JPH0123942B2 - - Google Patents
Info
- Publication number
- JPH0123942B2 JPH0123942B2 JP57025646A JP2564682A JPH0123942B2 JP H0123942 B2 JPH0123942 B2 JP H0123942B2 JP 57025646 A JP57025646 A JP 57025646A JP 2564682 A JP2564682 A JP 2564682A JP H0123942 B2 JPH0123942 B2 JP H0123942B2
- Authority
- JP
- Japan
- Prior art keywords
- film carrier
- axis
- bonding
- axis direction
- movement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
Description
【発明の詳細な説明】
本発明は、フイルムキヤリアボンダーにおける
ペレツトなどの位置合せ装置に関するもので、構
造の簡易化をはかり、工程の全自動化が容易に実
施できるように制御系を合理化しようとするもの
である。[Detailed Description of the Invention] The present invention relates to a device for aligning pellets, etc. in a film carrier bonder, and aims to simplify the structure and rationalize the control system so that full automation of the process can be easily implemented. It is something.
従来の位置合せは、第１図に示すように、ボン
デイングツール１とフイルムキヤリア２及びペレ
ツト３を載置したボンデイングステージ４などの
関係位置を、正規の位置に合わせる際に、
(A) ボンデイングステージ４に対しては、回転
（角度θ）……、Ｘ軸方向の移動……、Ｙ
軸方向の移動……、Ｚ軸方向の移動……、
(B) フイルムキヤリア２に対しては、Ｘ軸方向の
移動……、Ｙ軸方向の移動……、
(C) ボンデイングツール１に対しては、Ｘ軸又は
Ｙ軸のいづれか１方向の移動……、Ｚ軸方向
の移動……、
などが必要であり、全部で駆動軸は８軸である。
そして位置出し作業は、カメラ（図示せず）で観
察しながら、ボンデイングツール１を基準にし
て、フイルムキヤリア２とペレツト３を動かし
（移動機構は図示せず）正規の位置を決めている。
この場合、それぞれの駆動軸の構成は前記の通り
であり、フイルムキヤリア２を平面方向に移動し
ていた為に、構造が大きくなりかつ複雑である。
またボンデイングステージ４を上下方向に移動す
るので、構造が大きくなると共に複雑になる。と
くにボンデイングツール１を基準にとつているか
ら、工程の全自動化が困難である。 As shown in Fig. 1, conventional alignment involves aligning the relative positions of the bonding tool 1, the film carrier 2, the bonding stage 4 on which the pellet 3 is placed, etc., to the regular positions. For 4, rotation (angle θ)..., movement in the X-axis direction..., Y
Movement in the axial direction..., movement in the Z-axis direction..., (B) Movement in the X-axis direction..., movement in the Y-axis direction... for film carrier 2, (C) Movement in the bonding tool 1 In this case, movement in either the X-axis or Y-axis direction, movement in the Z-axis direction, etc. are required, and there are eight drive axes in total.
In the positioning operation, the film carrier 2 and the pellet 3 are moved (the moving mechanism is not shown) to determine their proper position with respect to the bonding tool 1 while observing with a camera (not shown).
In this case, the configuration of each drive shaft is as described above, and since the film carrier 2 is moved in the plane direction, the structure becomes large and complicated.
Furthermore, since the bonding stage 4 is moved in the vertical direction, the structure becomes larger and more complicated. In particular, since the bonding tool 1 is used as the standard, it is difficult to fully automate the process.
本発明は従来のこれらの欠点を除き、できるだ
け駆動機構を簡略化し、構造の小型化を計ると共
に、工程の全自動化を容易に達成できるように、
なさんとするものである。 The present invention eliminates these conventional drawbacks, simplifies the drive mechanism as much as possible, miniaturizes the structure, and easily achieves full automation of the process.
It is something to do with someone.
本発明の特徴は、ボンデイングツールをＸ軸と
Ｙ軸方向およびＺ軸方向に移動せしめる手段と、
フイルムキヤリアをＺ軸方向に移動せしめる手段
と、ボンデイングステージをＸ軸とＹ軸方向に移
動せしめる手段および回転せしめる手段を具備
し、前記フイルムキヤリアを基準として、位置出
しを行うように構成されたフイルムキヤリアボン
デイング装置にある。 Features of the present invention include means for moving the bonding tool in the X-axis, Y-axis directions, and Z-axis direction;
A film comprising means for moving the film carrier in the Z-axis direction, and means for moving and rotating a bonding stage in the X-axis and Y-axis directions, and configured to perform positioning with respect to the film carrier. Located in carrier bonding equipment.
以下、本発明の一実施例を図面と共に説明す
る。第２図は本発明実施例のフイルムキヤリアボ
ンデイング装置の位置合せを説明するための部分
図である。すなわち、本実施例における位置合せ
は第２図に示す通りの組合せで行い、従来と大き
く異なる点は、フイルムキヤリア２を基準とし、
フイルムキヤリア２を上下方向にだけ動かすよう
にしたことである。したがつて、従来の駆動系と
較べてみると、ボンデイングステージ４において
は、上下方向の移動が無くなり、フイルムキヤリ
ア２においてはXY軸方向の移動に代つて上下方
向に動き、またボンデイングツール１において
は、Ｘ軸又はＹ軸の動きが追加され、全体の駆動
軸は７軸となり、従来の８軸から１軸少くなつて
いる。 An embodiment of the present invention will be described below with reference to the drawings. FIG. 2 is a partial view for explaining the alignment of the film carrier bonding apparatus according to the embodiment of the present invention. That is, the alignment in this embodiment is performed using the combinations shown in FIG.
The film carrier 2 is moved only in the vertical direction. Therefore, when compared with a conventional drive system, the bonding stage 4 no longer moves vertically, the film carrier 2 moves vertically instead of moving in the XY axis directions, and the bonding tool 1 moves vertically instead of moving in the The X-axis or Y-axis movement is added, and the total number of drive axes is seven, which is one axis less than the conventional eight axes.
駆動系の１軸減少、とくにフイルムキヤリア２
の水平方向移動を無くしたことは、駆動系の簡略
化に寄与し、構造が小型されるので極めて効果的
であり、全体的に見ると位置の検出が容易とな
り、更にはボンデイングツール１を基準として位
置出しを行つていた場合と異なり、全工程の自動
化が容易となるなど好都合である。 One axis reduction in drive system, especially film carrier 2
Eliminating the horizontal movement of the bonding tool contributes to the simplification of the drive system, making the structure more compact, which is extremely effective.Overall, it becomes easier to detect the position, and furthermore, it is easier to detect the position than the bonding tool 1. Unlike the case where positioning was performed as a manual, the entire process can be easily automated, which is advantageous.
第１図は従来のボンデイング装置の位置出しの
構成、第２図は本発明実施例におけるボンデイン
グ装置の位置出しの構成である。
なお図において、１……ボンデイングツール、
２……フイルムキヤリア、３……ペレツト、４…
…ボンデイングステージ、である。
FIG. 1 shows a positioning configuration of a conventional bonding apparatus, and FIG. 2 shows a positioning configuration of a bonding apparatus according to an embodiment of the present invention. In the figure, 1... bonding tool,
2...Film carrier, 3...Pellet, 4...
...The bonding stage.
Claims (1)
Ｚ軸方向に移動せしめる手段と、フイルムキヤリ
アをＺ軸方向に移動せしめる手段と、ボンデイン
グステージをＸ軸とＹ軸方向に移動せしめる手段
および回転せしめる手段を具備し、前記フイルム
キヤリアを基準として、位置出しを行うように構
成されたことを特徴とするフイルムキヤリアボン
デイング装置。1. Means for moving the bonding tool in the X-axis, Y-axis direction, and Z-axis direction, means for moving the film carrier in the Z-axis direction, and means for moving the bonding stage in the X-axis, Y-axis direction, and rotating means. A film carrier bonding apparatus comprising: a film carrier bonding apparatus, wherein the film carrier bonding apparatus is configured to perform positioning using the film carrier as a reference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57025646A JPS58142534A (en) | 1982-02-19 | 1982-02-19 | Film carrier bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57025646A JPS58142534A (en) | 1982-02-19 | 1982-02-19 | Film carrier bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58142534A JPS58142534A (en) | 1983-08-24 |
| JPH0123942B2 true JPH0123942B2 (en) | 1989-05-09 |
Family
ID=12171587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57025646A Granted JPS58142534A (en) | 1982-02-19 | 1982-02-19 | Film carrier bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58142534A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0510364Y2 (en) * | 1987-05-11 | 1993-03-15 | ||
| US5113565A (en) * | 1990-07-06 | 1992-05-19 | International Business Machines Corp. | Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS521067B2 (en) * | 1971-09-29 | 1977-01-12 | ||
| JPS56162846A (en) * | 1980-05-20 | 1981-12-15 | Citizen Watch Co Ltd | Ic gang bonding device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS521067U (en) * | 1976-06-18 | 1977-01-06 |
-
1982
- 1982-02-19 JP JP57025646A patent/JPS58142534A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS521067B2 (en) * | 1971-09-29 | 1977-01-12 | ||
| JPS56162846A (en) * | 1980-05-20 | 1981-12-15 | Citizen Watch Co Ltd | Ic gang bonding device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58142534A (en) | 1983-08-24 |
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