JPS6236282Y2 - - Google Patents

Info

Publication number
JPS6236282Y2
JPS6236282Y2 JP1982021128U JP2112882U JPS6236282Y2 JP S6236282 Y2 JPS6236282 Y2 JP S6236282Y2 JP 1982021128 U JP1982021128 U JP 1982021128U JP 2112882 U JP2112882 U JP 2112882U JP S6236282 Y2 JPS6236282 Y2 JP S6236282Y2
Authority
JP
Japan
Prior art keywords
semiconductor wafer
temperature
semiconductor
sensor circuit
tester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982021128U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58124949U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2112882U priority Critical patent/JPS58124949U/ja
Publication of JPS58124949U publication Critical patent/JPS58124949U/ja
Application granted granted Critical
Publication of JPS6236282Y2 publication Critical patent/JPS6236282Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2112882U 1982-02-17 1982-02-17 半導体ウエハ− Granted JPS58124949U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2112882U JPS58124949U (ja) 1982-02-17 1982-02-17 半導体ウエハ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2112882U JPS58124949U (ja) 1982-02-17 1982-02-17 半導体ウエハ−

Publications (2)

Publication Number Publication Date
JPS58124949U JPS58124949U (ja) 1983-08-25
JPS6236282Y2 true JPS6236282Y2 (ru) 1987-09-16

Family

ID=30033259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2112882U Granted JPS58124949U (ja) 1982-02-17 1982-02-17 半導体ウエハ−

Country Status (1)

Country Link
JP (1) JPS58124949U (ru)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5387669A (en) * 1977-01-12 1978-08-02 Nippon Telegr & Teleph Corp <Ntt> Inspecting system for integrated circuit device
JPS5497376A (en) * 1978-01-18 1979-08-01 Matsushita Electric Ind Co Ltd Inspection method semiconductor device
JPS57102009A (en) * 1980-12-17 1982-06-24 Nec Corp Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5387669A (en) * 1977-01-12 1978-08-02 Nippon Telegr & Teleph Corp <Ntt> Inspecting system for integrated circuit device
JPS5497376A (en) * 1978-01-18 1979-08-01 Matsushita Electric Ind Co Ltd Inspection method semiconductor device
JPS57102009A (en) * 1980-12-17 1982-06-24 Nec Corp Semiconductor device

Also Published As

Publication number Publication date
JPS58124949U (ja) 1983-08-25

Similar Documents

Publication Publication Date Title
JPH08242100A (ja) 製造欠陥分析装置
CN111238672B (zh) 一种基于磁显微法的超导带材动态温度测量方法
JPS6236282Y2 (ru)
JPH0774218A (ja) Icのテスト方法およびそのプローブカード
JPH08330368A (ja) 半導体回路装置群及びそのプローブ試験方法
JPS6252457B2 (ru)
JPS6118338B2 (ru)
CN213457326U (zh) 一种绝缘电阻检测仪器的接触不良测试系统
JP2005049314A (ja) プロービングテスト法およびプローブ状態検出装置
CN102207412B (zh) 恒温电烙铁校准装置及其校准方法
JPH04115545A (ja) プローブカード
JPH0473620B2 (ru)
TWI604204B (zh) 用於電測探針頭的電測裝置及其電測方法
JP2002286560A (ja) 温度センサの検査方法及び検査装置
JP2827285B2 (ja) ウェーハ検査装置
JPH0220037A (ja) 半導体装置検査方法
JPS5943733Y2 (ja) 半導体装置
JPH03185744A (ja) 半導体素子
JPS6436040A (en) Parametric inspection apparatus for semiconductor device
JPH0719819B2 (ja) プローブ装置
JPH0424459Y2 (ru)
JPH1019958A (ja) Icのインサーキットテスタによる足浮き検出方法並びに接触式ヒータープローブ
JP2002100658A (ja) 半導体装置の検査装置
CN116500399A (zh) 半导体结构的检测方法、装置、设备及存储介质
JPS61187245A (ja) プロ−ブカ−ド