JPS551195A - Lead frame header connection body - Google Patents

Lead frame header connection body

Info

Publication number
JPS551195A
JPS551195A JP6144679A JP6144679A JPS551195A JP S551195 A JPS551195 A JP S551195A JP 6144679 A JP6144679 A JP 6144679A JP 6144679 A JP6144679 A JP 6144679A JP S551195 A JPS551195 A JP S551195A
Authority
JP
Japan
Prior art keywords
header
lead frame
staking
warping
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6144679A
Other languages
Japanese (ja)
Other versions
JPS6239542B2 (en
Inventor
Yuji Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6144679A priority Critical patent/JPS551195A/en
Publication of JPS551195A publication Critical patent/JPS551195A/en
Publication of JPS6239542B2 publication Critical patent/JPS6239542B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the warping of the lead frame due to heat expansion and contraction by means of a through hole for insertion of staking projection made a slot. CONSTITUTION:A header suspension lead 4 is bent like L so as to suspend the header for connection of pellets securely. The lead 4 is provided with a through hole for staking in a long and narrow shape along the length of the header. In other words, respective projections for staking provided for the header 7 are inserted into respective slots of the header suspension leads 4 and then subjected to staking. Thus, the header 7 is mounted to the lead frame 1. As a result, in the heat treatment of the lead frame, the staked sections 6 moves in the slots 5 thereby eliminating warping of the lead frame 1. Likewise, when it is cooled, warping thereof can be prevented.
JP6144679A 1979-05-21 1979-05-21 Lead frame header connection body Granted JPS551195A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6144679A JPS551195A (en) 1979-05-21 1979-05-21 Lead frame header connection body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6144679A JPS551195A (en) 1979-05-21 1979-05-21 Lead frame header connection body

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP49102094A Division JPS5928985B2 (en) 1974-09-06 1974-09-06 How to connect metal substrates

Publications (2)

Publication Number Publication Date
JPS551195A true JPS551195A (en) 1980-01-07
JPS6239542B2 JPS6239542B2 (en) 1987-08-24

Family

ID=13171289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6144679A Granted JPS551195A (en) 1979-05-21 1979-05-21 Lead frame header connection body

Country Status (1)

Country Link
JP (1) JPS551195A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61149390A (en) * 1984-12-25 1986-07-08 Mitsubishi Paper Mills Ltd Color develop sheet for pressure-sensitive recording
JPS6295288A (en) * 1985-10-23 1987-05-01 Fuji Photo Film Co Ltd Recording material
JPS6313778A (en) * 1986-07-04 1988-01-21 Fuji Photo Film Co Ltd Recording material
JPS6331788A (en) * 1986-07-28 1988-02-10 Fuji Photo Film Co Ltd Pressure-sensitive recording sheet
JPS6331789A (en) * 1986-07-28 1988-02-10 Fuji Photo Film Co Ltd Pressure-sensitive recording sheet
US5260403A (en) * 1991-07-03 1993-11-09 Mitsui Toatsu Chemicals, Inc. Color-developing composition, aqueous suspension of the composition, and color-developing sheet produced using the suspension and suitable for use in pressure-sensitive copying paper
US5763296A (en) * 1991-11-21 1998-06-09 Sgs-Thomson Microelectronics S.R.L. Method for fabricating an electronic device structure with studs locating lead frame on backing plate
US7595961B2 (en) 2004-08-31 2009-09-29 Fujitsu Limited Base member and information storage apparatus
JP2012129392A (en) * 2010-12-16 2012-07-05 Shindengen Electric Mfg Co Ltd Frame assembly, semiconductor device and method of manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5129872A (en) * 1974-09-06 1976-03-13 Hitachi Ltd KINZOKUKI BANNOSET SUZOKUHOHO

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5129872A (en) * 1974-09-06 1976-03-13 Hitachi Ltd KINZOKUKI BANNOSET SUZOKUHOHO

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61149390A (en) * 1984-12-25 1986-07-08 Mitsubishi Paper Mills Ltd Color develop sheet for pressure-sensitive recording
JPH0434515B2 (en) * 1984-12-25 1992-06-08 Mitsubishi Paper Mills Ltd
JPS6295288A (en) * 1985-10-23 1987-05-01 Fuji Photo Film Co Ltd Recording material
JPH0675992B2 (en) * 1985-10-23 1994-09-28 富士写真フイルム株式会社 Recording material
JPS6313778A (en) * 1986-07-04 1988-01-21 Fuji Photo Film Co Ltd Recording material
JPH0549031B2 (en) * 1986-07-04 1993-07-23 Fuji Photo Film Co Ltd
JPH0549033B2 (en) * 1986-07-28 1993-07-23 Fuji Photo Film Co Ltd
JPS6331789A (en) * 1986-07-28 1988-02-10 Fuji Photo Film Co Ltd Pressure-sensitive recording sheet
JPH0549032B2 (en) * 1986-07-28 1993-07-23 Fuji Photo Film Co Ltd
JPS6331788A (en) * 1986-07-28 1988-02-10 Fuji Photo Film Co Ltd Pressure-sensitive recording sheet
US5260403A (en) * 1991-07-03 1993-11-09 Mitsui Toatsu Chemicals, Inc. Color-developing composition, aqueous suspension of the composition, and color-developing sheet produced using the suspension and suitable for use in pressure-sensitive copying paper
US5763296A (en) * 1991-11-21 1998-06-09 Sgs-Thomson Microelectronics S.R.L. Method for fabricating an electronic device structure with studs locating lead frame on backing plate
US7595961B2 (en) 2004-08-31 2009-09-29 Fujitsu Limited Base member and information storage apparatus
JP2012129392A (en) * 2010-12-16 2012-07-05 Shindengen Electric Mfg Co Ltd Frame assembly, semiconductor device and method of manufacturing the same

Also Published As

Publication number Publication date
JPS6239542B2 (en) 1987-08-24

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