JPS6236391B2 - - Google Patents

Info

Publication number
JPS6236391B2
JPS6236391B2 JP57076941A JP7694182A JPS6236391B2 JP S6236391 B2 JPS6236391 B2 JP S6236391B2 JP 57076941 A JP57076941 A JP 57076941A JP 7694182 A JP7694182 A JP 7694182A JP S6236391 B2 JPS6236391 B2 JP S6236391B2
Authority
JP
Japan
Prior art keywords
brazing
metal
brazing material
semiconductor element
brazed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57076941A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5890748A (ja
Inventor
Shinzo Anazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP7694182A priority Critical patent/JPS5890748A/ja
Publication of JPS5890748A publication Critical patent/JPS5890748A/ja
Publication of JPS6236391B2 publication Critical patent/JPS6236391B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP7694182A 1982-05-07 1982-05-07 半導体装置 Granted JPS5890748A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7694182A JPS5890748A (ja) 1982-05-07 1982-05-07 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7694182A JPS5890748A (ja) 1982-05-07 1982-05-07 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP49100939A Division JPS5819385B2 (ja) 1974-09-04 1974-09-04 ロウヅケホウホウ

Publications (2)

Publication Number Publication Date
JPS5890748A JPS5890748A (ja) 1983-05-30
JPS6236391B2 true JPS6236391B2 (enrdf_load_stackoverflow) 1987-08-06

Family

ID=13619764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7694182A Granted JPS5890748A (ja) 1982-05-07 1982-05-07 半導体装置

Country Status (1)

Country Link
JP (1) JPS5890748A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59195856A (ja) * 1983-04-20 1984-11-07 Fujitsu Ltd 半導体装置及びその製造方法
JPS61107751A (ja) * 1984-10-30 1986-05-26 Nec Kansai Ltd 樹脂モ−ルド型半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819385B2 (ja) * 1974-09-04 1983-04-18 日本電気株式会社 ロウヅケホウホウ

Also Published As

Publication number Publication date
JPS5890748A (ja) 1983-05-30

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