JPS6239216B2 - - Google Patents
Info
- Publication number
- JPS6239216B2 JPS6239216B2 JP18661083A JP18661083A JPS6239216B2 JP S6239216 B2 JPS6239216 B2 JP S6239216B2 JP 18661083 A JP18661083 A JP 18661083A JP 18661083 A JP18661083 A JP 18661083A JP S6239216 B2 JPS6239216 B2 JP S6239216B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- weight
- effect
- grain
- added
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010949 copper Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 7
- 230000000694 effects Effects 0.000 description 20
- 229910045601 alloy Inorganic materials 0.000 description 18
- 239000000956 alloy Substances 0.000 description 18
- 239000013078 crystal Substances 0.000 description 12
- 230000009466 transformation Effects 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 7
- 229910017535 Cu-Al-Ni Inorganic materials 0.000 description 5
- 230000003446 memory effect Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000005266 casting Methods 0.000 description 4
- 238000005098 hot rolling Methods 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 229910000734 martensite Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 238000005204 segregation Methods 0.000 description 3
- 229910000925 Cd alloy Inorganic materials 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000521 B alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000002079 cooperative effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18661083A JPS6077947A (ja) | 1983-10-04 | 1983-10-04 | 銅基形状記憶合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18661083A JPS6077947A (ja) | 1983-10-04 | 1983-10-04 | 銅基形状記憶合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6077947A JPS6077947A (ja) | 1985-05-02 |
| JPS6239216B2 true JPS6239216B2 (cs) | 1987-08-21 |
Family
ID=16191583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18661083A Granted JPS6077947A (ja) | 1983-10-04 | 1983-10-04 | 銅基形状記憶合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6077947A (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110284025A (zh) * | 2019-07-29 | 2019-09-27 | 江西省鹰潭铜产业工程技术研究中心 | 一种铝青铜材料及其制备方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6130643A (ja) * | 1984-07-20 | 1986-02-12 | Kobe Steel Ltd | 加工性の良好な硬質形状記憶合金 |
| US6440849B1 (en) * | 1999-10-18 | 2002-08-27 | Agere Systems Guardian Corp. | Microstructure control of copper interconnects |
| CN108384984B (zh) * | 2018-04-09 | 2020-01-03 | 天津理工大学 | 一种低成本高温形状记忆合金的制备方法 |
| CN110512115B (zh) * | 2019-09-29 | 2021-08-17 | 宁波金田铜业(集团)股份有限公司 | 高强高弹导电铜钛合金棒材及其制备方法 |
-
1983
- 1983-10-04 JP JP18661083A patent/JPS6077947A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110284025A (zh) * | 2019-07-29 | 2019-09-27 | 江西省鹰潭铜产业工程技术研究中心 | 一种铝青铜材料及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6077947A (ja) | 1985-05-02 |
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