JPS6232021B2 - - Google Patents

Info

Publication number
JPS6232021B2
JPS6232021B2 JP54042063A JP4206379A JPS6232021B2 JP S6232021 B2 JPS6232021 B2 JP S6232021B2 JP 54042063 A JP54042063 A JP 54042063A JP 4206379 A JP4206379 A JP 4206379A JP S6232021 B2 JPS6232021 B2 JP S6232021B2
Authority
JP
Japan
Prior art keywords
solder
ultrasonic horn
ultrasonic
horn
molten solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54042063A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55136562A (en
Inventor
Tadao Kushima
Tomiro Yasuda
Tasao Soga
Hiroshi Kato
Taku Sugawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4206379A priority Critical patent/JPS55136562A/ja
Publication of JPS55136562A publication Critical patent/JPS55136562A/ja
Publication of JPS6232021B2 publication Critical patent/JPS6232021B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/013—
    • H10W72/07125—
    • H10W72/073—
    • H10W72/07341—
    • H10W72/075—
    • H10W72/884—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP4206379A 1979-04-09 1979-04-09 Ultrasonic pre-soldering method and apparatus thereof Granted JPS55136562A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4206379A JPS55136562A (en) 1979-04-09 1979-04-09 Ultrasonic pre-soldering method and apparatus thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4206379A JPS55136562A (en) 1979-04-09 1979-04-09 Ultrasonic pre-soldering method and apparatus thereof

Publications (2)

Publication Number Publication Date
JPS55136562A JPS55136562A (en) 1980-10-24
JPS6232021B2 true JPS6232021B2 (enExample) 1987-07-11

Family

ID=12625634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4206379A Granted JPS55136562A (en) 1979-04-09 1979-04-09 Ultrasonic pre-soldering method and apparatus thereof

Country Status (1)

Country Link
JP (1) JPS55136562A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01156220A (ja) * 1987-12-12 1989-06-19 Masashi Mori 果実等の供給ホッパー

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5795639A (en) * 1980-12-04 1982-06-14 Sanyo Electric Co Ltd Forming method for preforming
JP3580731B2 (ja) * 1999-06-11 2004-10-27 和美 松重 鉛フリー半田の半田付け方法、及び当該半田付け方法にて半田付けされた接合体
DE19953670A1 (de) * 1999-11-08 2001-05-23 Euromat Gmbh Lotlegierung
DE102010016814B3 (de) * 2010-05-05 2011-10-06 Schott Solar Ag Verfahren und Vorrichtung zum Aufbringen von Lot auf ein Werkstück
CH705035B1 (de) 2011-05-23 2016-03-31 Esec Ag Verfahren zum Auftragen von Lot auf ein Substrat und Verfahren für die Montage eines Halbleiterchips.
CH704991A1 (de) * 2011-05-23 2012-11-30 Esec Ag Verfahren zum Auftragen von Lot auf ein Substrat und Verfahren für die Montage von Halbleiterchips.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01156220A (ja) * 1987-12-12 1989-06-19 Masashi Mori 果実等の供給ホッパー

Also Published As

Publication number Publication date
JPS55136562A (en) 1980-10-24

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