CA1175957A - Ensemble a circuit integre - Google Patents

Ensemble a circuit integre

Info

Publication number
CA1175957A
CA1175957A CA000394433A CA394433A CA1175957A CA 1175957 A CA1175957 A CA 1175957A CA 000394433 A CA000394433 A CA 000394433A CA 394433 A CA394433 A CA 394433A CA 1175957 A CA1175957 A CA 1175957A
Authority
CA
Canada
Prior art keywords
lead frame
opening
contacts
lead
bonding fingers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000394433A
Other languages
English (en)
Inventor
Joseph Link
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CTU of Delaware Inc
Original Assignee
Mostek Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mostek Corp filed Critical Mostek Corp
Priority to CA000394433A priority Critical patent/CA1175957A/fr
Application granted granted Critical
Publication of CA1175957A publication Critical patent/CA1175957A/fr
Expired legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
CA000394433A 1982-01-19 1982-01-19 Ensemble a circuit integre Expired CA1175957A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA000394433A CA1175957A (fr) 1982-01-19 1982-01-19 Ensemble a circuit integre

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA000394433A CA1175957A (fr) 1982-01-19 1982-01-19 Ensemble a circuit integre

Publications (1)

Publication Number Publication Date
CA1175957A true CA1175957A (fr) 1984-10-09

Family

ID=4121857

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000394433A Expired CA1175957A (fr) 1982-01-19 1982-01-19 Ensemble a circuit integre

Country Status (1)

Country Link
CA (1) CA1175957A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012142712A1 (fr) * 2011-04-21 2012-10-26 Ford Timothy D F Procédé de surmoulage et dispositif électronique surmoulé

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012142712A1 (fr) * 2011-04-21 2012-10-26 Ford Timothy D F Procédé de surmoulage et dispositif électronique surmoulé

Similar Documents

Publication Publication Date Title
US4441119A (en) Integrated circuit package
US7211471B1 (en) Exposed lead QFP package fabricated through the use of a partial saw process
CA1040747A (fr) Bloc de circuits integres a dissipateur thermique d'un type nouveau
US7321162B1 (en) Semiconductor package having reduced thickness
US6630729B2 (en) Low-profile semiconductor package with strengthening structure
US7190062B1 (en) Embedded leadframe semiconductor package
US6521987B1 (en) Plastic integrated circuit device package and method for making the package
US6627976B1 (en) Leadframe for semiconductor package and mold for molding the same
US4167647A (en) Hybrid microelectronic circuit package
KR100927319B1 (ko) 스탬핑된 리드프레임 및 그 제조 방법
US5471088A (en) Semiconductor package and method for manufacturing the same
US20030113954A1 (en) Method of making a semiconductor package having exposed metal strap
KR100369907B1 (ko) 반도체 패키지와 그 반도체 패키지의 기판 실장 구조 및적층 구조
KR19980032479A (ko) 표면 설치 to-220 패키지 및 그의 제조 공정
US4298769A (en) Hermetic plastic dual-in-line package for a semiconductor integrated circuit
US4278991A (en) IC Package with heat sink and minimal cross-sectional area
EP0444818A2 (fr) Emballage de circuit intégré amélioré
KR0179834B1 (ko) 컬럼형 패키지
US6677662B1 (en) Clamp and heat block assembly for wire bonding a semiconductor package assembly
JPH0774278A (ja) セラミック・パッケージ組立部品
US6911718B1 (en) Double downset double dambar suspended leadframe
CA1175957A (fr) Ensemble a circuit integre
US6921967B2 (en) Reinforced die pad support structure
WO1982002458A1 (fr) Enveloppe de circuit integre
JP3097842B2 (ja) 樹脂封止型半導体装置用リードフレーム

Legal Events

Date Code Title Description
MKEC Expiry (correction)
MKEX Expiry