JPS6238866B2 - - Google Patents
Info
- Publication number
- JPS6238866B2 JPS6238866B2 JP57219917A JP21991782A JPS6238866B2 JP S6238866 B2 JPS6238866 B2 JP S6238866B2 JP 57219917 A JP57219917 A JP 57219917A JP 21991782 A JP21991782 A JP 21991782A JP S6238866 B2 JPS6238866 B2 JP S6238866B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- hole
- lid
- electrode
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W76/47—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57219917A JPS59110141A (ja) | 1982-12-15 | 1982-12-15 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57219917A JPS59110141A (ja) | 1982-12-15 | 1982-12-15 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59110141A JPS59110141A (ja) | 1984-06-26 |
| JPS6238866B2 true JPS6238866B2 (show.php) | 1987-08-20 |
Family
ID=16743042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57219917A Granted JPS59110141A (ja) | 1982-12-15 | 1982-12-15 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59110141A (show.php) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0787230B2 (ja) * | 1988-05-24 | 1995-09-20 | 三菱電機株式会社 | 半導体装置 |
| JP4053257B2 (ja) * | 2001-06-14 | 2008-02-27 | 新光電気工業株式会社 | 半導体装置の製造方法 |
| US11239124B2 (en) | 2017-05-10 | 2022-02-01 | Mitsubishi Electric Corporation | Semiconductor device and method of manufacturing semiconductor device, power conversion device, and moving body |
| JP7247124B2 (ja) | 2020-01-07 | 2023-03-28 | 三菱電機株式会社 | 半導体モジュール |
| EP4270466A1 (en) * | 2022-04-25 | 2023-11-01 | Infineon Technologies AG | Power semiconductor module arrangements and methods for producing power semiconductor module arrangements |
-
1982
- 1982-12-15 JP JP57219917A patent/JPS59110141A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59110141A (ja) | 1984-06-26 |
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