrylate monomer, a liquid polyester acrylate resin containing a polyfunctional acrylate monomer, or the like, which is an ultraviolet curable resin, is used. You can also.

[0031] Between the film-like sealant 6 and the electronic component 2 if necessary, to interpose a high adhesive strength liquid epoxy resins is a thermosetting adhesive. As the conductive bonding material 9, a solder powder can be used.

Hereinafter, a specific example of manufacturing the connection unit 1 will be described.

[Production Example 1] (i) Transfer molding was performed using a novolak-type epoxy resin containing a silica-based filler, and was 11 mm long and 1 mm wide.
A film-like sealant 6 having a thickness of 1 mm and a thickness of 0.2 mm was formed.

(Ii) As shown in FIG.
For example, corresponding to 32 electrodes 4 and the same number of terminals 5 of the substrate 3 having the above structure, 32 connection holes 7 having a diameter d of d = 0.14 mm were formed in the sealant 6 by an excimer laser.

(Iii) As shown in FIG. 4, the substrate 3 is placed on a heating plate 11 and heated to 120 ° C. Then, a sealant 6 is placed above the substrate 3 and each connection hole 7 is connected to each terminal 5. Matched and placed.

(Iv) As shown in FIG. 5, the sealant 6 is overlaid on the substrate 3 and then the sealant 6 is applied to the substrate 3 by 80 g.
It was pressed at a pressure of f / cm ² for 10 seconds and adhered by temporary bonding.

(V) As shown in FIG. 6, using a conductive paste (mixed solvent amount A = 45.8% by volume) 12 of the above composition and a # 200 mesh screen (emulsion thickness 10 μm), sealing agent 6 The surface was subjected to screen printing, and the conductive paste 12 was filled in each connection hole 7. In this case, the surface of the conductive paste 12 is more than the edge of the connection hole 7 by 0.1.
mm higher. That is, the depth e of the connection hole 7 is e = 0.2 mm, the thickness f of the terminal 5 is f = 0.018 mm, and the height g of the conductive paste 12 is g = 0.192 mm.

(Vi) As shown in FIG. 7, the temperature of the substrate 3 is raised to 150 ° C., and then the electronic component 2 is placed above the sealant 6 with its electrodes 4 aligned with the connection holes 7. did.

(Vii) As shown in FIG. 2, the diameter a of the projection 8 of each electrode 4 in the electronic component 2 is a = 0.14 mm,
The protrusion length h (including the thickness of the electrode 4; the same applies hereinafter) h = h
0.111 mm. As shown in FIG. 8, each projection 8 is stabbed into the conductive paste 12 in each connection hole 7, the electronic component 2 is overlaid on the sealant 6, and then the electronic component 2 is
Was pressed against the substrate 3 at a pressure of 200 gf / cm ² for 20 seconds to solidify the sealant 6 and the conductive bonding material 9 under heat and pressure, thereby bonding the electronic component 2 to the substrate 3.

(Viii) In order to completely solidify the sealant 6, the joined body of the electronic component 2 and the substrate 3 is placed in an oven, kept at 150 ° C. under atmospheric pressure for 20 minutes, and then placed in the oven. And cooled to obtain a connection unit 1 (Example).

In this connection unit 1, the electronic component 2
Has a linear expansion coefficient of 2.7 × 10 ⁻⁶ / ° C., while the linear expansion coefficient of the substrate 3 is 1.4 × 10 ⁻⁵ / ° C. As shown in FIG. 2, the thickness b of the sealing agent 6 between the electronic component 2 and the substrate 3 is b = 0.166 mm, the distance c between the tip of the projection 8 and the terminal 5 is c = 0.037 mm, The hardness (Shore hardness) of the blocking agent 6 was 91 HSD, and the hardness (Shore hardness) of the conductive bonding material 9 was 80 HSD. As described above, the diameter d of the connection hole 7 is d = 0.14 mm, the diameter a of the projection 8 is a = 0.14 mm, the projection length h is h = 0.111 mm, and the thickness of the terminal 5 is f is 0.018 mm.

For comparison, in the conductive paste 12,
By changing the mixed solvent amount A and performing the above-mentioned steps (i) to (viii), a plurality of connection units 1 were obtained.

For these connection units 1, each electrode 4
When the contact state between the projection 8 and each conductive bonding material 9 was examined, the results shown in Table 1 were obtained. Table 1 lists the connection unit 1 (Example) as Example 3.

[0044]

[Table 1]

When the dimensions of the projection 8 and the connection hole 7 and the height of the conductive paste 12 after charging the connection hole 7 are set as described above, as shown in Table 1, Examples 2 to 4
As described above, the mixed solvent amount A of the conductive paste 12 is 2
When 9.2% by volume ≦ A ≦ 58.3% by volume, the contact state between the protruding portion 8 of the electrode 4 and the conductive bonding material 9 is improved, and the conductive bonding material 9 is eroded from the connection hole 7. Can be prevented. In this case, the mixed solvent amount A is preferably 30% by volume ≦ A ≦ 55% by volume.

In the case of Example 1, since the amount of the conductive bonding material 9 is too small, a gap is generated between the projection 8 and the conductive bonding material 9 due to the solidification and shrinkage. In the case of Example 5, since the amount of the conductive bonding material 9 is too large, the conductive bonding material 9 may erode from the connection hole 7 and short-circuit between the two adjacent electrodes 4.

In Examples 2 and 4 of Table 1, the thickness b, the interval c and the hardness (HSD) are the same as those of Example 3.

Next, in the same manner as described above, the thickness b of the sealant 6 between the electronic component 2 and the substrate 3, the length h of the protrusion 8, the distance c between the tip of the protrusion 8 and the terminal 5, and Various connection units 1 having different hardnesses of the sealing agent 6 and the conductive bonding material 9 were obtained. The thickness b of the sealant 6 and the interval c are changed by changing the pressure in the step (vii), and the change in the projection length h of the projection 8 depends on the formation condition of the projection 8. The hardness of the sealant 6 and the conductive bonding material 9 was further changed by changing the amount of the curing agent.

Next, a thermal shock test was performed on each connection unit 1. The test conditions were such that each connection unit 1 was -40.
5 minutes in silicone oil at 120 ° C, then 120 ° C
Of silicone oil for 5 minutes, and this was repeated as one cycle.

Table 2 shows the thickness b of the sealant 6, the diameter a of the projection 8, the distance c between the tip of the projection 8 and the terminal 5, the projection length h of the projection 8, the terminal h in each connection unit 1. 5, the hardness (HSD) of the sealant 6 and the conductive bonding material 9;
Also shows the evaluation in the thermal shock test. In this evaluation, the mark “○” indicates that no abnormality occurred in the appearance of the sealant 6 at 5000 cycles, and the mark “△” indicates that a part of the sealant 6 was cracked at 5000 cycles. And "x" indicates that the sealant 6 had cracks in 4000 cycles. In Table 2,
Example 3 in Table 1 is listed as Example 1.

[0051]

[Table 2]

In Table 2, the thickness b of the sealant 6 is set to b> a, and the distance between the tip of the projection 8 and the terminal 5 is determined based on the diameter a of the projection 8 which is a constant value. c to c>
When it is set to 0.02 mm, excellent durability is exhibited even in the severe thermal shock test as described above as in Examples 1, 2, 6, and 7. This is because the sealing agent 6 has a large volume and the space c is large, so that the thermal stress caused by a difference in linear expansion coefficient between the electronic component 2 and the substrate 3 can be sufficiently reduced. In this case, Examples 1, 2, 6, and 7 also satisfy the condition that the hardness of the conductive bonding material is lower than that of the sealant.

In Examples 3 and 5, the relationship between the diameter a and the thickness b is b <a, and in Example 4, the distance c is c <0.02 mm. Low impact.

In Example 8, there is no problem with the thickness b of the sealant 6 and the distance c, but since the hardness of the conductive bonding material 9 is larger than that of the sealant 6, , The durability is slightly lower.

[Production Example 2] (i) Transfer molding was performed using a novolak-type epoxy resin containing a silica-based filler, and was 11 mm long and 1 mm wide.
A film-like sealant 6 having a thickness of 1 mm and a thickness of 0.2 mm was formed.

(Ii) As shown in FIG. 9A, the substrate 3 is placed on the heating plate 11 and heated to 120 ° C. Then, the sealing agent 6 is entirely placed on the substrate 3 by the sealing agent 6. Are arranged such that the terminal 5 is covered.

(Iii) As shown in FIG. 9 (b), the sealing agent 6 is superimposed on the substrate 3, and then the sealing agent 6 is pressed against the substrate 3 at a pressure of 80 gf / cm ² for 10 seconds to temporarily adhere the same. Then, corresponding to the 32 electrodes 4 of the electronic component 2 and the same number of terminals 5 of the substrate 3 having the above structure, 32 diameters d of the sealant 6 are changed to d = d by an excimer laser.
A connection hole 7 of 0.14 mm was formed.

Thereafter, the steps (v) to (viii) of Production Example 1 (see FIGS. 6 to 8) were sequentially performed to obtain a connection unit 1.

[Manufacturing Example 3] (i) As shown in FIG.
Is placed on the heating plate 11, and then screen printing is performed on the surface of the substrate 3 using a liquid epoxy acrylate resin containing a polyfunctional acrylate monomer, which is an ultraviolet curable resin, thereby forming a film-like seal. A stopper 6 is formed and all the terminals 5 are formed by the sealant 6.
Was coated. The dimensions of this sealant 6 are 11 mm in length and 11 m in width.
m, thickness 0.2 mm.

(Ii) As shown in FIG. 10B, each corresponding portion of the sealant 6 is formed to form each connection hole 7 in a portion of the sealant 6 corresponding to each terminal 5 on the substrate 3. Irradiate the remaining part with ultraviolet rays, and solidify the remaining part,
Thereafter, the unsolidified portion was removed by washing. The diameter d of each connection hole 7 thus obtained was d = 0.14 mm.

(Iii) As shown in FIG. 10 (c), a conductive paste (mixed solvent amount A = 45.8% by volume) 12 of the above composition and a # 200 mesh screen (milk material thickness 1)
(0 μm), screen printing was performed on the surface of the sealant 6, and the conductive paste 12 was filled in each connection hole 7.
In this case, the surface of the conductive paste 12 is higher than the edge of the connection hole 7 by 0.1 mm. That is, the height g of the conductive paste 12 is g = 0.192 mm as in the case of Production Example 1.

(Iv) As shown in FIG. 10 (d), the substrate 3 is heated to 150 ° C., the electronic component 2 is placed above the sealant 6, and each electrode 4 is aligned with each connection hole 7. Placed.

(V) As shown in FIG. 2, the diameter a of the projection 8 of each electrode 4 in the electronic component 2 is a = 0.14 mm, and the projection length h is h = 0.111 mm. As shown in FIG. 10E, each projection 8 is stabbed into the conductive paste 12 in each connection hole 7, the electronic component 2 is superimposed on the sealant 6, and then the electronic component 2 is mounted on the substrate. 170gf / cm ^{2 for} 3
Pressure for about 30 seconds to solidify the sealant 6 and the conductive bonding material 9 under heat and pressure, and to attach the electronic component 2 to the substrate 3.
Joined.

(Vi) In order to completely solidify the sealant 6,
Put the joint between the electronic component 2 and the substrate 3 in an oven,
It was kept at 150 ° C. under atmospheric pressure for 20 minutes, and then cooled in an oven to obtain a connection unit 1. Also in the connection unit 1, the hardness of the conductive bonding material 9 after solidification is lower than the hardness of the sealant 6.

[Production Example 4] Depending on the material of the sealant 6,
There are cases where the electronic component 2 cannot be joined to the substrate 3. In such a case, the following mounting method is performed.

(I) As shown in FIG. 11A, the substrate 3 having 32 terminals 5 on the surface is placed on the heating plate 11, and then the surface of the substrate 3 is made of an ultraviolet curable resin.
Screen printing is performed using a liquid polyester acrylate resin containing a polyfunctional acrylate monomer, thereby forming a film-like sealing agent 6 and forming the film-forming sealing agent 6.
Covered all the terminals 5. The dimensions of the sealant 6 are 11 mm in length, 11 mm in width, and 0.2 mm in thickness.

(Ii) As shown in FIG. 11B, each corresponding portion of the sealing agent 6 is formed to form each connection hole 7 in a portion of the sealing agent 6 corresponding to each terminal 5 on the substrate 3. Irradiate the remaining part with ultraviolet rays, and solidify the remaining part,
Thereafter, the unsolidified portion was removed by washing. The diameter d of each connection hole 7 thus obtained was d = 0.14 mm.

(Iii) As shown in FIG. 11C, the conductive paste 12 having the above composition (mixed solvent amount A = 45.8% by volume) and a # 200 mesh screen (emulsion thickness 1
(0 μm), screen printing was performed on the surface of the sealant 6, and the conductive paste 12 was filled in each connection hole 7.
In this case, the surface of the conductive paste 12 is higher than the edge of the connection hole 7 by 0.1 mm. That is, the height g of the conductive paste 12 is g = 0.192 mm as in the case of Production Example 1.

(Iv) As shown in FIG. 11D, a low-viscosity liquid epoxy resin 14 having a low viscosity of 50 cP is prepared in a container 13, and the surface of the electronic component 2 having the electrodes 4 is provided on the resin 14. The resin 14 was applied very thinly on the surface by contact.

(V) As shown in FIG.
Is heated to 150 ° C., and then the electronic component 2
Were arranged so that each electrode 4 matched each connection hole 7.

(Vi) As shown in FIG. 2, the diameter a of the projection 8 of each electrode 4 in the electronic component 2 is a = 0.14 mm,
The protrusion length h is h = 0.111 mm. As shown in FIG. 11 (f), each projection 8 was stabbed into the conductive paste 12 in each connection hole 7, and the electronic component 2 was overlaid on the sealant 6. While each projection 8 is stabbed into the conductive paste 12, the high adhesive epoxy resin 14 attached to the surface of the projection 8 is squeezed by the conductive paste 12 and removed from the surface of the projection 8. . Next, the electronic component 2 is attached to the substrate 3
The electronic component 2 was bonded to the substrate 3 by pressing the substrate at a pressure of 100 gf / cm ² for about 90 seconds to solidify the sealant 6, the conductive bonding material 9 and the high-adhesion liquid epoxy resin 14 under heat and pressure. .

(Vii) In order to completely solidify the sealant 6,
Put the joint between the electronic component 2 and the substrate 3 in an oven,
It was kept at 150 ° C. under atmospheric pressure for 60 minutes, and then cooled in an oven to obtain a connection unit 1.

The liquid epoxy resin 14 having a high adhesive strength may be applied to the surface of the sealant 6 by screen printing instead of being applied to the electronic component 2. In this case, the film thickness of the resin 14 is suitably 5 μm.

[0074]

According to the present invention, with the above-described structure, it is possible to provide a connection unit between an electronic component and a substrate having excellent thermal shock resistance. Also electronic
In the cooling process after the operation of components, the linear expansion coefficient between the electronic component and the substrate
The thermal stress acting on the connection due to the difference is reduced and
Effective in preventing deformation and breakage of each connection due to movement
It is.

[Brief description of the drawings]

FIG. 1 is a front view of a connection unit.

FIG. 2 is an enlarged sectional view of a portion indicated by an arrow 2 in FIG.

FIG. 3 is a perspective view of a film-like sealant.

FIG. 4 is an explanatory view showing a state in which a film-like sealant is disposed above a substrate in the first example of the method of manufacturing a connection unit.

FIG. 5 is an explanatory view showing a state in which a film-like sealant is overlaid on a substrate in the first example of the method of manufacturing a connection unit.

FIG. 6 is an explanatory view showing a state in which a conductive paste is filled into each connection hole of the film-like sealing agent in the first example of the connection unit manufacturing method.

FIG. 7 is an explanatory view showing a state in which an electronic component is arranged above the film-like sealant in the first example of the connection unit manufacturing method.

FIG. 8 is an explanatory view showing a state in which an electronic component is superimposed on a film-like sealant in the first example of the method of manufacturing a connection unit.

FIG. 9 is a process chart of a second example of the connection unit manufacturing method.

FIG. 10 is a process chart of a third example of the connection unit manufacturing method.

FIG. 11 is a process chart of a fourth example of the connection unit manufacturing method.

[Explanation of symbols]

 2 Electronic component 3 Substrate 4 Electrode 5 Terminal 6 Sealant 8 Projection 9 Conductive bonding material 14 High adhesive liquid epoxy resin (adhesive) a Diameter b Thickness c Interval

Claims (2)

(57) [Claims] An electronic component (2) including at least one electrode (4) having a projection (8), and a substrate (20) including at least one terminal (5) facing the projection (8). 3), a conductive bonding material (9) for electrically connecting the protrusion (8) and the terminal (5), and the electronic component (2) surrounding the conductive bonding material (9). An electrically insulating sealant (6) for bonding between the substrates (3); a diameter a of the projection (8); and the sealant between the electronic component (2) and the substrate (3). The relationship between the thickness (b) and (6) is set to b> a, and the distance c between the tip of the projection (8) and the terminal (5) is set to c> 0.0.
The conductive bonding material (9) and the sealant are set to 2 mm.
(6) is solidified at the time of the joining, and the conductive joining material
The connection unit between an electronic component and a substrate , wherein the hardness of (9) is lower than the hardness of the sealant (6) . 2. An electronic component (2) provided with at least one electrode (4) having a projection (8), and a substrate provided with at least one terminal (5) facing said projection (8). 3), a conductive bonding material (9) for electrically connecting the protrusions (8) and the terminals (5), and surrounding the conductive bonding material (9) and bonding to the substrate (3). And a bonding agent (14) for joining the electronic component (2) and the sealing agent (6), and a diameter a of the projection (8). , The electronic component (2)
And the thickness b of the sealing agent (6) between the substrates (3)
Is set to b> a, the distance c between the tip of the projection (8) and the terminal (5) is set to c> 0.02 mm, and the conductive bonding material (9) and the sealing agent are set. (6) is the above
Hardened at the time of joining, the hardness of the conductive joining material (9)
Is a connection unit between an electronic component and a substrate , wherein the hardness is lower than the hardness of the sealant (6) .