JPS6239542B2 - - Google Patents

Info

Publication number
JPS6239542B2
JPS6239542B2 JP54061446A JP6144679A JPS6239542B2 JP S6239542 B2 JPS6239542 B2 JP S6239542B2 JP 54061446 A JP54061446 A JP 54061446A JP 6144679 A JP6144679 A JP 6144679A JP S6239542 B2 JPS6239542 B2 JP S6239542B2
Authority
JP
Japan
Prior art keywords
header
lead frame
lead
hole
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54061446A
Other languages
English (en)
Japanese (ja)
Other versions
JPS551195A (en
Inventor
Juji Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6144679A priority Critical patent/JPS551195A/ja
Publication of JPS551195A publication Critical patent/JPS551195A/ja
Publication of JPS6239542B2 publication Critical patent/JPS6239542B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP6144679A 1979-05-21 1979-05-21 Lead frame header connection body Granted JPS551195A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6144679A JPS551195A (en) 1979-05-21 1979-05-21 Lead frame header connection body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6144679A JPS551195A (en) 1979-05-21 1979-05-21 Lead frame header connection body

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP49102094A Division JPS5928985B2 (ja) 1974-09-06 1974-09-06 金属基板の接続方法

Publications (2)

Publication Number Publication Date
JPS551195A JPS551195A (en) 1980-01-07
JPS6239542B2 true JPS6239542B2 (2) 1987-08-24

Family

ID=13171289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6144679A Granted JPS551195A (en) 1979-05-21 1979-05-21 Lead frame header connection body

Country Status (1)

Country Link
JP (1) JPS551195A (2)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61149390A (ja) * 1984-12-25 1986-07-08 Mitsubishi Paper Mills Ltd 感圧記録用顕色シ−ト
JPH0675992B2 (ja) * 1985-10-23 1994-09-28 富士写真フイルム株式会社 記録材料
JPS6313778A (ja) * 1986-07-04 1988-01-21 Fuji Photo Film Co Ltd 記録材料
JPS6331789A (ja) * 1986-07-28 1988-02-10 Fuji Photo Film Co Ltd 感圧記録シ−ト
JPS6331788A (ja) * 1986-07-28 1988-02-10 Fuji Photo Film Co Ltd 感圧記録シ−ト
JP3105354B2 (ja) * 1991-07-03 2000-10-30 三井化学株式会社 顕色剤組成物、水性懸濁液及びそれを用いた感圧複写紙用顕色シート
IT1252136B (it) * 1991-11-29 1995-06-05 St Microelectronics Srl Struttura di dispositivo a semiconduttore con dissipatore metallico e corpo in plastica, con mezzi per una connessione elettrica al dissipatore di alta affidabilita'
JP4336278B2 (ja) 2004-08-31 2009-09-30 富士通株式会社 キャリッジアームおよび情報記憶装置
JP5703008B2 (ja) * 2010-12-16 2015-04-15 新電元工業株式会社 フレーム組立体、半導体装置及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5928985B2 (ja) * 1974-09-06 1984-07-17 株式会社日立製作所 金属基板の接続方法

Also Published As

Publication number Publication date
JPS551195A (en) 1980-01-07

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