JPS6231822B2 - - Google Patents

Info

Publication number
JPS6231822B2
JPS6231822B2 JP56090556A JP9055681A JPS6231822B2 JP S6231822 B2 JPS6231822 B2 JP S6231822B2 JP 56090556 A JP56090556 A JP 56090556A JP 9055681 A JP9055681 A JP 9055681A JP S6231822 B2 JPS6231822 B2 JP S6231822B2
Authority
JP
Japan
Prior art keywords
bonding
range
rotary table
wire
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56090556A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57206040A (en
Inventor
Koichi Uehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56090556A priority Critical patent/JPS57206040A/ja
Publication of JPS57206040A publication Critical patent/JPS57206040A/ja
Publication of JPS6231822B2 publication Critical patent/JPS6231822B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56090556A 1981-06-12 1981-06-12 Wire bonding method Granted JPS57206040A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56090556A JPS57206040A (en) 1981-06-12 1981-06-12 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56090556A JPS57206040A (en) 1981-06-12 1981-06-12 Wire bonding method

Publications (2)

Publication Number Publication Date
JPS57206040A JPS57206040A (en) 1982-12-17
JPS6231822B2 true JPS6231822B2 (de) 1987-07-10

Family

ID=14001677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56090556A Granted JPS57206040A (en) 1981-06-12 1981-06-12 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS57206040A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63198139U (de) * 1987-06-10 1988-12-20
JPH0334223A (ja) * 1989-06-26 1991-02-14 Internatl Business Mach Corp <Ibm> キーボタン

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5283169A (en) * 1975-12-31 1977-07-11 Shinkawa Seisakusho Kk Apparatus for supersonic wire bonding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5283169A (en) * 1975-12-31 1977-07-11 Shinkawa Seisakusho Kk Apparatus for supersonic wire bonding

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63198139U (de) * 1987-06-10 1988-12-20
JPH0334223A (ja) * 1989-06-26 1991-02-14 Internatl Business Mach Corp <Ibm> キーボタン

Also Published As

Publication number Publication date
JPS57206040A (en) 1982-12-17

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