JPS6231822B2 - - Google Patents
Info
- Publication number
- JPS6231822B2 JPS6231822B2 JP56090556A JP9055681A JPS6231822B2 JP S6231822 B2 JPS6231822 B2 JP S6231822B2 JP 56090556 A JP56090556 A JP 56090556A JP 9055681 A JP9055681 A JP 9055681A JP S6231822 B2 JPS6231822 B2 JP S6231822B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- range
- rotary table
- wire
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56090556A JPS57206040A (en) | 1981-06-12 | 1981-06-12 | Wire bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56090556A JPS57206040A (en) | 1981-06-12 | 1981-06-12 | Wire bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57206040A JPS57206040A (en) | 1982-12-17 |
| JPS6231822B2 true JPS6231822B2 (enrdf_load_stackoverflow) | 1987-07-10 |
Family
ID=14001677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56090556A Granted JPS57206040A (en) | 1981-06-12 | 1981-06-12 | Wire bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57206040A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63198139U (enrdf_load_stackoverflow) * | 1987-06-10 | 1988-12-20 | ||
| JPH0334223A (ja) * | 1989-06-26 | 1991-02-14 | Internatl Business Mach Corp <Ibm> | キーボタン |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5283169A (en) * | 1975-12-31 | 1977-07-11 | Shinkawa Seisakusho Kk | Apparatus for supersonic wire bonding |
-
1981
- 1981-06-12 JP JP56090556A patent/JPS57206040A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63198139U (enrdf_load_stackoverflow) * | 1987-06-10 | 1988-12-20 | ||
| JPH0334223A (ja) * | 1989-06-26 | 1991-02-14 | Internatl Business Mach Corp <Ibm> | キーボタン |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57206040A (en) | 1982-12-17 |
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