JPS6232021B2 - - Google Patents

Info

Publication number
JPS6232021B2
JPS6232021B2 JP54042063A JP4206379A JPS6232021B2 JP S6232021 B2 JPS6232021 B2 JP S6232021B2 JP 54042063 A JP54042063 A JP 54042063A JP 4206379 A JP4206379 A JP 4206379A JP S6232021 B2 JPS6232021 B2 JP S6232021B2
Authority
JP
Japan
Prior art keywords
solder
ultrasonic horn
ultrasonic
horn
molten solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54042063A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55136562A (en
Inventor
Tadao Kushima
Tomiro Yasuda
Tasao Soga
Hiroshi Kato
Taku Sugawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4206379A priority Critical patent/JPS55136562A/ja
Publication of JPS55136562A publication Critical patent/JPS55136562A/ja
Publication of JPS6232021B2 publication Critical patent/JPS6232021B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/751—Means for controlling the bonding environment, e.g. valves, vacuum pumps
    • H01L2224/75101—Chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83053—Bonding environment
    • H01L2224/83054—Composition of the atmosphere
    • H01L2224/83075—Composition of the atmosphere being inert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP4206379A 1979-04-09 1979-04-09 Ultrasonic pre-soldering method and apparatus thereof Granted JPS55136562A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4206379A JPS55136562A (en) 1979-04-09 1979-04-09 Ultrasonic pre-soldering method and apparatus thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4206379A JPS55136562A (en) 1979-04-09 1979-04-09 Ultrasonic pre-soldering method and apparatus thereof

Publications (2)

Publication Number Publication Date
JPS55136562A JPS55136562A (en) 1980-10-24
JPS6232021B2 true JPS6232021B2 (en, 2012) 1987-07-11

Family

ID=12625634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4206379A Granted JPS55136562A (en) 1979-04-09 1979-04-09 Ultrasonic pre-soldering method and apparatus thereof

Country Status (1)

Country Link
JP (1) JPS55136562A (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01156220A (ja) * 1987-12-12 1989-06-19 Masashi Mori 果実等の供給ホッパー

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5795639A (en) * 1980-12-04 1982-06-14 Sanyo Electric Co Ltd Forming method for preforming
JP3580731B2 (ja) * 1999-06-11 2004-10-27 和美 松重 鉛フリー半田の半田付け方法、及び当該半田付け方法にて半田付けされた接合体
DE19953670A1 (de) * 1999-11-08 2001-05-23 Euromat Gmbh Lotlegierung
DE102010016814B3 (de) * 2010-05-05 2011-10-06 Schott Solar Ag Verfahren und Vorrichtung zum Aufbringen von Lot auf ein Werkstück
CH705035B1 (de) 2011-05-23 2016-03-31 Esec Ag Verfahren zum Auftragen von Lot auf ein Substrat und Verfahren für die Montage eines Halbleiterchips.
CH704991A1 (de) * 2011-05-23 2012-11-30 Esec Ag Verfahren zum Auftragen von Lot auf ein Substrat und Verfahren für die Montage von Halbleiterchips.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01156220A (ja) * 1987-12-12 1989-06-19 Masashi Mori 果実等の供給ホッパー

Also Published As

Publication number Publication date
JPS55136562A (en) 1980-10-24

Similar Documents

Publication Publication Date Title
US5298715A (en) Lasersonic soldering of fine insulated wires to heat-sensitive substrates
JPS6232021B2 (en, 2012)
JP3998484B2 (ja) 電子部品の接続方法
JPH088284A (ja) ワイヤボンディング構造及びその補強方法
JP3344289B2 (ja) バンプ付ワークの実装方法
JP2828069B2 (ja) バンプ付きワークの半田付け方法
JP2586811B2 (ja) はんだバンプ形成方法
JP2947220B2 (ja) フリップチップ接続方法及びフリップチップ搭載装置
JPS6059070B2 (ja) 超音波予備はんだ付方法
JP3269399B2 (ja) バンプ付きワークの実装方法
JP2812094B2 (ja) 半田ｔａｂの構造ならびに半田ｔａｂのｉｌｂ装置およびｉｌｂ方法
JPS6347142B2 (en, 2012)
JPS592934Y2 (ja) 超音波予備半田付け装置
JP2009212431A (ja) リフロー装置及び半導体装置の製造方法
JPS6363588A (ja) リ−ドフレ−ム取付方法
JP2009182012A (ja) 半導体装置の製造方法および半導体装置の製造装置
JPH07283221A (ja) バンプの形成方法
JP3269398B2 (ja) バンプ付きワークの半田付け方法
JPH0216011B2 (en, 2012)
JPH1174299A (ja) バンプ形成装置およびバンプ形成方法
JP2737341B2 (ja) 迎えはんだ付け方法
JP3039116B2 (ja) ワイヤボンディング装置およびワイヤボンディング方法
WO2025062759A1 (ja) 予備はんだ形成方法及び予備はんだ形成装置
JPS635234Y2 (en, 2012)
JPS6297341A (ja) ボンディング装置及びボンディング方法