FR2620569A1 - Process for gauging the thickness of a weld of an electronic component on a substrate - Google Patents
Process for gauging the thickness of a weld of an electronic component on a substrate Download PDFInfo
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- FR2620569A1 FR2620569A1 FR8712604A FR8712604A FR2620569A1 FR 2620569 A1 FR2620569 A1 FR 2620569A1 FR 8712604 A FR8712604 A FR 8712604A FR 8712604 A FR8712604 A FR 8712604A FR 2620569 A1 FR2620569 A1 FR 2620569A1
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- substrate
- fusible
- electronic component
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Abstract
Description
"PROCèDE POUR CALIBRER L'EPAISSEUR D'UNE SOUDURE D'UN COMPO-
SANT ELECTRONIQUE SUR UN SUBSTRAT"."METHOD FOR CALIBRATING THE THICKNESS OF A WELDING OF A COMPO-
ELECTRONIC HEALTH ON A SUBSTRATE ".
La présente invention concerne un procédé pour calibrer l'épaisseur e d'une soudure d'un composant électronique sur un substrat, ladite soudure étant réalisée à l'aide d'un ~matériau fusible. The present invention relates to a method for calibrating the thickness e of a solder of an electronic component on a substrate, said solder being produced using a ~ fusible material.
L'invention trouve une application particulièrement avantageuse dans le domaine de la technologie hybride et, en particulier, dans le report de composants électroniques (ou 'puces') sur un substrat. The invention finds a particularly advantageous application in the field of hybrid technology and, in particular, in the transfer of electronic components (or “chips”) to a substrate.
Un procédé actuellement utilisé pour souder un composant électronique sur un substrat consiste à étaler sur le substrat, à l'endroit prévu pour la soudure, une pàte fusible du type de celles disponibles commercialement, par exemple sous la marque Indalloy. A method currently used for soldering an electronic component on a substrate consists in spreading on the substrate, at the place provided for soldering, a fusible paste of the type of those commercially available, for example under the brand Indalloy.
Ces pâtes fusibles sont composées de particules de métal fusible (Indium, alliage Indium/Etain, etc...} mélangées à un liant et un mouillant tel que la résine de pin. Après avoir étalé ladite pâte fusible, on amène le composant électronique en position sur le substrat et au contact de la pâte fusible. La pâte est ensuite fondue à une température de l'ordre de 170 à 2250 C. Après refroidissement, la soudure est alors réalisée. These fusible pastes are composed of particles of fusible metal (Indium, Indium / Tin alloy, etc.) mixed with a binder and a wetting agent such as pine resin. After spreading said fusible paste, the electronic component is brought in. position on the substrate and in contact with the meltable paste The paste is then melted at a temperature of the order of 170 to 2250 C. After cooling, the welding is then carried out.
L'inconvénient présenté par ce procédé de soudage connu est que l'épaisseur e de la soudure, c'est à dire la distance entre le composant électronique et le substrat, est non uniforme, aléatoire et non reproductible. Or, cette épaisseur e est décisive quant à la détermination de la résistance thermiq.-, de la résistance électrique et de l'encombrement lécaniqu du composant électronique sur le substrat. De plus, l'épaisseur e conditionne la longueur des connexions électriques entre le composant et les contacts situés sur le substrat, or cette longueur est d'une très grande importance dans la valeur des inductances parasites des liaisons composantsubstrat. The disadvantage presented by this known welding method is that the thickness e of the solder, that is to say the distance between the electronic component and the substrate, is non-uniform, random and non-reproducible. However, this thickness e is decisive as regards the determination of the thermal resistance, the electrical resistance and the mechanical bulk of the electronic component on the substrate. In addition, the thickness e conditions the length of the electrical connections between the component and the contacts located on the substrate, but this length is of very great importance in the value of the parasitic inductances of the component-substrate connections.
Aussi, le problème technique à résoudre par l'objet de la présente demande est de proposer un procédé pour calibrer l'épaisseur e d'une soudure d'un composant électronique sur un substrat, ladite soudure étant réalisée à l'aide d'un matériau fusible, procédé grâce auquel on obtiendrait une épaisseur e de soudure constante sur toute sa surface, connue, réglable et reproductible. Also, the technical problem to be solved by the subject of the present application is to propose a method for calibrating the thickness e of a solder of an electronic component on a substrate, said solder being produced using a fusible material, process by which a constant thickness e of weld over its entire surface is obtained, known, adjustable and reproducible.
La solution au problème technique posé consiste, selon la présente invention, en ce que, l'on combine audit matériau fusible des moyens de calage calibrés, d'épaisseur e, et en ce que le composant électronique et le substrat sont mis en contact avec lesdits moyens de calage. The solution to the technical problem posed consists, according to the present invention, in that said fusible material is combined with calibrated wedging means, of thickness e, and in that the electronic component and the substrate are brought into contact with said wedging means.
Dans un premier mode de réalisation du procédé selon l'invention, dans lequel le matériau fusible est une pâte fusible, il est prévu que lesdits moyens de calage sont constitués par des billes calibrées en diamètre, et en ce qu'avant fusion de ladite pâte fusible, on exerce des forces de pression sur le composant électronique et/ou sur le substrat de façon que le composant électronique et le substrat soient en contact avec lesdites billes. L'épaisseur e de la soudure est alors complètement déterminée par le diamètre des billes, qui peuvent être des billes de verre ou, mieux encore, des billes d'un métal alliable ou soudable à la pâte fusible. In a first embodiment of the method according to the invention, in which the meltable material is a meltable paste, provision is made for said wedging means to consist of balls calibrated in diameter, and in that before melting of said paste fuse, pressure forces are exerted on the electronic component and / or on the substrate so that the electronic component and the substrate are in contact with said balls. The thickness e of the weld is then completely determined by the diameter of the balls, which can be glass balls or, better still, balls of an alloyable or weldable metal.
Cette dernière disposition évite le risque de départ des billes non alliées lorsque le composant électronique et le substrat sont lis en contact avec lesdites billes.This latter arrangement avoids the risk of starting unalloyed balls when the electronic component and the substrate are read in contact with said balls.
Enfin, un second mode de réalisation du procédé selon l'invention, dans lequel le matériau fusible est un métal fusible, prévoit que lesdits moyens de image sont constitués par une grille métallique dont les brins sont calibrés en épaisseur, et que ladite grille est recouverte d'une couche dudit métal fusible. Finally, a second embodiment of the method according to the invention, in which the fusible material is a fusible metal, provides that said image means are constituted by a metal grid whose strands are calibrated in thickness, and that said grid is covered a layer of said fusible metal.
La description qui va suivre en regard des dessins annexés, donnés à titre d'exemples non limitatifs, fera bien comprendre en quoi consiste l'invention et comment elle peut être réalisée. The description which follows with reference to the appended drawings, given by way of nonlimiting examples, will make it clear what the invention consists of and how it can be implemented.
Les figures la et 1b illustrent, par des vues en coupe, un premier mode de réalisation du procédé selon l'invention. Figures la and 1b illustrate, in sectional views, a first embodiment of the method according to the invention.
La figure 2 montre à l'aide d'une coupe un deuxième mode de réalisation du procédé selon l'invention. Figure 2 shows with a section a second embodiment of the method according to the invention.
Aux figures la et tb sont représentées des vues en coupe illustrant un procédé pour calibrer l'épaisseur e d'une soudure d'un composant électronique 10 sur un substrat 20, ladite soudure étant réalisée à l'aide d'un matériau fusible 30. Dans le mode de réalisation montré aux figures la et lb, le matériau fusible 30 est constitué par une pâte fusible qui est un mélange de particules de métal fusible et d'un liant. FIGS. 1a and tb show cross-section views illustrating a method for calibrating the thickness e of a solder of an electronic component 10 on a substrate 20, said solder being produced using a fusible material 30. In the embodiment shown in FIGS. 1 a and 1 b, the meltable material 30 is constituted by a meltable paste which is a mixture of particles of meltable metal and a binder.
Ce genre de pâte fusible se trouve aisément dans le commerce, par exemple sous la marque Indalloy. Ainsi que l'indiquent les figures la et lb, on combine audit matériau fusible, ici la pâte fusible, des moyens de calage 40 calibrés d'épaisseur e qui, dans le cas des figures la et lb, sont des billes calibrées en diamètre à 10, 20 ou 30 pm. Comme on peut l'observer à la figure lb, le composant électronique 10 et le substrat 20 sont mis en contact avec les moyens de calage 40, et, plus précisément ici, avant fusion de ladite pâte fusible, on exerce des forces de pression P sur le composant électronique et/ou sur le substrat afin de les mettre en contact avec les billes 40.Ces billes peuvent être des billes de verre, mais, avantageusement, on préférera des billes d'un matériau alliable à la pâte fusible car, dans ce cas, les billes étant incorporées à la pâte fusible de façon positive, aucun départ des billes au moment'de la mise en contact du compos nt électronique et du substrat avec lesdites billes n'est à craindre, alors que cet inconvénient peut se produire avec des billes de verre. Les billes alliables peuvent être, par exemple, des billes de cuivre et la pâte fusible peut être réalisée avec de 1'Indium, un alliage Argent/Etain ou encore un alliage Indium/Etain.This type of meltable paste is readily available commercially, for example under the brand name Indalloy. As indicated in FIGS. 1a and 1b, said fusible material, here the fusible paste, is combined with calibration means 40 calibrated of thickness e which, in the case of FIGS. 1a and 1b, are balls calibrated in diameter at 10, 20 or 30 pm. As can be seen in FIG. 1b, the electronic component 10 and the substrate 20 are brought into contact with the wedging means 40, and, more precisely here, before melting of said fusible paste, pressure forces P are exerted on the electronic component and / or on the substrate in order to bring them into contact with the balls 40. These balls can be glass balls, but, advantageously, we prefer balls of a material that can be combined with fusible paste because, in in this case, the balls being incorporated in the meltable paste in a positive manner, no departure of the balls when the electronic compound and the substrate are brought into contact with said balls is to be feared, while this drawback may occur with glass beads. The alloy balls can be, for example, copper balls and the fusible paste can be produced with Indium, a Silver / Tin alloy or an Indium / Tin alloy.
selon le mode de mise en oeuvre de la figure 2 dans lequel le matériau fusible est un métal fusible, les moyens de calage 40 sont constitués par une grille métallique dont les brins 50 sont calibrés en épaisseur et ladite grille est recouverte d'une couche dudit métal fusible. A titre d'exemple, la grille peut être en cuivre ou en laiton avec des brins 50 de 20 à 30 pm d'épaisseur, comportant en surface une couche 30 d'Indium déposée par voie électrolytique. Les grilles métalliques utilisées sont, soit des grilles métalliques tissées, soit des grilles en métal repoussé. according to the embodiment of Figure 2 in which the fusible material is a fusible metal, the wedging means 40 are constituted by a metal grid whose strands 50 are calibrated in thickness and said grid is covered with a layer of said fusible metal. By way of example, the grid can be made of copper or brass with strands 50 20 to 30 μm thick, comprising on the surface a layer 30 of Indium deposited electrolytically. The metallic grids used are either woven metallic grids or repoussé metal grids.
De même que dans le cas des billes, les grilles métalliques peuvent être associées à une pâte fusible remplissant les mailles desdites grilles. As in the case of balls, the metal grids can be associated with a fusible paste filling the meshes of said grids.
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8712604A FR2620569A1 (en) | 1987-09-11 | 1987-09-11 | Process for gauging the thickness of a weld of an electronic component on a substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8712604A FR2620569A1 (en) | 1987-09-11 | 1987-09-11 | Process for gauging the thickness of a weld of an electronic component on a substrate |
Publications (1)
Publication Number | Publication Date |
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FR2620569A1 true FR2620569A1 (en) | 1989-03-17 |
Family
ID=9354804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8712604A Withdrawn FR2620569A1 (en) | 1987-09-11 | 1987-09-11 | Process for gauging the thickness of a weld of an electronic component on a substrate |
Country Status (1)
Country | Link |
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FR (1) | FR2620569A1 (en) |
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EP0413335A2 (en) * | 1989-08-17 | 1991-02-20 | Canon Kabushiki Kaisha | Method of mutually connecting electrode terminals |
FR2722916A1 (en) * | 1994-02-22 | 1996-01-26 | Nec Corp | Connection element comprising solder-coated core |
FR2781924A1 (en) * | 1998-07-30 | 2000-02-04 | St Microelectronics Sa | Procedure for assembly of integrated circuits including a stage of soldering under mechanical pressure with initial spacing of components determined by the diameter of balls of solder |
WO2004065050A2 (en) * | 2003-01-14 | 2004-08-05 | Molex Incorporated | Method and system for solder connecting electrical devices |
WO2004107832A1 (en) * | 2003-05-22 | 2004-12-09 | Rf Micro Devices, Inc. | Solder filler |
GB2603488A (en) * | 2021-02-04 | 2022-08-10 | Rockwood Composites | A soldering compound |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0413335A2 (en) * | 1989-08-17 | 1991-02-20 | Canon Kabushiki Kaisha | Method of mutually connecting electrode terminals |
EP0413335A3 (en) * | 1989-08-17 | 1991-10-30 | Canon Kabushiki Kaisha | Method of mutually connecting electrode terminals |
US5352318A (en) * | 1989-08-17 | 1994-10-04 | Canon Kabushiki Kaisha | Method of mutually connecting electrode terminals |
FR2722916A1 (en) * | 1994-02-22 | 1996-01-26 | Nec Corp | Connection element comprising solder-coated core |
FR2781924A1 (en) * | 1998-07-30 | 2000-02-04 | St Microelectronics Sa | Procedure for assembly of integrated circuits including a stage of soldering under mechanical pressure with initial spacing of components determined by the diameter of balls of solder |
US7410091B2 (en) | 1998-07-30 | 2008-08-12 | Stmicroelectronics S.A. | Method of integrated circuit assembly |
WO2004065050A2 (en) * | 2003-01-14 | 2004-08-05 | Molex Incorporated | Method and system for solder connecting electrical devices |
WO2004065050A3 (en) * | 2003-01-14 | 2004-09-30 | Molex Inc | Method and system for solder connecting electrical devices |
WO2004107832A1 (en) * | 2003-05-22 | 2004-12-09 | Rf Micro Devices, Inc. | Solder filler |
GB2603488A (en) * | 2021-02-04 | 2022-08-10 | Rockwood Composites | A soldering compound |
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