JPH0121560Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an improvement of a bonding apparatus for bonding semiconductor (LSI) chips one by one onto a substrate placed on a bonding stage.

When mounting a semiconductor chip on a part of the board,
As shown in FIG. 1, a semiconductor chip 3 is connected to the terminal portion 2 of a substrate 1 via solder bumps 4, and a light-shielding resin 6 is injected between the chip and the substrate, and a bonding resin 5 is applied to the entire chip. It is coated with

Here, the terminal portions 2 on the substrate and the semiconductor chips 3 are connected one by one using a bonding device, but in conventional bonding devices, the bonding stage on which the substrate is placed is fixed, so for example, the bonding stage on which the substrate is placed is fixed. As shown in Figure 2, multiple semiconductor chips 3 are mounted on one board at different mounting pitches.
When bonding is performed at P ₁ to _{P 3} , it is necessary to manually move and position the board to match the mounting pitch each time bonding is performed. For this reason, there was a drawback that workability was poor and quality also deteriorated.

In view of these conventional drawbacks, the present invention is based on the technical concept of bonding semiconductor chips on the intersections of grids with a constant pitch on the substrate, and is an extremely inexpensive bonding device that significantly simplifies substrate positioning. The purpose is to provide.

The present invention will be described in detail below based on examples.

FIG. 3 is a block diagram of the bonding apparatus according to the present invention, and FIG. 4 is a perspective view of the main parts thereof. In the figure,
The bonding stage on which the substrate 1 is placed is constructed by stacking two L-shaped plates 4 and 5 on which stepping motors 2 and 3 are mounted, and another movable plate 6. That is, two sliding rods 7, 7 are erected inside the bent portion of the L-shaped plate 4,
This is slidably fitted into the side wall of another L-shaped plate 5. Further, a screw rod 8 is screwed into the same side wall, and one end of the screw rod 8 is directly connected to the rotating shaft of the stepping motor 2.

Similarly, sliding rods 7, 7 and a threaded rod 8 directly connected to the rotating shaft of the stepping motor 3 are arranged inside the bent portion of the L-shaped plate 5, and these are movable as shown in the figure. They are fitted and screwed into the side walls of the plate 6, respectively.

Reference numeral 9 indicates a bonding head, which is connected to a control unit 11 via an arm 10, rotates 90 degrees in the direction of the arrow in the figure around the control unit 11, and is rotated so as to reach the semiconductor chip supply device 12. It is provided. Further, a vacuum chuck portion is formed on the lower surface of this bonding head 9, and is connected to a vacuum pump of a control portion 11 via a vacuum hose 13 (see FIG. 4). Furthermore, the head 9
The head is equipped with a built-in heater, and the head is heated to about 300° C. by power supply from the control section 11.

The stepping motors 2 and 3 are controlled to rotate a certain number of times and stop each time an X and Y direction movement key on a keyboard (not shown) is pressed. It is configured to move one pitch at a time.

According to this configuration, the bonding head 9 is first moved to the chip supply device 12 to adsorb the chip, and then the head is returned to the substrate. Then, by appropriately pressing the XY movement keys on the keyboard, determine the mounting position of the chip on the board, lower the head to bring the chip into contact with the board, and supply power to the heater. Or as shown in Figure 5,
Bonding is performed at appropriate locations on the intersections of a lattice with a constant pitch P on the substrate.

By determining the bonding position of the chip on the intersection of the grid of constant pitch in this way, the direction and distance of movement of the substrate can be made uniform, which greatly simplifies the structure of the bonding stage and the control of the stepping motor. There are some advantages.

In addition, in the above embodiment, the bonding stage was configured to move in the XY direction by a fixed pitch by operating the XY direction movement key on the keyboard.
The stage may be automatically set by inputting the number of times the XY direction movement key is operated. In addition, the bonding stage can be
The stage may be configured to mechanically move by a fixed pitch in the X and Y directions, and the stage may be moved directly by hand in the X and Y directions.

As described above, since the bonding apparatus of the present invention is equipped with a means for appropriately moving the bonding stage at a constant pitch in the XY directions, the moving direction and distance of the stage are uniform, the bonding positioning work is simplified, and the quality is improved. can be measured. Furthermore, since the structure, control, etc. are simple, it can be provided at low cost.

[Brief explanation of the drawing]

FIG. 1 is a diagram illustrating the bonding state of a chip on a substrate, and FIG. 2 is a diagram illustrating the state of bonding a chip using a conventional bonding device.
FIG. 3 is a block diagram of the bonding apparatus according to the present invention, FIG. 4 is a perspective view of the main parts thereof, and FIG. 5 is a diagram showing the positional relationship of chip bonding by the same apparatus. 1 is a board, 2 and 3 are stepping motors, 4,
5 is an L-shaped plate, 6 is a movable plate, 7 is a sliding rod, 8 is a screw rod, 9 is a bonding head, 10 is an arm, 1
1 is a control unit, and 13 is a vacuum hose.

Claims (1)

[Scope of utility model registration request] 1. A bonding apparatus for bonding semiconductor chips one by one onto a substrate placed on a bonding stage, comprising means for appropriately moving the bonding stage at a constant pitch in the X and Y directions.