JPS6238863B2 - - Google Patents
Info
- Publication number
- JPS6238863B2 JPS6238863B2 JP53131639A JP13163978A JPS6238863B2 JP S6238863 B2 JPS6238863 B2 JP S6238863B2 JP 53131639 A JP53131639 A JP 53131639A JP 13163978 A JP13163978 A JP 13163978A JP S6238863 B2 JPS6238863 B2 JP S6238863B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- lead
- outer frame
- tie bar
- effective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 230000008054 signal transmission Effects 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 description 10
- 239000008188 pellet Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13163978A JPS5559749A (en) | 1978-10-27 | 1978-10-27 | Lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13163978A JPS5559749A (en) | 1978-10-27 | 1978-10-27 | Lead frame |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6392887A Division JPS62252959A (ja) | 1987-03-20 | 1987-03-20 | リ−ドフレ−ム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5559749A JPS5559749A (en) | 1980-05-06 |
JPS6238863B2 true JPS6238863B2 (fr) | 1987-08-20 |
Family
ID=15062750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13163978A Granted JPS5559749A (en) | 1978-10-27 | 1978-10-27 | Lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5559749A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02105867U (fr) * | 1989-02-10 | 1990-08-22 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5749129A (en) * | 1980-09-09 | 1982-03-20 | Matsushita Electric Ind Co Ltd | Method of producing electronic part |
JPS5827332A (ja) * | 1981-08-11 | 1983-02-18 | Toshiba Corp | リードフレームを用いた半導体装置の製造方法 |
JPS58154240A (ja) * | 1982-03-10 | 1983-09-13 | Hitachi Ltd | 樹脂封止形半導体装置 |
JPS58170834U (ja) * | 1982-05-07 | 1983-11-15 | 日本電気株式会社 | リ−ドフレ−ムのアイランド吊り構造 |
JPS6155349U (fr) * | 1984-08-29 | 1986-04-14 | ||
JPS62190858A (ja) * | 1986-02-18 | 1987-08-21 | Mitsubishi Electric Corp | 半導体装置 |
JPS63147832U (fr) * | 1987-03-19 | 1988-09-29 | ||
JPS62252959A (ja) * | 1987-03-20 | 1987-11-04 | Hitachi Ltd | リ−ドフレ−ム |
JP2803642B2 (ja) * | 1996-06-27 | 1998-09-24 | 日本電気株式会社 | 半導体装置 |
CN107845575A (zh) * | 2017-11-03 | 2018-03-27 | 浙江人和光伏科技有限公司 | 一种薄片二极管的生产方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5363979A (en) * | 1976-11-19 | 1978-06-07 | Hitachi Ltd | Sealing method of semiconductor element and lead frame used for the same |
-
1978
- 1978-10-27 JP JP13163978A patent/JPS5559749A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5363979A (en) * | 1976-11-19 | 1978-06-07 | Hitachi Ltd | Sealing method of semiconductor element and lead frame used for the same |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02105867U (fr) * | 1989-02-10 | 1990-08-22 |
Also Published As
Publication number | Publication date |
---|---|
JPS5559749A (en) | 1980-05-06 |
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