JPS6231822B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wire bonding method in which a substrate having a wide bonding range is rotatably positioned on a rotary table and a pad of a pellet and a lead post of the substrate are connected with a wire.

Generally, the bonding area of the board is 50 mm or less in both the vertical and horizontal directions. Recently, however, hybrid substrates have come into use that have a bonding area that is approximately four times larger than that of conventional substrates. Therefore, in order to perform wire bonding on a substrate having such a wide bonding range, the XY drive device on which the bonding head of the wire bonding apparatus is mounted must be moved considerably.

However, increasing the amount of movement of the XY drive device in the XY directions inevitably increases the size of the bonding device, which has the disadvantage of increasing the floor space on which the device is installed. Also, the bonding equipment is μ
It is required to move in the XY directions with an accuracy of m, and an increase in the size of the XY drive device has the disadvantage that the movement accuracy becomes coarser and the bonding accuracy deteriorates.

The present invention was made in view of the above-mentioned drawbacks of the prior art, and an object of the present invention is to provide a wire bonding method capable of bonding a substrate with a wide bonding range with high precision without increasing the size of the wire bonding device. .

Hereinafter, the present invention will be explained with reference to illustrated embodiments.
First, prior to the method of the present invention, the structure of the apparatus will be explained. FIG. 1 is a plan view of the entire wire bonding apparatus used in the method of the present invention. 1 is a board with a wide bonding range; 2 is a loader magazine in which the board 1 is stored; 3 is an unloader magazine in which the board 1 has been wire bonded;
4 is a rotary table that positions and rotates the substrate 1, 5 is a wire bonding device, and an XY drive device 6 that moves in the XY direction;
The bonding head 9 is provided with a bonding head 9 that moves up and down a bonding arm 8 that is mounted on a capillary and holds a capillary 7 through which a wire (not shown) is inserted.

Therefore, when the substrate 1 is sent from the loader magazine 2 to the rotary table section 4 and positioned, the XY drive device 6 moves in the XY direction to perform wire bonding. After wire bonding is completed, the substrate 1 is transferred and stored in the unloader magazine 3.

FIG. 2 is an enlarged partially sectional front view of the rotary table section including the rotary table 4. As shown in FIG. 11 is a heater that heats the substrate 1 to a temperature that allows bonding;
It is embedded in the rotary table 4. 12 is a rotating shaft fixed to the lower surface of the rotary table 4; 13 is a frame that supports the rotating shaft 12 on its own axis through a bearing 14, and is fixed to a base 15.
16 is a bevel gear fixed to the lower end of the rotating shaft 12;
7 is a bevel gear that meshes with the bevel gear 16, and the motor 18
is fixed to the output shaft 18a of. 19 is a mounting angle for the motor 18; 20 is an angle that rotatably supports the output shaft 18a of the motor 18 via a bearing 21; these angles 19 and 20 are fixed to the base 15; 22 is an indexing position detection cam for dividing and indexing the rotary table 4;
Reference numeral 3 denotes an origin position detection cam for returning the rotary table 10 to its origin, and these cams 22 and 23 are fixed to the output shaft 18a of the motor 18. 2
4 and 25 are sensors provided corresponding to the cams 22 and 23.

Therefore, when the motor 18 is driven, the bevel gear 17,
Rotary table 10 rotates via 16.

Next, the method of the present invention will be explained. FIG. 3 is an enlarged plan view showing an example of the substrate 1. In the case of this example, the bonding area was divided into four, as it has an area of 2a x 2a, which is about four times the bonding area a x a of a normal substrate. Bonding range 1A, 1B,
Set 1C and 1D. Further, when the substrate 1 is sent from the loader magazine 2 to the rotary table 4 and positioned, the bonding range 1A is positioned at the bonding position of the bonding device 5.
Then, the substrate 1, which has been transferred and positioned to the bonding position, is moved to the bonding area 1A by the XY driving device 6, which drives the bonding head 9 in the XY direction, and by the capillary 7 in a well-known manner.
will be bonded to. When the bonding of the bonding range 1A is completed, the motor 18 is driven by the completion signal and the rotary table 4 is rotated 90 degrees. Thereby, the bonding range 1B is positioned at the bonding position. Then, in the same manner as described above, the bonding head 9 is driven in the XY directions by the XY driving device 6, and bonding is performed in the bonding range 1B by the capillary 7.
Similarly, the rotary table 4 is rotated 90 degrees, and the bonding device 5 performs bonding in the bonding range 1C, and then the rotary table 4 is rotated 90 degrees, and the bonding device 5 performs bonding in the bonding range 1D. When bonding in all bonding ranges 1A to 1D is completed in this manner, the substrate 1 is sent to the unloader side and stored in the unloader magazine 3. At the same time, the next substrates 1 are fed one by one from the loader side to the bonding position on the rotary table 4, where they are positioned and wire bonded.

In the above embodiment, the bonding range of the substrate is divided into four, but the bonding range is not limited to this, and may be divided into three or five or more, for example.

As is clear from the above description, according to the bonding method of the present invention, a plurality of divided bonding ranges are set for a substrate having a wide bonding range, and the divided bonding ranges are divided by rotating a rotary table. Since bonding is performed sequentially at the bonding position, the
The amount of movement in the XY directions is small, the bonding device does not need to be large, and bonding can be performed with high precision.

[Brief explanation of the drawing]

FIG. 1 is a plan view of the entire wire bonding apparatus used in the method of the present invention, FIG. 2 is an enlarged partial cross-sectional front view of the rotary table portion of FIG. 1, and FIG. 3 is an enlarged plan explanatory view showing an example of a substrate. It is. 1... Substrate, 1A to 1D... Divided bonding range, 4... Rotary table, 5... Bonding device.

Claims (1)

[Claims] 1. In a wire bonding method in which a pad of a pellet and a lead post of a board are connected with a wire, a board with a wide bonding range is placed on a rotary table, and a bonding range is set by dividing the bonding range of the board into a plurality of equal parts. After completing wire bonding for one bonding range that has been set to be divided, the rotary table is rotated by an equal division angle that is 360 degrees divided by the number of divisions, and wire bonding for the next bonding range that has been set for division is completed. A wire bonding method characterized by sequentially wire bonding a bonding range divided into a plurality of parts by repeating the same operation.