JPS6233446A - 集積回路装置 - Google Patents

集積回路装置

Info

Publication number
JPS6233446A
JPS6233446A JP60174644A JP17464485A JPS6233446A JP S6233446 A JPS6233446 A JP S6233446A JP 60174644 A JP60174644 A JP 60174644A JP 17464485 A JP17464485 A JP 17464485A JP S6233446 A JPS6233446 A JP S6233446A
Authority
JP
Japan
Prior art keywords
pads
pad
deviation
probe
probes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60174644A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0464465B2 (OSRAM
Inventor
Hideo Ishikawa
石川　英郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60174644A priority Critical patent/JPS6233446A/ja
Publication of JPS6233446A publication Critical patent/JPS6233446A/ja
Publication of JPH0464465B2 publication Critical patent/JPH0464465B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W70/60—
    • H10W72/926—
    • H10W72/932—

Landscapes

  • Wire Bonding (AREA)
JP60174644A 1985-08-07 1985-08-07 集積回路装置 Granted JPS6233446A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60174644A JPS6233446A (ja) 1985-08-07 1985-08-07 集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60174644A JPS6233446A (ja) 1985-08-07 1985-08-07 集積回路装置

Publications (2)

Publication Number Publication Date
JPS6233446A true JPS6233446A (ja) 1987-02-13
JPH0464465B2 JPH0464465B2 (OSRAM) 1992-10-15

Family

ID=15982196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60174644A Granted JPS6233446A (ja) 1985-08-07 1985-08-07 集積回路装置

Country Status (1)

Country Link
JP (1) JPS6233446A (OSRAM)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58166730A (ja) * 1982-03-26 1983-10-01 Mitsubishi Electric Corp 半導体装置のボンデイング用電極

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58166730A (ja) * 1982-03-26 1983-10-01 Mitsubishi Electric Corp 半導体装置のボンデイング用電極

Also Published As

Publication number Publication date
JPH0464465B2 (OSRAM) 1992-10-15

Similar Documents

Publication Publication Date Title
US6770906B2 (en) Semiconductor reliability test chip
US6225702B1 (en) Ball grid array to prevent shorting between a power supply and ground terminal
US20100283156A1 (en) Semiconductor device
JP2000164620A (ja) 半導体集積回路装置及び半導体集積回路装置の組立方法
JPS6233446A (ja) 集積回路装置
JP3214420B2 (ja) フィルムキャリア型半導体装置及び検査用プローブヘッド並びに位置合わせ方法
JPS62261139A (ja) 半導体装置
JPS63128636A (ja) 半導体集積回路装置
JPH05343487A (ja) 半導体集積回路装置
JPH065674A (ja) 半導体集積回路装置
JPS6231148A (ja) 半導体装置
JPS62183134A (ja) 半導体装置
JP2842598B2 (ja) 半導体集積回路
JPH01319956A (ja) 半導体集積回路
JPH0439950A (ja) 半導体装置
JPS6195541A (ja) 半導体装置
JPS61148829A (ja) ワイヤボンデイング方法
JPH0658937B2 (ja) 半導体集積回路
JPH07111282A (ja) 半導体チップおよびそれを用いた半導体集積回路装置
CN114171483A (zh) 半导体结构及半导体器件
JPS62111439A (ja) 半導体装置
JPH03185730A (ja) 半導体装置
JPH05102254A (ja) 半導体装置試験用プローブカード
JPH0269682A (ja) 測定用接続基板
JPH0314250A (ja) 半導体装置