JPS6231822B2 - - Google Patents
Info
- Publication number
- JPS6231822B2 JPS6231822B2 JP56090556A JP9055681A JPS6231822B2 JP S6231822 B2 JPS6231822 B2 JP S6231822B2 JP 56090556 A JP56090556 A JP 56090556A JP 9055681 A JP9055681 A JP 9055681A JP S6231822 B2 JPS6231822 B2 JP S6231822B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- range
- rotary table
- wire
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56090556A JPS57206040A (en) | 1981-06-12 | 1981-06-12 | Wire bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56090556A JPS57206040A (en) | 1981-06-12 | 1981-06-12 | Wire bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57206040A JPS57206040A (en) | 1982-12-17 |
| JPS6231822B2 true JPS6231822B2 (enrdf_load_stackoverflow) | 1987-07-10 |
Family
ID=14001677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56090556A Granted JPS57206040A (en) | 1981-06-12 | 1981-06-12 | Wire bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57206040A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63198139U (enrdf_load_stackoverflow) * | 1987-06-10 | 1988-12-20 | ||
| JPH0334223A (ja) * | 1989-06-26 | 1991-02-14 | Internatl Business Mach Corp <Ibm> | キーボタン |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5283169A (en) * | 1975-12-31 | 1977-07-11 | Shinkawa Seisakusho Kk | Apparatus for supersonic wire bonding |
-
1981
- 1981-06-12 JP JP56090556A patent/JPS57206040A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63198139U (enrdf_load_stackoverflow) * | 1987-06-10 | 1988-12-20 | ||
| JPH0334223A (ja) * | 1989-06-26 | 1991-02-14 | Internatl Business Mach Corp <Ibm> | キーボタン |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57206040A (en) | 1982-12-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0247119B2 (enrdf_load_stackoverflow) | ||
| JP2550130B2 (ja) | 半導体ウエハーを移送する装置 | |
| US3941294A (en) | Wire bonding apparatus with improved Z-axis motion control | |
| JPS6255916B2 (enrdf_load_stackoverflow) | ||
| JPS60259328A (ja) | 放電加工切断装置 | |
| JPS6231822B2 (enrdf_load_stackoverflow) | ||
| JP3247495B2 (ja) | 基板処理装置、基板移載機の位置設定方法、及びボートの状態検出方法 | |
| JP3233011B2 (ja) | 基板の位置決め装置 | |
| JPH0344434B2 (enrdf_load_stackoverflow) | ||
| GB2047596A (en) | Method of wire-bonding and wire-bonder | |
| JP3395592B2 (ja) | 電子部品実装装置 | |
| JPH0247118B2 (enrdf_load_stackoverflow) | ||
| JPH0452617B2 (enrdf_load_stackoverflow) | ||
| JP3417603B2 (ja) | 実装機の部品検査装置 | |
| CN222940351U (zh) | 一种排针旋转取针装置 | |
| JP2676446B2 (ja) | ワイヤボンディング方法 | |
| JPH05243292A (ja) | Ｌｏｃ用ダイボンダ | |
| KR200349721Y1 (ko) | 평판표시소자용 본딩시스템 | |
| JPH0629342A (ja) | 同じ平面上にないボンド面に対するボンディング機構 | |
| JPS6074447A (ja) | ワイヤボンデイング装置 | |
| JPH0519980B2 (enrdf_load_stackoverflow) | ||
| JPH11307554A (ja) | Ｌｅｄチップのダイボンド方法およびダイボンド装置 | |
| JPS58111330A (ja) | ワイヤボンディング装置及びそれを用いたワイヤボンディング方法 | |
| JPH0774969B2 (ja) | 電子部品の装着装置 | |
| JPS6193638A (ja) | ワイヤホンダ |